Infineon Technologies S29GL01GS10DHI023
- Part No.:
- S29GL01GS10DHI023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GS10DHI023.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,089
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Product details
Overview
S29GL01GS10DHI023 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 3.0 V core supply, 16-bit data bus, and MIRRORBIT™ Eclipse 65 nm process technology. It delivers 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. Designed for embedded boot code storage in industrial control systems requiring high reliability and fast XIP execution.
For engineers reviewing the S29GL01GS10DHI023 datasheet, S29GL01GS10DHI023 pinout, S29GL01GS10DHI023 application, or S29GL01GS10DHI023 equivalent, key selection criteria include its 128-kbyte uniform sector erase architecture, 512-byte programming buffer, Versatile I/O (1.65 V–VCC), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and TSOP-56/LAA/LAE/VBU package compatibility.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A25), supporting both standard and page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations autonomously, including suspend/resume, status register polling, and RY/BY# signaling.
The internal architecture integrates dedicated erase voltage and program voltage generators, on-die ECC logic, and sector protection control registers. It supports Common Flash Interface (CFI) for host software identification and uses a 32-byte page-aligned read path where low-order address bits (A0–A3) select within-page words after initial 90 ns access.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 1 Gb (128 MB) - supports full boot image storage for complex microcontrollers |
| Random Access Time | 90 ns at VCC = VIO - enables deterministic XIP execution latency |
| Page Access Time | 15 ns - allows rapid sequential reads within 32-byte aligned pages |
| Programming Buffer | 512 bytes - reduces effective programming time vs. single-word writes |
| ECC | On-die single-bit correction - eliminates need for external ECC logic |
| Endurance | 100,000 program/erase cycles - suitable for field-upgradable firmware |
| Data Retention | 20 years - ensures long-term reliability in unpowered storage |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP-I, Type I), 14 mm × 20 mm body, 0.5 mm pitch. Compatible with JEDEC MO-141AC standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A25 | Address Inputs | Word-aligned addressing; A25 active for 1 Gb density |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional bus; supports 1.65 V–VCC versatile I/O |
| CE# | Chip Enable | Active-low device selection; controls power-down entry |
| OE# | Output Enable | Active-low read gating; decouples output drivers during idle |
| WE# | Write Enable | Active-low control for write/program/erase command latching |
| RY/BY# | Ready/Busy Output | Open-drain status indicator; low during embedded operations |
| RESET# | Hardware Reset | Active-low asynchronous reset of internal state machine |
| VCC | Core Supply | 3.0 V ±0.3 V; powers core logic, EAC, and voltage generators |
| VIO | I/O Supply | 1.65 V to VCC; independently configurable for mixed-voltage systems |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous Page Read | 32-byte aligned access with 15 ns intra-page timing - accelerates sequential instruction fetch |
| Embedded Algorithm Controller (EAC) | Autonomous program/erase with suspend/resume - enables real-time task interruption without data loss |
| Advanced Sector Protection (ASP) | Volatile and non-volatile lock per 128-kB sector - prevents accidental firmware overwrite in field deployments |
| Secure Silicon Region (OTP) | 1024-byte one-time-programmable array with two lockable regions - stores cryptographic keys or calibration data |
| Common Flash Interface (CFI) | Standardized parameter table accessible via read commands - enables OS/driver auto-detection without hard-coded offsets |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot loader and real-time OS kernel in programmable logic controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: Non-volatile boot memory with XIP capability and deterministic 90 ns read latency. Use Value: Enables immediate MCU execution post-power-on; 20-year retention avoids recalibration during equipment lifecycle. | Use Scenario: Holding safety-critical boot code and sensor fusion firmware in automotive camera ECUs certified to AEC-Q100 Grade 2. IC Role / Device Role / Timing Role: AEC-Q100 qualified parallel NOR flash providing secure, ECC-protected startup sequence. Use Value: Hardware ECC and sector locking prevent corruption from EMI or voltage transients during vehicle ignition. |
| Medical Imaging System BIOS | Telecom Base Station Configuration |
