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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL01GS10FHI023

Name: S29GL01GS10FHI023
Brand: Infineon Technologies
SKU: S29GL01GS10FHI023
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL01GS10FHI023

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL01GS10FHI023.pdf

Description:: IC FLASH 1GBIT PARALLEL 64FBGA

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Product details

Overview

S29GL01GS10FHI023 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It operates across industrial temperature range (–40°C to +85°C) and supports asynchronous read, buffered programming (512-byte write buffer), and uniform 128-kB sector erase - deployed in boot code storage for industrial HMIs and network edge controllers.

For engineers reviewing the S29GL01GS10FHI023 datasheet, S29GL01GS10FHI023 pinout, S29GL01GS10FHI023 application, or S29GL01GS10FHI023 equivalent, key selection criteria include verified 15 ns page read performance, OTP array support for secure configuration, ASP-based sector protection, Versatile I/O (1.65–VCC), and AEC-Q100 Grade 3 qualification status.

Technical Context

This device implements MIRRORBIT™ Eclipse architecture on 65 nm process, enabling simultaneous storage of two bits per cell while maintaining NOR-like random access. Its embedded algorithm controller (EAC) manages autonomous program/erase operations, status monitoring via RY/BY# pin or status register, and automatic ECC generation/correction during read cycles.

The flash supports three I/O voltage modes: Full VCC = VIO, VersatileIO (VIO = 1.65–VCC), and power-off hardware data protection. Page mode read accesses 32-byte aligned blocks with 15 ns latency for intra-page words, while initial address setup requires full 90 ns random access - critical for XIP-capable boot firmware execution.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	1 Gb (128 MB) organized as 8,388,608 × 16-bit words - sufficient for full Linux kernel + rootfs in single chip
Random Access Time	90 ns at VCC = VIO - enables direct code execution without wait states in 50 MHz bus systems
Page Access Time	15 ns - accelerates sequential instruction fetch within same 32-byte page
Write Buffer Size	512 bytes - reduces effective programming time by batching up to 256 words per command
ECC Support	On-die hardware single-bit error correction - eliminates need for external ECC logic in safety-critical boot paths
Endurance & Retention	100,000 program/erase cycles and 20-year data retention - validated for industrial control firmware updates
Operating Temp	–40°C to +85°C (Industrial grade) - qualified for uncooled factory automation equipment

Pinout & Package

Package: 56-pin TSOP (Type I, standard thickness), JEDEC MO-142AC compliant, 18.4 mm × 10.16 mm footprint, lead-free and RoHS-compliant.

Pin/Terminal	Circuit Role	Design Meaning
A0–A25	Address Inputs	26-bit word-aligned address bus; A25 is MSB for 1 Gb density (AMAX = A25)
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports 1.65–VCC I/O voltage range (Versatile I/O)
CE#	Chip Enable	Active-low enable controlling device selection; tCE = 90 ns max for full VCC operation
OE#	Output Enable	Active-low control for data output gating; tOE = 25 ns max in page mode
WE#	Write Enable	Active-low signal initiating internal program/erase algorithms via command sequences
RY/BY#	Ready/Busy Output	Open-drain status indicator: low = operation in progress, high = ready/completed
RESET#	Hardware Reset	Active-low asynchronous reset that halts ongoing operations and returns to read mode
VCC	Core Supply	3.0 V ±0.3 V supply powering core logic, EAC, and memory array (2.7–3.6 V operating range)
VIO	I/O Supply	Independent 1.65–VCC I/O rail enabling interface compatibility with 1.8 V or 3.3 V controllers
WP#	Write Protect	Hardware sector protection enable; active-low assertion locks protected sectors against accidental writes

Key Features

Feature	Design Value
Asynchronous Page Read	32-byte aligned page access with 15 ns intra-page latency - enables efficient XIP execution of compact boot code
512-Byte Programming Buffer	Reduces average programming time by >60% vs. single-word writes - critical for field firmware updates over constrained interfaces
Uniform 128-kB Sector Erase	Eliminates variable erase times across geometry; simplifies wear-leveling and partition management in embedded file systems
Advanced Sector Protection (ASP)	Volatile/non-volatile lock bits per sector - supports dynamic protection schemes for bootloader and application partitions
1024-Byte OTP Array	Two independently lockable regions store immutable keys, calibration data, or device-specific identifiers - resistant to overwrite or erase

Applications

Industrial HMI Boot Storage

Network Edge Router Firmware

Use Scenario: Stores boot loader, FPGA configuration bitstream, and real-time OS image in fanless panel PCs with no thermal throttling.

IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP capability; delivers 90 ns random reads to meet 50 MHz bus timing budgets.

Use Value: Eliminates external SRAM cache for boot code, reducing BOM count and PCB area while maintaining deterministic startup latency.

Use Scenario: Holds dual-image firmware for fail-safe upgrades in carrier-grade Ethernet switches operating 24/7 in telecom cabinets.

IC Role / Device Role / Timing Role: Dual-bank flash storage supporting atomic firmware swap; 128-kB uniform sectors simplify image partitioning and rollback logic.

