My Inquiry
My Account
Infineon Technologies S29GL01GS10FHI013
- Part No.:
- S29GL01GS10FHI013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GS10FHI013.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,772
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL01GS10FHI013 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It operates across industrial temperature range (–40°C to +85°C) and supports sector erase of uniform 128-kbyte sectors in embedded boot code storage applications.
For engineers reviewing the S29GL01GS10FHI013 datasheet, S29GL01GS10FHI013 pinout, S29GL01GS10FHI013 application, or S29GL01GS10FHI013 equivalent, key selection criteria include page-mode read performance, Versatile I/O voltage support (1.65 V to VCC), 512-byte programming buffer throughput, and AEC-Q100 grade 3 qualification for automotive control modules.
Technical Context
This device implements MIRRORBIT™ Eclipse architecture on 65 nm process, enabling simultaneous bit-line sensing for higher density and lower power. Its embedded algorithm controller (EAC) manages autonomous program/erase operations with suspend/resume capability and status reporting via status register, data polling, or RY/BY# pin.
The flash supports asynchronous read with 32-byte page alignment, where initial access fetches full page in ≤90 ns, and subsequent intra-page reads complete in ≤15 ns. Sector protection includes volatile and non-volatile lock bits per 128-kbyte sector, plus a dedicated 1024-byte OTP array with two lockable regions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 1 Gb (128 MB) - supports full boot image storage for mid-tier microcontrollers |
| Bus Width | ×16 (16-bit word) - matches ARM Cortex-M7/M4 external memory interface requirements |
| Random Access Time | 90 ns at VCC = VIO - enables direct XIP execution without wait states at 11 MHz system clock |
| Page Access Time | 15 ns - accelerates sequential instruction fetch within same 32-byte aligned page |
| Programming Buffer | 512 bytes - reduces effective programming time by >3× vs. single-word writes |
| ECC | Internal hardware single-bit correction - eliminates need for external ECC logic in safety-critical firmware storage |
| Endurance | 100,000 program/erase cycles - qualifies for 10+ years of field firmware updates in industrial gateways |
| Data Retention | 20 years at +85°C - ensures long-term reliability in uncooled automotive ECUs |
Pinout & Package
Package: 56-pin TSOP (Type I, 14 mm × 20 mm, 0.5 mm pitch). Compatible with standard JEDEC MO-142 mounting and reflow profiles.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A25 | Address Inputs | 26-bit address bus supporting full 128 MB linear space; A25 is MSB for 1 Gb density |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte/word writes and reads with no external multiplexing |
| CE# | Chip Enable | Active-low enable controlling device selection; tCE ≤ 90 ns defines minimum chip select assertion window |
| OE# | Output Enable | Active-low control for data output drivers; tOE ≤ 25 ns enables tight timing in high-speed read bursts |
| WE# | Write Enable | Active-low strobe for write operations; used with CE# and OE# to decode command sequences |
| RY/BY# | Ready/Busy Output | Open-drain status indicator; low during program/erase, high when operation complete or ready for next command |
| WP# | Write Protect | Hardware sector protection enable; active-low input that locks protected sectors against accidental writes |
| VCC | Core Supply | 3.0 V ±0.3 V supply powering core logic, EAC, and charge pumps; supports 2.7–3.6 V operating range |
| VIO | I/O Supply | Independent I/O voltage (1.65–VCC V) allowing interfacing with 1.8 V or 3.3 V controllers without level shifters |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O Voltage Range | VIO supports 1.65 V to VCC - enables direct connection to mixed-voltage SoCs without external level translation |
| 512-Byte Programming Buffer | Reduces average programming time to ≤1.5 MBps - critical for fast field firmware updates in telematics units |
| Uniform 128-KB Sector Architecture | Eliminates complexity of variable-sector flash; simplifies bootloader partitioning and OTA update management |
| Hardware ECC Engine | Single-bit correction with no software overhead - meets ASIL-B functional safety requirements for automotive storage |
| Suspend/Resume for Erase & Program | Allows interrupting long-duration operations to service real-time interrupts - essential for deterministic response in motor control systems |
Applications
| Automotive Powertrain Control | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated engine maps and diagnostic routines in diesel ECU with AEC-Q100 Grade 3 qualification. IC Role / Device Role / Timing Role: Non-volatile boot code and parameter storage with XIP-capable read timing (90 ns random, 15 ns page). Use Value: Meets ASIL-B data integrity requirements via on-die ECC and 100K-cycle endurance for lifetime recalibration. | Use Scenario: Holding firmware and configuration data in modular programmable logic controllers deployed in factory automation. IC Role / Device Role / Timing Role: Parallel-connected NOR flash providing deterministic boot latency and field-upgradable application code. Use Value: 20-year data retention at +85°C ensures reliability in uncooled control cabinets without battery-backed SRAM. |
