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Infineon Technologies S29GL01GS10FHI020

Name: S29GL01GS10FHI020
Brand: Infineon Technologies
SKU: S29GL01GS10FHI020
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL01GS10FHI020

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL01GS10FHI020.pdf

Description:: IC FLASH 1GBIT PARALLEL 64FBGA

Quantity:: RFQ Add To RFQ list

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Product details

Overview

S29GL01GS10FHI020 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It operates across industrial temperature range (–40°C to +85°C) and supports sector erase (128 kB uniform sectors), suspend/resume, and versatile I/O (VIO = 1.65 V to VCC). Used in boot code storage for industrial controllers requiring deterministic XIP execution.

For engineers reviewing the S29GL01GS10FHI020 datasheet, S29GL01GS10FHI020 pinout, S29GL01GS10FHI020 application, or S29GL01GS10FHI020 equivalent, this page delivers verified timing specs, package mapping (56-pin TSOP), OTP array layout, ASP protection modes, and CFI-compliant interface behavior - all critical for legacy embedded system upgrades and automotive ECU firmware storage validation.

Technical Context

This device implements asynchronous parallel NOR architecture with MIRRORBIT™ Eclipse 65 nm process, enabling true XIP capability without external cache. Its embedded algorithm controller (EAC) manages autonomous program/erase operations, status monitoring via RY/BY# pin or status register, and automatic ECC encoding/decoding during read.

The 512-byte write buffer enables burst programming at up to 1.5 MBps, while 128-kB uniform sector erase achieves 477 kBps throughput. Versatile I/O allows independent VIO (1.65–VCC) for mixed-voltage system interfacing, and CFI parameter table provides runtime identification of geometry, timings, and command sets.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory density	1 Gb (128 MB), organized as 8,388,608 × 16-bit words - supports full firmware image storage for ARM Cortex-M7/M4-based controllers.
Random access time	90 ns at VCC = VIO - ensures sub-100 ns instruction fetch latency for real-time boot code execution.
Page access time	15 ns - enables fast sequential reads within 32-byte aligned pages, critical for tight-loop code execution.
Write buffer size	512 bytes - reduces effective programming time by batching up to 256 words per command, improving firmware update efficiency.
ECC capability	Single-bit error correction with internal hardware ECC - eliminates need for external error-handling logic in safety-critical applications.
Endurance & retention	100,000 program/erase cycles and 20-year data retention - meets long-life requirements for industrial gateways and medical devices.
Operating temperature	–40°C to +85°C (Industrial grade) - qualified for deployment in uncontrolled ambient environments without thermal derating.

Pinout & Package

Package: 56-pin Thin Small Outline Package (TSOP), 14 mm × 20 mm, standard JEDEC MO-141AC footprint, lead-free and RoHS compliant.

Pin/Terminal	Circuit Role	Design Meaning
A0–A25	Address inputs	26-bit address bus supporting full 128 MB address space; A25 is MSB for 1 Gb density.
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports word-wide transfers only - no byte-lane control.
CE#	Chip enable	Active-low chip select; controls device power state and enables read/write/erase operations.
OE#	Output enable	Active-low control for output drivers; used during read cycles to gate data onto DQ bus.
WE#	Write enable	Active-low signal initiating write/program/erase commands; latches command sequences on rising edge.
RY/BY#	Ready/Busy indicator	Open-drain output signaling operation progress; low = busy, high = ready or error condition.
RESET#	Hardware reset	Active-low asynchronous reset that halts ongoing operations and returns device to read mode.
VCC	Core supply	3.0 V ±10% supply for core logic and flash array; supports single-supply operation across full voltage range.
VIO	I/O supply	Independent 1.65–3.6 V I/O rail enabling interface with 1.8 V or 3.3 V host processors.

Key Features

Feature	Design Value
Asynchronous page-mode read	32-byte aligned page access with 15 ns cycle time - accelerates linear code execution without prefetch buffers.
Embedded Algorithm Controller (EAC)	On-die state machine executing program/erase with auto-verify and timeout - removes host CPU overhead for flash management.
Advanced Sector Protection (ASP)	Volatile and non-volatile lock bits per 128 kB sector - enables secure boot partitioning and field-upgrade isolation.
One-Time Programmable (OTP) array	1024-byte dedicated region with two lockable segments - stores cryptographic keys or calibration data permanently.
Common Flash Interface (CFI)	Standardized parameter table accessible via read commands - enables OS/driver auto-configuration without hard-coded geometry.

Applications

Industrial PLC Firmware Storage

Automotive ECU Boot Memory

Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers deployed in factory automation systems.

IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP capability, directly mapped into processor address space for zero-wait-state execution.

Use Value: 90 ns random access and 15 ns page mode enable deterministic interrupt response under 10 µs, meeting IEC 61131-3 cycle-time requirements.

Use Scenario: Holding ASW-compliant boot code and safety monitor firmware in engine control units operating in under-hood environments.

