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Infineon Technologies S29GL01GS10TFA010
- Part No.:
- S29GL01GS10TFA010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL01GS10TFA010.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:1,532
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Product details
Overview
S29GL01GS10TFA010 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access and 15 ns page access, and integrates hardware ECC for single-bit error correction. Used in boot code storage for industrial microcontrollers requiring fast XIP execution and reliable non-volatile program retention.
For engineers reviewing the S29GL01GS10TFA010 datasheet, S29GL01GS10TFA010 pinout, S29GL01GS10TFA010 application, or S29GL01GS10TFA010 equivalent, key selection criteria include its 128-kbyte uniform sector erase architecture, 512-byte write buffer throughput (1.5 MBps), Versatile I/O support (1.65–3.6 V), OTP array with dual lockable regions, and AEC-Q100 Grade 2 qualification (–40°C to +105°C).
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A25), supports both standard and page-mode reads, and uses embedded algorithms for sector erase and buffered programming without host CPU intervention. Its internal state machine handles command execution, status reporting via RY/BY# pin or status register, and automatic ECC generation/correction during read cycles.
The flash array is organized into uniform 128-kbyte sectors, each independently erasable, and includes dedicated 1024-byte OTP space with two lockable regions for secure configuration or calibration data. Sector protection is configurable via volatile (SR bits) and non-volatile (lock bits) methods, enabling flexible firmware update and field-programmable security policies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 1 Gb (128 MB) - supports full boot image storage for high-end MCUs and SoCs |
| Interface | Parallel ×16 asynchronous - enables direct memory-mapped XIP execution without translation layer |
| Access Time | 90 ns random / 15 ns page - meets real-time boot latency requirements in industrial controllers |
| Write Buffer | 512 bytes - reduces effective programming time by 4× vs. single-word writes |
| ECC | Hardware single-bit correction - eliminates need for external ECC logic in safety-critical systems |
| Endurance | 100,000 program/erase cycles - supports frequent firmware updates over 10+ year product life |
| Data Retention | 20 years at +85°C - ensures long-term reliability in unattended embedded deployments |
Pinout & Package
Package: 64-ball LAE Fortified BGA (9 mm × 9 mm, 0.8 mm pitch). Pinout validated per Infineon datasheet 001-98285 Rev. *U, Section 12.2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A25 | Address inputs | 26-bit word address bus; A25 is MSB for 1 Gb density (226 × 16-bit = 128 MB) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte/word writes and reads with no external multiplexing |
| CE# | Chip enable | Active-low chip select; controls device power state and enables internal timing for access |
| OE# | Output enable | Active-low read strobe; gates output drivers without affecting internal state machine |
| WE# | Write enable | Active-low control for write/program operations; latches command sequences and data |
| RY/BY# | Ready/Busy | Open-drain status indicator; low during embedded erase/program, high when ready |
| VCC | Core supply | 2.7–3.6 V core voltage; powers logic, array, and ECC engine |
| VIO | I/O supply | 1.65–3.6 V independent I/O rail; decouples interface voltage from core for mixed-signal SoC interfacing |
Key Features
| Feature | Design Value |
|---|---|
| Page mode read | 32-byte aligned page access with 15 ns cycle time - accelerates sequential instruction fetch in XIP applications |
| Embedded sector erase | Self-timed 128-kbyte sector erase with suspend/resume - enables background firmware updates without system halt |
| Versatile I/O | Independent VIO rail (1.65–3.6 V) - simplifies interface to 1.8 V or 3.3 V host processors without level shifters |
| OTP array | 1024-byte one-time-programmable space with two lockable regions - stores immutable keys or calibration data resistant to field reprogramming |
| CFI compliance | Standard Common Flash Interface table - enables auto-detection and driver compatibility across toolchains and OS bootloaders |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot firmware and real-time control code in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: Non-volatile XIP-capable boot memory mapped directly to MCU address space; provides deterministic 90 ns instruction fetch latency. Use Value: Eliminates external SRAM copy step during boot, reducing startup time by >30% and system BOM cost by removing secondary cache memory. | Use Scenario: Holding safety-critical boot code and sensor calibration data in front-camera modules certified to ISO 26262 ASIL-B. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 (–40°C to +105°C) flash with hardware ECC and OTP lock - ensures integrity of boot sequence under thermal stress. Use Value: Meets automotive functional safety requirements without software ECC overhead, enabling deterministic boot within 100 ms cold-start window. |
