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Infineon Technologies S29GL01GS10FAI023
- Part No.:
- S29GL01GS10FAI023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GS10FAI023.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,147
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Product details
Overview
S29GL01GS10FAI023 from Spansion is a 1 Gbit (128 MB) 3.0 V-only page-mode NOR Flash memory IC fabricated on 65 nm MirrorBit Eclipse process technology, featuring 100 ns random access time, industrial temperature range (–40°C to +85°C), and Fortified Ball-Grid Array (LAA064, 11 mm × 13 mm) package with sector protection and password-enabled security modes. It serves as nonvolatile program/data storage in boot code execution and firmware update subsystems of embedded networking equipment.
For engineers reviewing the S29GL01GS10FAI023 datasheet, S29GL01GS10FAI023 pinout, S29GL01GS10FAI023 application, or S29GL01GS10FAI023 equivalent, key selection considerations include VIO/VCC voltage flexibility (2.7–3.6 V), DYB power-up state configuration (unprotected/protected), Read Password Mode support, and industrial-grade reliability for long-life embedded deployments.
Technical Context
This device implements a synchronous/asynchronous hybrid interface with standard Intel-compatible command set, supporting CFI-compliant identification and sector erase granularity down to 128 KB. Its architecture enables execute-in-place (XIP) operation without external buffering, reducing system memory footprint.
The MirrorBit Eclipse cell structure delivers dual-bit-per-cell density while maintaining single-bit-per-cell read/write timing behavior and full compatibility with legacy S29GL-S software drivers and hardware controllers used in telecom baseband and industrial HMI platforms.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 Gbit (128 MB) organized as 134,217,728 × 8 bits - supports full firmware image storage for mid-tier routers and PLCs. |
| Access Time | 100 ns - enables direct XIP execution from flash at CPU clock rates up to 25 MHz without wait states. |
| Supply Voltage | VCC = VIO = 2.7–3.6 V - simplifies power design by eliminating separate I/O rail regulators in cost-sensitive edge devices. |
| Temperature Range | Industrial: –40°C to +85°C - validated for continuous operation in uncontrolled cabinet environments like factory-floor gateways. |
| Package | LAA064 Fortified BGA (11 mm × 13 mm) - provides mechanical robustness and thermal performance superior to TSOP in vibration-prone applications. |
| Security Mode | Read Password Mode with DYB power-up state configurable as unprotected - allows secure field firmware updates without permanent lockout risk. |
| Erase Granularity | 128 KB uniform sectors - balances update flexibility with wear-leveling efficiency across 100K-cycle endurance rating. |
Pinout & Package
Fortified Ball-Grid Array (LAA064) package with 64 solder balls in 11 mm × 13 mm body, 0.8 mm pitch, RoHS-compliant matte tin finish, designed for high-reliability industrial PCB assembly and thermal cycling resilience.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address Inputs | 24-bit address bus supporting full 128 MB linear addressing; A23 selects upper/lower half for banked access. |
| DQ0–DQ7 | Data Input/Output | 8-bit bidirectional data bus compatible with 8-bit microcontroller interfaces and byte-wide memory controllers. |
| CE# | Chip Enable | Active-low chip select enabling low-power standby mode when deasserted; supports multi-chip address decoding. |
| OE# | Output Enable | Controls output buffer tri-state; required for read operations and bus sharing with other peripherals. |
| WE# | Write Enable | Active-low signal initiating write/erase commands; latches command sequences on rising edge per JEDEC JESD21-C. |
| RY/BY# | Ready/Busy Output | Open-drain status indicator signaling internal operation completion; eliminates need for polling loops in real-time firmware. |
| VCC / VIO | Power Supply | Single 2.7–3.6 V supply for core and I/O - removes level-shifter requirement in mixed-voltage SoC designs. |
| WP# / RESET# | Hardware Protection | Combination pin enabling hardware write protection and cold reset initiation; prevents accidental erase during power transitions. |
Key Features
| Feature | Design Value |
|---|---|
| MirrorBit Eclipse Technology | 65 nm process delivering 1 Gbit density in LAA064 BGA while maintaining 100 ns access and 100K erase/write cycles - extends product lifecycle in field-deployed infrastructure. |
| CFI Compliance | Standard Common Flash Interface v1.3 implementation - ensures plug-and-play compatibility with Linux MTD, U-Boot, and Windows CE flash drivers without vendor-specific middleware. |
| Password-Based Security | Read Password Mode with programmable DYB power-up state (protected/unprotected) - enables secure over-the-air firmware updates without exposing full memory map. |
| Uniform Sector Architecture | 128 KB erasable sectors across entire array - simplifies bootloader partitioning and supports atomic firmware rollback via dual-bank schemes. |
| Industrial Temperature Operation | Guaranteed functionality from –40°C to +85°C with full timing compliance - eliminates derating concerns in outdoor telecom enclosures and railway signaling cabinets. |
Applications
| Telecom Base Station Control | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot loader, FPGA configuration bitstreams, and real-time control firmware in LTE macrocell remote radio units. IC Role / Device Role / Timing Role: Primary nonvolatile code storage executing XIP during cold start; supports hot firmware patching via sector erase. Use Value: 100 ns access enables deterministic boot within 500 ms; industrial temp rating ensures uptime in rooftop-mounted enclosures. | Use Scenario: Holding ladder logic programs and I/O mapping tables in DIN-rail mounted programmable logic controllers deployed in manufacturing lines. IC Role / Device Role / Timing Role: Persistent firmware repository accessed by ARM Cortex-M7 controller during cyclic scan execution. Use Value: Uniform 128 KB sectors allow safe firmware version swapping without runtime interruption; password mode prevents unauthorized logic modification. |
