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Infineon Technologies S29GL01GS10DHI020

Part No.:
S29GL01GS10DHI020
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
64-LBGA
Datasheet:
AetrixS29GL01GS10DHI020.pdf
Description:
IC FLASH 1GBIT PARALLEL 64FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:314

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Product details

Overview

S29GL01GS10DHI020 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 3.0 V core supply, 16-bit data bus, and MIRRORBIT™ Eclipse 65 nm technology. It delivers 90 ns random access time and 15 ns page access time, supports 512-byte buffer programming, internal single-bit ECC, and uniform 128 kB sector erase - deployed in automotive instrument clusters requiring fast XIP boot code execution.

For engineers reviewing the S29GL01GS10DHI020 datasheet, S29GL01GS10DHI020 pinout, S29GL01GS10DHI020 application, or S29GL01GS10DHI020 equivalent, key selection criteria include Versatile I/O voltage range (1.65 V to VCC), AEC-Q100 Grade 2 qualification (–40°C to +105°C), OTP array support, and CFI-compliant interface for firmware update compatibility.

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A25), 32-byte page read architecture, and embedded algorithm controller (EAC) managing program/erase operations without host CPU intervention. It uses hardware-based status monitoring via RY/BY# pin, data polling, and status register reads.

The internal ECC engine corrects single-bit errors on-the-fly during read cycles, while Advanced Sector Protection (ASP) enables independent volatile/non-volatile locking per 128 kB sector. The 1024-byte OTP array includes two lockable regions for secure boot configuration storage.

Key Specifications

ParameterValue and Actual Design Meaning
Density1 Gb (128 MB) - supports full firmware images for mid-tier automotive ECUs
InterfaceParallel ×16 asynchronous - enables direct XIP execution from flash without RAM copy
Access Time90 ns random / 15 ns page - meets real-time boot latency requirements in ADAS domain controllers
Programming Buffer512 bytes - reduces firmware update time by 4× vs. single-word programming
ECCHardware single-bit correction - ensures data integrity over 20-year retention without software overhead
Endurance100,000 program/erase cycles - sufficient for field firmware updates across vehicle lifetime
Temperature RangeAEC-Q100 Grade 2 (–40°C to +105°C) - qualified for under-hood ECU deployment

Pinout & Package

Package: 64-ball LAE Fortified BGA (9 mm × 9 mm, 0.8 mm pitch). Pinout validated per Infineon datasheet 001-98285 Rev. *U, Section 12.2.

Pin/TerminalCircuit RoleDesign Meaning
A0–A25Address Inputs26-bit word address bus; A25 active for 1 Gb density addressing
DQ0–DQ15Data I/O16-bit bidirectional data bus; supports 1.65 V–VCC versatile I/O
CE#Chip EnableActive-low enable for device selection in multi-chip memory systems
OE#Output EnableControls output buffer; required for read cycle timing compliance
WE#Write EnableInitiates write/program command sequences; latches address/data on falling edge
RY/BY#Ready/Busy OutputOpen-drain status indicator; low during embedded program/erase operations
RESET#Hardware ResetAsynchronous reset input; forces device into standby mode and clears internal state
VCCCore Supply3.0 V ±0.3 V supply for core logic and memory array (2.7–3.6 V operating range)
VIOI/O SupplyIndependent 1.65–3.6 V supply for interface buffers - enables mixed-voltage system integration

Key Features

FeatureDesign Value
Page Mode Read32-byte aligned access with 15 ns intra-page latency - accelerates sequential instruction fetch in XIP mode
Buffer ProgrammingUp to 512 bytes per command - cuts firmware patch time by >75% vs. byte-wise writes
Hardware ECCOn-die single-bit error correction - eliminates need for external error-handling firmware layer
Advanced Sector ProtectionVolatile and non-volatile lock per 128 kB sector - enables secure bootloader partitioning
OTP Array1024-byte one-time-programmable region with dual lockable zones - stores cryptographic keys and calibration data

Applications

Automotive Instrument ClusterADAS Domain Controller

Use Scenario: Storage and execution of gauge graphics, CAN message mapping tables, and driver alert logic.

IC Role / Device Role / Timing Role: XIP-capable NOR flash providing deterministic <90 ns instruction fetch latency to MCU.

Use Value: Eliminates boot ROM + RAM copy step; reduces BOM cost and power during startup sequence.