Use Scenario: Hosting diagnostic firmware and calibration tables in portable ultrasound devices requiring FDA-compliant data integrity. IC Role / Device Role / Timing Role: High-reliability boot memory with 100,000 erase cycles for field updates. Use Value: OTP region securely stores device-specific calibration constants; ASP prevents unauthorized reprogramming. | Use Scenario: Storing FPGA configuration bitstreams and protocol stack parameters in 5G remote radio units exposed to wide temperature swings. IC Role / Device Role / Timing Role: Industrial-grade (–40°C to +105°C) parallel flash with Versatile I/O interfacing to 1.8 V FPGAs. Use Value: Independent VIO rail allows direct connection to low-voltage logic without level shifters. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GS10DHIV10 | Same die, TSOP-56 package, Industrial grade (–40°C to +85°C), no AEC-Q100 certification | Lacks automotive qualification; lower temperature margin | Select when AEC-Q100 compliance is not required and cost optimization is prioritized |
| MX29GL128FPTI-90G | 128 Mb density, 90 ns access, 3.3 V core, no integrated ECC, different CFI layout | Lower density; requires external ECC implementation | Choose only if legacy system compatibility mandates Macronix pinout and command set |
Compared with S29GL01GS10DHI023, the S29GL01GS10DHIV10 offers identical performance at lower qualification cost, while MX29GL128FPTI-90G trades density and ECC integration for established ecosystem support in older designs.
Availability
S29GL01GS10DHI023 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system BIOS requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S29GL01GS10DHI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, industrial, and security solutions, with global R&D and manufacturing infrastructure.
The GL-S family targets high-reliability embedded systems needing fast XIP-capable flash with automotive-grade robustness, combining MIRRORBIT™ density advantages with industrial/automotive qualification rigor.
FAQ
What is the maximum operating temperature range for S29GL01GS10DHI023?
This part is qualified to AEC-Q100 Grade 2, supporting continuous operation from –40°C to +105°C. The extended temperature range is validated per JEDEC JESD22-A108 and includes thermal cycling, high-temperature operating life, and storage tests per automotive requirements.
Does S29GL01GS10DHI023 require external level shifters when interfacing with 1.8 V logic?
No. Its Versatile I/O feature supports VIO from 1.65 V to VCC, enabling direct connection to 1.8 V FPGAs or ASICs without external level translation. VIO must be supplied independently and stabilized before VCC during power-up sequencing.
How does the 512-byte programming buffer improve firmware update efficiency?
The buffer allows up to 512 bytes to be loaded and programmed in a single embedded operation, reducing total programming time by ~70% versus single-word writes. This is especially beneficial for field updates where minimizing flash write duration improves system availability and reduces risk of power-loss corruption.
Can the Secure Silicon Region (OTP) be reprogrammed after initial programming?
No. The 1024-byte OTP array is physically one-time programmable. Once a bit is set to '0', it cannot be changed back to '1'. Two independent lock bits permanently disable further writes to each 512-byte region, ensuring cryptographic keys or calibration data remain immutable after final programming.
S29GL01GS10DHI023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL01GS10DHI023 FAQ
1.How can I place an order for S29GL01GS10DHI023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GS10DHI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GS10DHI023 reliable?
The price and inventory of S29GL01GS10DHI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS10DHI023 is usually 5 days.
3.What payment methods are accepted for S29GL01GS10DHI023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS10DHI023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GS10DHI023?
S29GL01GS10DHI023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GS10DHI023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GS10DHI023?
For technical support, including S29GL01GS10DHI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS10DHI023 requirements.
6.How does Aetrix verify that S29GL01GS10DHI023 is sourced from the original manufacturer or authorized distributors?
All S29GL01GS10DHI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS10DHI023 meets industry standards.
7.What is the process for return or replacement of S29GL01GS10DHI023?
All S29GL01GS10DHI023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS10DHI023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GS10DHI023 part is unused and in its original packaging.
Return procedure for S29GL01GS10DHI023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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