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Infineon Technologies S29GL01GS10FHI010
- Part No.:
- S29GL01GS10FHI010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GS10FHI010.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:814
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Product details
Overview
S29GL01GS10FHI010 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It operates across industrial temperature range (–40°C to +85°C) and supports sector erase of uniform 128-kbyte sectors in embedded boot code storage applications.
For engineers reviewing the S29GL01GS10FHI010 datasheet, S29GL01GS10FHI010 pinout, S29GL01GS10FHI010 application, or S29GL01GS10FHI010 equivalent, key selection criteria include its 512-byte programming buffer, Versatile I/O (1.65 V to VCC), CFI compliance, ASP sector protection, and OTP array with dual lockable regions.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing and 32-byte page read capability. Its embedded algorithm controller (EAC) manages program/erase operations, suspend/resume commands, and status reporting via status register, data polling, or RY/BY# pin.
The MIRRORBIT™ Eclipse architecture on 65-nm process enables simultaneous storage of two bits per cell. Internal hardware ECC performs real-time single-bit correction during read, while advanced sector protection supports both volatile and non-volatile locking per 128-kbyte sector.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 1 Gb (128 MB) - supports full boot image storage for high-end microcontrollers and SoCs |
| Interface | Parallel ×16 asynchronous - enables XIP execution without external buffering or translation logic |
| Access Time | 90 ns random / 15 ns page - meets real-time boot latency requirements in automotive ECUs and industrial PLCs |
| Programming Buffer | 512 bytes - reduces effective programming time by up to 4× vs. single-word writes |
| ECC | Internal hardware single-bit correction - eliminates need for external ECC logic in safety-critical systems |
| Endurance & Retention | 100,000 cycles / 20 years - qualified for long-life deployments in infrastructure and automotive control units |
| Temperature Grade | Industrial (–40°C to +85°C) - validated for operation in uncontrolled ambient environments without thermal derating |
Pinout & Package
Package: 56-pin TSOP (Type I, standard thickness). Pinout validated per Infineon datasheet 001-98285 Rev. *U, Section 12.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A25 | Address inputs | 26-bit word address bus (A25 valid for 1 Gb density); latched on CE# or OE# assertion |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports 1.65 V to VCC I/O voltage via Versatile I/O feature |
| CE# | Chip enable | Active-low device select; controls power state entry and timing reference for tCE access |
| OE# | Output enable | Active-low read strobe; gates output drivers and defines tOE access window |
| WE# | Write enable | Active-low write strobe; initiates command sequences and internal program/erase cycles |
| RY/BY# | Ready/Busy indicator | Open-drain status pin; low during embedded operations, high when ready for next command |
| WP# | Hardware write protect | Active-low sector protection override; disables program/erase when asserted |
| VCC | Core supply | 3.0 V ±0.3 V supply for logic and memory array; powers internal voltage generators |
| VIO | I/O supply | Independent 1.65 V to VCC supply for interface buffers; enables mixed-voltage system interfacing |
Key Features
| Feature | Design Value |
|---|---|
| 65 nm MIRRORBIT™ Eclipse technology | Enables 1 Gb density in compact TSOP package while maintaining 100k-cycle endurance and 20-year data retention |
| 512-byte programming buffer | Allows burst programming of up to 256 words in one command, reducing firmware update time in field-deployed devices |
| Hardware ECC engine | Corrects single-bit errors on-the-fly during read, eliminating soft-error-induced boot failures without software overhead |
| Advanced Sector Protection (ASP) | Permits independent volatile/non-volatile locking of each 128-kbyte sector, enabling secure bootloader and parameter partitioning |
| 1024-byte OTP array | Provides tamper-resistant storage for calibration data, security keys, or device-specific identifiers with dual lockable regions |
Applications
| Automotive Engine Control Unit (ECU) | Industrial Programmable Logic Controller (PLC) |
|---|---|
Use Scenario: Storing boot firmware and real-time control algorithms in AEC-Q100 grade 3 ECU modules. IC Role / Device Role / Timing Role: Primary non-volatile boot memory with XIP support and deterministic 90 ns read latency. Use Value: Enables cold-start execution within <500 ms; ECC prevents corruption-induced limp-home mode failures. | Use Scenario: Holding configuration data, ladder logic, and firmware updates in DIN-rail mounted PLCs operating at 85°C ambient. IC Role / Device Role / Timing Role: Field-upgradable program storage with sector-level write protection and 100k-cycle endurance. Use Value: Supports over-the-air updates without downtime; ASP allows safe concurrent read/write of operational and backup partitions. |