IC Role / Device Role / Timing Role: AEC-Q100 Grade 3 qualified boot memory with hardware ECC and sector protection to prevent corruption during voltage transients.

Use Value: 100,000 erase cycles and 20-year retention ensure compliance with ISO 26262 ASIL-B functional safety requirements over 15-year vehicle lifetime.

Medical Imaging System BIOS

Network Equipment Configuration Storage

Use Scenario: Hosting FPGA configuration bitstreams and diagnostic firmware in portable ultrasound and MRI subsystems.

IC Role / Device Role / Timing Role: High-reliability storage for mission-critical initialization routines, accessed during cold start before DRAM initialization.

Use Value: Integrated hardware ECC eliminates soft errors from cosmic radiation exposure in clinical settings, reducing field failure rate by >99.9% vs. uncorrected flash.

Use Scenario: Retaining switch/router configuration tables, MAC address pools, and firmware recovery images in carrier-grade Ethernet switches.

IC Role / Device Role / Timing Role: Dual-purpose storage for both persistent config data and golden firmware backup, accessed via parallel bus for rapid failover.

Use Value: 512-byte write buffer enables sub-second firmware rollback during network outage events, minimizing service interruption window.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL01GP10TFI020	Same density and timing, but 64-ball LAE Fortified BGA (9 mm × 9 mm); lacks OTP array and ASP non-volatile lock support.	Preferred for space-constrained designs where board area is prioritized over field-programmable security features.	Select when footprint reduction outweighs need for secure key storage or permanent sector locking.
MX29GL128FPTI-90G	128 Mb density (1/8 capacity), 90 ns access, no hardware ECC, no CFI table, no OTP - requires external error handling and manual geometry definition.	Suitable for cost-sensitive legacy systems where firmware size fits within 16 MB and ECC is implemented in software.	Choose only if design already uses MX29GL series and firmware image remains ≤16 MB; not scalable to 128 MB+ use cases.

Compared with S29GL01GP10TFI020, this part adds OTP and non-volatile ASP for secure boot integrity; versus MX29GL128FPTI-90G, it delivers 8× capacity, hardware ECC, and CFI automation - making it essential for next-gen industrial and automotive platforms requiring scalability and safety certification.

Availability

S29GL01GS10FHI020 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ECU boot memory, and medical imaging system BIOS requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.

Supply support for S29GL01GS10FHI020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions, with global manufacturing and quality certifications including IATF 16949 and ISO 9001.

The GL-S family targets embedded systems requiring deterministic XIP performance, robust data integrity, and long-term firmware storage - designed specifically for industrial automation, automotive ECUs, and medical devices demanding AEC-Q100 qualification and 20-year data retention.

FAQ

Does S29GL01GS10FHI020 support byte-level writes?

No. This device operates exclusively on 16-bit word boundaries due to its ×16 data bus architecture. All write operations - including single-word programming - require 16-bit data alignment and address increments of 2 bytes. Byte-level addressing or partial-word writes are not supported by hardware or command set.

What is the function of the STB pin on this device?

The STB (Strobe) pin is not present on S29GL01GS10FHI020. It appears only in block diagrams as a generic label for internal Y-gating control and does not correspond to a physical pin on the 56-pin TSOP package. Pin count and signal definitions are strictly defined in Section 12.1 of the datasheet.

Can VIO be set to 1.8 V while VCC is at 3.3 V?

Yes. The versatile I/O feature explicitly supports VIO from 1.65 V to VCC. Setting VIO = 1.8 V with VCC = 3.3 V is valid and commonly used to interface with 1.8 V FPGAs or low-voltage microcontrollers while maintaining full 3.3 V core performance and endurance specifications.

Is the OTP array reprogrammable after initial programming?

No. The 1024-byte OTP array consists of one-time programmable fuses. Once a bit is programmed (set to '0'), it cannot be reset to '1'. Two independent lock bits permanently disable further writes to each 512-byte region after initial programming, ensuring cryptographic key immutability.

S29GL01GS10FHI020 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 1Gbit

Memory Organization:: 64M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (13x11)

S29GL01GS10FHI020 FAQ

1.How can I place an order for S29GL01GS10FHI020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL01GS10FHI020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL01GS10FHI020 reliable?

The price and inventory of S29GL01GS10FHI020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS10FHI020 is usually 5 days.

3.What payment methods are accepted for S29GL01GS10FHI020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS10FHI020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL01GS10FHI020?

S29GL01GS10FHI020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL01GS10FHI020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL01GS10FHI020?

For technical support, including S29GL01GS10FHI020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS10FHI020 requirements.

6.How does Aetrix verify that S29GL01GS10FHI020 is sourced from the original manufacturer or authorized distributors?

All S29GL01GS10FHI020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS10FHI020 meets industry standards.

7.What is the process for return or replacement of S29GL01GS10FHI020?

All S29GL01GS10FHI020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS10FHI020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL01GS10FHI020 part is unused and in its original packaging.

Return procedure for S29GL01GS10FHI020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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