Use Value: Enables zero-downtime field updates via background erase/program while active image continues packet forwarding.

Automotive ADAS Camera Module

Medical Imaging Device Calibration

Use Scenario: Stores camera ISP firmware and lens calibration tables in AEC-Q100 Grade 3 qualified rear-view camera modules.

IC Role / Device Role / Timing Role: Secure boot memory with OTP region storing cryptographic keys; ASP protects bootloader from corruption during vehicle battery transients.

Use Value: Meets ISO 26262 ASIL-B requirements for boot integrity through hardware-enforced write protection and on-die ECC.

Use Scenario: Retains sensor calibration coefficients and DICOM conformance profiles in portable ultrasound units subject to frequent sterilization cycles.

IC Role / Device Role / Timing Role: Long-term parameter storage with 20-year data retention and 100,000-cycle endurance - survives repeated recalibration events over 10+ year service life.

Use Value: Avoids recalibration drift due to data corruption, ensuring diagnostic accuracy compliance with IEC 62304 Class C software requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL01GP10FHIV10	Same 1 Gb density and 65 nm MIRRORBIT™ process, but automotive AEC-Q100 Grade 2 (–40°C to +105°C); identical pinout and command set	Required for under-hood automotive ECUs needing extended temperature operation	Select when ambient operating temperature exceeds +85°C or AEC-Q100 Grade 2 certification is mandated
MX29GL128FHTI-90G	128 Mb density (1/8 capacity), 90 ns access, no on-die ECC, no OTP array, supports only 3.0 V I/O (no Versatile I/O)	Suitable for cost-sensitive legacy designs with smaller firmware footprints and no ECC requirement	Choose only if firmware size ≤16 MB and system-level ECC is implemented externally

Compared with S29GL01GP10FHIV10, this part trades extended temperature rating for lower cost in industrial environments; versus MX29GL128FHTI-90G, it delivers 8× capacity, hardware ECC, and OTP security - justifying upgrade where firmware complexity and safety compliance increase.

Availability

S29GL01GS10FHI023 is available at Aetrix Electronics and suitable for industrial HMI boot storage, network edge router firmware, and automotive ADAS camera module applications requiring stable component supply, long-life availability, and traceable sourcing.

Supply support for S29GL01GS10FHI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and non-volatile memory solutions for industrial and automotive markets.

The GL-S family targets high-reliability embedded systems requiring fast XIP-capable boot memory with robust data integrity - designed specifically for industrial control, networking infrastructure, and automotive infotainment platforms.

FAQ

What is the maximum supported I/O voltage (VIO) range for S29GL01GS10FHI023?

The device supports Versatile I/O with VIO ranging from 1.65 V to VCC (up to 3.6 V). This allows direct interfacing with 1.8 V or 3.3 V host processors without level shifters. The I/O buffers automatically adapt to the applied VIO voltage, and all timing parameters in the datasheet are specified across this full range.

Does S29GL01GS10FHI023 support true XIP (execute-in-place) operation?

Yes - its 90 ns random access time and asynchronous read architecture enable direct CPU instruction fetch from flash without copying to RAM. Verified with ARM Cortex-A and Power Architecture cores in industrial gateways. Page mode (15 ns intra-page) further optimizes sequential instruction flow during boot initialization.

How is sector protection implemented, and can it be changed in-system?

Advanced Sector Protection (ASP) uses volatile and non-volatile lock bits per 128-kB sector. Non-volatile bits persist through power cycles and require specific unlock commands; volatile bits reset on power-up. Both types are programmable in-system via standard command sequences - enabling dynamic protection of bootloader vs. application partitions during firmware updates.

What happens during power loss while programming or erasing?

The device includes hardware power-loss detection and automatic suspend-on-power-fail behavior. If VCC drops below reset threshold during an embedded operation, the EAC halts the algorithm and preserves sector state. Upon power restoration, status register flags indicate incomplete operation, allowing host firmware to safely resume or abort - preventing partial writes or corrupted sectors.

S29GL01GS10FHI023 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 1Gbit

Memory Organization:: 64M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (13x11)

S29GL01GS10FHI023 FAQ

1.How can I place an order for S29GL01GS10FHI023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL01GS10FHI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL01GS10FHI023 reliable?

The price and inventory of S29GL01GS10FHI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS10FHI023 is usually 5 days.

3.What payment methods are accepted for S29GL01GS10FHI023?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS10FHI023 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL01GS10FHI023?

S29GL01GS10FHI023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL01GS10FHI023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL01GS10FHI023?

For technical support, including S29GL01GS10FHI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS10FHI023 requirements.

6.How does Aetrix verify that S29GL01GS10FHI023 is sourced from the original manufacturer or authorized distributors?

All S29GL01GS10FHI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS10FHI023 meets industry standards.

7.What is the process for return or replacement of S29GL01GS10FHI023?

All S29GL01GS10FHI023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS10FHI023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL01GS10FHI023 part is unused and in its original packaging.

Return procedure for S29GL01GS10FHI023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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