| Medical Imaging System Boot ROM | Telecom Base Station Firmware Storage |
Use Scenario: Hosting certified boot loader and diagnostic firmware in FDA-regulated MRI subsystem controllers. IC Role / Device Role / Timing Role: Secure, traceable firmware repository with OTP-based cryptographic key storage. Use Value: Dual-lock OTP regions prevent unauthorized key extraction; 20-year retention ensures lifetime compliance without requalification. | Use Scenario: Storing FPGA bitstreams and protocol stacks in carrier-grade 5G baseband units requiring -40°C to +85°C operation. IC Role / Device Role / Timing Role: High-reliability parallel flash for multi-image storage with CFI-compliant auto-detection. Use Value: CFI table enables automatic driver initialization across heterogeneous host platforms; Versatile I/O simplifies interface to 1.8 V FPGA I/O banks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GS10FHIV10 | Same die, automotive AEC-Q100 grade 2 (–40°C to +105°C); identical timing and features | Required for under-hood automotive modules exceeding 85°C ambient | Select when extended temperature operation is mandated by system thermal profile |
| MX29GL128FHTI-90G | 128 Mb density, 90 ns access, no integrated ECC, no OTP array, different command set | Limited to non-safety-critical firmware storage where ECC and secure key storage are not required | Choose only if cost sensitivity outweighs reliability and security requirements |
Compared with S29GL01GS10FHIV10, the subject part trades extended temperature rating for industrial qualification; versus MX29GL128FHTI-90G, it delivers 8× density, hardware ECC, and OTP security at higher pin count and BOM cost.
Availability
S29GL01GS10FHI010 is available at Aetrix Electronics and suitable for automotive ECU design, industrial PLC firmware storage, medical imaging boot ROM, and telecom base station firmware requiring stable component supply across extended product lifecycles.
Supply support for S29GL01GS10FHI010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.
The GL-S family targets high-reliability embedded systems requiring deterministic boot performance, long-term data integrity, and hardware-enforced security - especially in automotive, industrial, and medical applications.
FAQ
What is the maximum operating frequency supported by S29GL01GS10FHI010?
S29GL01GS10FHI010 is an asynchronous parallel flash device with no clock input; its timing is governed by access times (tACC = 90 ns, tPACC = 15 ns) and bus setup/hold requirements. It interfaces directly with microcontroller or FPGA parallel memory controllers without requiring clock synchronization or PLL configuration.
Does this device support execute-in-place (XIP) functionality?
Yes - the S29GL01GS10FHI010 supports true XIP operation due to its fast random access (90 ns), page-mode read capability (15 ns), and deterministic asynchronous timing. Host processors can fetch and execute instructions directly from its memory-mapped address space without copying to RAM.
How is the 1024-byte OTP array structured and accessed?
The OTP array consists of two independently lockable 512-byte regions. Access requires issuing specific unlock and program commands via the standard command set; once locked (volatile or non-volatile), regions become permanently read-only. OTP is electrically isolated from main array and retains data for 20 years.
Can S29GL01GS10FHI010 be used with a 1.8 V I/O interface?
Yes - its Versatile I/O feature supports VIO from 1.65 V to VCC. With VCC = 3.0 V, VIO may be set to 1.8 V, enabling direct connection to 1.8 V FPGA or ASIC I/O banks without level shifters, provided timing margins (tVIOH, tVIOL) are met per datasheet Section 11.4.
S29GL01GS10FHI010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL01GS10FHI010 FAQ
1.How can I place an order for S29GL01GS10FHI010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GS10FHI010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GS10FHI010 reliable?
The price and inventory of S29GL01GS10FHI010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS10FHI010 is usually 5 days.
3.What payment methods are accepted for S29GL01GS10FHI010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS10FHI010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GS10FHI010?
S29GL01GS10FHI010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GS10FHI010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GS10FHI010?
For technical support, including S29GL01GS10FHI010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS10FHI010 requirements.
6.How does Aetrix verify that S29GL01GS10FHI010 is sourced from the original manufacturer or authorized distributors?
All S29GL01GS10FHI010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS10FHI010 meets industry standards.
7.What is the process for return or replacement of S29GL01GS10FHI010?
All S29GL01GS10FHI010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS10FHI010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GS10FHI010 part is unused and in its original packaging.
Return procedure for S29GL01GS10FHI010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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