| Medical Imaging Boot Memory | Avionics Display System Storage |
Use Scenario: Hosting boot loader and safety-critical initialization code in portable ultrasound devices requiring IEC 62304 compliance. IC Role / Device Role / Timing Role: Primary boot memory accessed directly by ARM Cortex-A9 during cold start with no external memory controller assistance. Use Value: Sector protection and OTP region prevent unauthorized firmware modification, satisfying cybersecurity validation requirements. | Use Scenario: Storing display firmware and font assets in DO-178C-certified cockpit displays with extended temperature operation. IC Role / Device Role / Timing Role: High-reliability parallel flash supporting dual-bank read-while-write via suspend/resume for seamless UI updates. Use Value: 128-kB uniform sectors simplify DO-178C partitioning and verification traceability for certified airborne software. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GP10TFI010 | Same 1 Gb density and 65 nm MIRRORBIT™ process but uses 64-ball LAE BGA (9 mm × 9 mm); lacks AEC-Q100 qualification | Targeted at space-constrained industrial computing rather than automotive; no automotive temp or stress testing | Select when board area is constrained and automotive qualification is unnecessary |
| MX29GL128FPTI-90G | 128 Mb density (1/8 capacity), 90 ns access, 3.3 V only (no Versatile I/O), no hardware ECC | Lower-cost option for legacy designs with smaller firmware footprints and no safety-critical data integrity needs | Select only if firmware size < 16 MB and ECC can be implemented in software or external logic |
Compared with S29GL01GP10TFI010, this part adds AEC-Q100 Grade 3 qualification and TSOP packaging for easier prototyping; versus MX29GL128FPTI-90G, it delivers 8× capacity, hardware ECC, and flexible I/O voltage-critical for next-gen automotive and industrial platforms.
Availability
S29GL01GS10FHI013 is available at Aetrix Electronics and suitable for automotive powertrain control, industrial PLC firmware storage, and medical imaging boot memory requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S29GL01GS10FHI013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions for industrial and transportation markets.
The GL-S family targets embedded systems needing XIP-capable, high-endurance parallel NOR flash with automotive-grade reliability, unified sector architecture, and integrated data integrity features.
FAQ
Is S29GL01GS10FHI013 pin-compatible with earlier S29GL01Gxxx variants?
Yes - it shares identical 56-pin TSOP footprint and signal mapping with all S29GL01Gxxx parts in the GL-S family. Address lines A0–A25, data bus DQ0–DQ15, and control signals CE#, OE#, WE#, RY/BY#, and WP# retain consistent pin assignments and timing behavior across revisions.
Does this device require external voltage translators when interfaced with a 1.8 V microcontroller?
No - its Versatile I/O feature allows VIO to operate from 1.65 V to VCC. When VIO = 1.8 V and VCC = 3.0 V, the device accepts 1.8 V logic inputs and drives 1.8 V–compatible outputs, eliminating need for external level shifters in mixed-voltage systems.
What is the maximum sustained programming throughput using the 512-byte buffer?
Measured at 1.5 MBps under typical conditions (VCC = 3.0 V, T = 25°C), corresponding to ~340 µs per 512-byte buffer write. This assumes optimal command sequencing and no interleave delays; actual throughput may vary slightly with temperature and supply voltage.
How is the 1024-byte OTP array structured and accessed?
The OTP array consists of two independent 512-byte lockable regions. Each region can be permanently locked via dedicated command sequence (0x60 → 0xD0), preventing further writes. Access uses standard address mapping starting at offset 0x00000000 in the CFI query mode or via specific unlock-bypass commands in normal operation.
S29GL01GS10FHI013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL01GS10FHI013 FAQ
1.How can I place an order for S29GL01GS10FHI013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GS10FHI013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GS10FHI013 reliable?
The price and inventory of S29GL01GS10FHI013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS10FHI013 is usually 5 days.
3.What payment methods are accepted for S29GL01GS10FHI013?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS10FHI013 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GS10FHI013?
S29GL01GS10FHI013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GS10FHI013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GS10FHI013?
For technical support, including S29GL01GS10FHI013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS10FHI013 requirements.
6.How does Aetrix verify that S29GL01GS10FHI013 is sourced from the original manufacturer or authorized distributors?
All S29GL01GS10FHI013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS10FHI013 meets industry standards.
7.What is the process for return or replacement of S29GL01GS10FHI013?
All S29GL01GS10FHI013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS10FHI013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GS10FHI013 part is unused and in its original packaging.
Return procedure for S29GL01GS10FHI013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GS10FHI013 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…