Use Scenario: Storing sensor fusion algorithms, camera calibration parameters, and fail-safe firmware images.

IC Role / Device Role / Timing Role: High-reliability code storage with ECC and sector-level write protection for ASIL-B compliance.

Use Value: Enables safe firmware updates over CAN FD without compromising runtime integrity.

Industrial PLC HMIMedical Imaging Control Board

Use Scenario: Hosting GUI assets, ladder logic binaries, and configuration profiles in panel-mounted HMIs.

IC Role / Device Role / Timing Role: Parallel interface flash supporting 50 MHz bus timing with robust sector erase control.

Use Value: Allows field-upgradable UI without requiring full board rework or external programmer.

Use Scenario: Storing FPGA bitstreams, DICOM protocol stacks, and regulatory-critical boot firmware.

IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified flash used as primary boot device for safety-critical imaging subsystems.

Use Value: Meets IEC 62304 Class C software lifecycle requirements via 20-year data retention and 100k-cycle endurance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S29GL01GS10DHIV10Same die, identical specs, but packaged in 56-pin TSOP instead of 64-ball LAE BGAPreferred for legacy PCB designs with through-hole or wide-pitch footprint constraintsSelect when mechanical compatibility with existing socketed layouts is required
MX29GL128FDTI-90G128 Mb density (1/8 capacity), 90 ns access, no built-in ECC, no OTP arraySuitable for cost-sensitive consumer electronics where firmware size and security are less criticalChoose only if capacity, ECC, and OTP features are not required in the target design

Compared with S29GL01GS10DHI020, the TSOP variant offers identical functionality in legacy packaging, while the Macronix part trades capacity, ECC, and OTP for lower unit cost - making it viable only in non-automotive, non-safety contexts.

Availability

S29GL01GS10DHI020 is available at Aetrix Electronics and suitable for automotive instrument clusters, ADAS domain controllers, and industrial PLC HMIs requiring stable component supply across extended product lifecycles.

Supply support for S29GL01GS10DHI020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions.

The GL-S family targets automotive and industrial applications demanding AEC-Q100 qualification, long-term data retention, and XIP-capable parallel flash for real-time firmware execution.

FAQ

What is the purpose of the Versatile I/O (VIO) supply pin?

The VIO pin powers the device's input/output buffers independently from the core VCC supply, enabling operation across 1.65 V to VCC (up to 3.6 V). This allows seamless interfacing with 1.8 V, 2.5 V, or 3.3 V host processors without level shifters - critical for mixed-voltage automotive ECUs.

Does S29GL01GS10DHI020 support execute-in-place (XIP) operation?

Yes - its fast 90 ns random access time and asynchronous parallel interface allow microcontrollers to execute code directly from flash memory without copying to RAM. This reduces boot time and SRAM usage in resource-constrained automotive applications.

How does the internal ECC function during read operations?

The hardware ECC engine automatically checks each 512-byte sector during read access and corrects single-bit errors in real time. No host intervention or additional timing overhead is required - correction occurs transparently within the standard read cycle timing window.

Can the OTP array be reprogrammed after initial programming?

No - the 1024-byte OTP array is permanently programmable once. Each of its two lockable regions can be individually secured via dedicated commands; after locking, further writes to that region are blocked permanently, ensuring immutable storage of keys or calibration data.

S29GL01GS10DHI020 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
GL-S
Package/Case:
64-LBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
1Gbit
Memory Organization:
64M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
60ns
Access Time:
100 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
64-FBGA (9x9)

S29GL01GS10DHI020 FAQ

1.How can I place an order for S29GL01GS10DHI020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL01GS10DHI020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL01GS10DHI020 reliable?

The price and inventory of S29GL01GS10DHI020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS10DHI020 is usually 5 days.

3.What payment methods are accepted for S29GL01GS10DHI020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS10DHI020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL01GS10DHI020?

S29GL01GS10DHI020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL01GS10DHI020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL01GS10DHI020?

For technical support, including S29GL01GS10DHI020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS10DHI020 requirements.

6.How does Aetrix verify that S29GL01GS10DHI020 is sourced from the original manufacturer or authorized distributors?

All S29GL01GS10DHI020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS10DHI020 meets industry standards.

7.What is the process for return or replacement of S29GL01GS10DHI020?

All S29GL01GS10DHI020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS10DHI020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL01GS10DHI020 part is unused and in its original packaging.

Return procedure for S29GL01GS10DHI020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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