| Medical Imaging Subsystem Boot | Smart Grid RTU Configuration |
Use Scenario: Hosting diagnostic self-test routines and safety-critical boot code in ultrasound machine front-end processing modules. IC Role / Device Role / Timing Role: Secure boot ROM with hardware write protection (WP#) and password-enforced read access for regulatory compliance. Use Value: DYB power-up in protected state prevents accidental corruption during power cycling; CFI compliance accelerates FDA validation testing. | Use Scenario: Storing communication protocol stacks (IEC 61850, DNP3) and calibration constants in outdoor-mounted remote terminal units for substation automation. IC Role / Device Role / Timing Role: Field-updatable configuration store interfaced via SPI-to-parallel bridge in resource-constrained MCU subsystems. Use Value: LAA064 BGA package withstands thermal cycling in desert substations; 100K endurance supports 10+ years of scheduled firmware upgrades. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NOR Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GP10FAI023 | Same density and package but uses older 90 nm MirrorBit process; 100K cycle endurance vs. 100K for Eclipse; slightly higher active current (30 mA vs. 25 mA). | Lacks DYB power-up state configurability and Read Password Mode - limited to basic sector protection schemes. | Select when legacy qualification or lower unit cost outweighs need for advanced security features. |
| MX29GL128FHTI-10G | 128 Mbit (not 1 Gbit); 100 ns access; TSOP48 package; no password mode; supports only VCC-only operation (no VIO option). | Requires board redesign due to different package and pinout; insufficient capacity for full firmware images in modern edge gateways. | Consider only for space-constrained legacy designs where density and security are secondary to footprint. |
Compared with S29GL01GP10FAI023 and MX29GL128FHTI-10G, the S29GL01GS10FAI023 uniquely combines 1 Gbit density, industrial BGA packaging, and field-upgradeable security - making it the sole choice for next-generation embedded systems requiring both scalability and certified firmware integrity.
Availability
S29GL01GS10FAI023 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, medical imaging subsystems, and smart grid RTUs requiring stable component supply across extended product lifecycles.
Supply support for S29GL01GS10FAI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Spansion Inc. was a leading provider of flash memory and microcontrollers, formed from the merger of AMD's and Fujitsu's flash businesses, later acquired by Cypress Semiconductor in 2015 and integrated into Infineon Technologies.
This device belongs to the S29GL-S MirrorBit Flash Family, engineered specifically for high-reliability embedded applications demanding deterministic boot performance, long-term data retention, and field-upgradable security in harsh environmental conditions.
FAQ
What is the maximum operating frequency supported by S29GL01GS10FAI023?
The device does not operate synchronously and has no clock input; its 100 ns random access time corresponds to a maximum effective read bandwidth of approximately 10 MB/s in page mode. It supports asynchronous bus protocols compatible with legacy 8-bit and 16-bit microcontrollers without requiring clock domain synchronization.
Does S29GL01GS10FAI023 support quad SPI or octal DDR interfaces?
No. This is a parallel-interface NOR Flash device with 8-bit DQ bus and standard Intel command set. It lacks serial interface logic, dedicated QSPI pins, or DDR timing circuitry. For serial NOR requirements, consider Spansion's S25FL series instead.
How is sector protection configured on S29GL01GS10FAI023?
Sector protection is implemented via hardware WP# pin assertion and software-controlled lock bits programmed using the CFI-defined command sequence. The "02" model number indicates lowest-address sector protection enabled at power-up, and Read Password Mode must be activated separately using the unlock-bypass method before modifying protection status.
Is S29GL01GS10FAI023 compliant with JEDEC Standard JESD22-A117 for moisture sensitivity?
Yes. As an LAA064 Fortified BGA package, it carries Moisture Sensitivity Level 3 (MSL3) per JESD22-A117, with floor life of 168 hours at ≤30°C/60% RH. Bake conditioning per J-STD-033 is required if exposed beyond that limit prior to reflow soldering.
S29GL01GS10FAI023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL01GS10FAI023 FAQ
1.How can I place an order for S29GL01GS10FAI023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GS10FAI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GS10FAI023 reliable?
The price and inventory of S29GL01GS10FAI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS10FAI023 is usually 5 days.
3.What payment methods are accepted for S29GL01GS10FAI023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS10FAI023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GS10FAI023?
S29GL01GS10FAI023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GS10FAI023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GS10FAI023?
For technical support, including S29GL01GS10FAI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS10FAI023 requirements.
6.How does Aetrix verify that S29GL01GS10FAI023 is sourced from the original manufacturer or authorized distributors?
All S29GL01GS10FAI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS10FAI023 meets industry standards.
7.What is the process for return or replacement of S29GL01GS10FAI023?
All S29GL01GS10FAI023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS10FAI023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GS10FAI023 part is unused and in its original packaging.
Return procedure for S29GL01GS10FAI023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GS10FAI023 Tags
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M24C02-WMN6TP
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M24C02-FMC6TG
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