| Medical Imaging System BIOS | Telecom Base Station Configuration |
Use Scenario: Storing diagnostic firmware and FPGA configuration bitstreams in portable ultrasound devices requiring FDA-compliant data retention. IC Role / Device Role / Timing Role: High-reliability 20-year data retention flash with 100,000-cycle endurance - preserves calibration and regulatory-critical parameters across device lifetime. Use Value: Avoids recalibration service visits by guaranteeing parameter persistence through 15+ years of clinical use and repeated power cycling. | Use Scenario: Hosting field-upgradable configuration tables and protocol stacks in 5G remote radio units deployed in outdoor cabinets. IC Role / Device Role / Timing Role: Sector-protected flash with suspend/resume erase - allows live firmware patching during maintenance windows without interrupting RF transmission. Use Value: Enables zero-downtime configuration updates, meeting telecom SLA requirements for >99.999% network uptime. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GP10TFI010 | Same density and timing, but TSOP-56 package (not BGA); lacks AEC-Q100 qualification | Suitable for cost-sensitive industrial boards where PCB space permits larger footprint and automotive temp range not required | Select when board layout favors through-hole or standard surface-mount packages and extended temperature operation is unnecessary |
| MX29GL128FPTI-90G | 128 Mb (not 1 Gb); 90 ns access; no integrated ECC; 1.8 V I/O compatible | Lower density, lower power, but requires external ECC implementation and cannot replace full boot image in high-end SoCs | Choose only for legacy designs with smaller firmware footprints and where ECC is handled in software or companion logic |
Compared with S29GL01GP10TFI010 and MX29GL128FPTI-90G, the S29GL01GS10TFA010 uniquely combines 1 Gb density, automotive-grade reliability, hardware ECC, and BGA packaging-making it the sole option for new AEC-Q100-compliant designs requiring full XIP boot capability in space-constrained modules.
Availability
S29GL01GS10TFA010 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system BIOS requiring stable component supply across multi-year production cycles.
Supply support for S29GL01GS10TFA010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.
The GL-S family targets high-reliability embedded systems needing fast, dense, and secure non-volatile storage-designed specifically for XIP boot code, firmware updates, and mission-critical configuration data in automotive, industrial, and medical applications.
FAQ
What is the maximum operating temperature range for S29GL01GS10TFA010?
This part is qualified to AEC-Q100 Grade 2, supporting continuous operation from –40°C to +105°C ambient temperature. It meets automotive thermal stress requirements including thermal cycling and high-temperature storage, and is validated for use in under-hood and near-engine control modules where ambient temperatures exceed 85°C.
Does S29GL01GS10TFA010 require external ECC circuitry?
No. The device includes fully integrated hardware ECC that automatically detects and corrects single-bit errors during every read operation. No external logic, software routines, or additional memory bandwidth is needed-reducing system complexity and ensuring deterministic error recovery in safety-critical applications.
Can S29GL01GS10TFA010 be used in place of older S29GL01GT devices?
Yes, but only with verified pinout and timing compatibility. S29GL01GS10TFA010 uses the LAE BGA package (64-ball, 9 mm × 9 mm), whereas S29GL01GT variants commonly use TSOP or different BGA footprints. Electrical timing and command set are backward-compatible, but mechanical replacement requires PCB redesign and validation of signal integrity at 90 ns access speeds.
How is sector protection configured on this device?
Sector protection is implemented via two independent mechanisms: volatile protection controlled by Status Register bits (cleared on power-up), and non-volatile protection set using lock bits stored in each sector's protection register. Both methods support individual 128-kbyte sector locking, enabling hierarchical firmware partitioning-for example, locking bootloader sectors while allowing application updates.
S29GL01GS10TFA010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL01GS10TFA010 FAQ
1.How can I place an order for S29GL01GS10TFA010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GS10TFA010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GS10TFA010 reliable?
The price and inventory of S29GL01GS10TFA010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS10TFA010 is usually 5 days.
3.What payment methods are accepted for S29GL01GS10TFA010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS10TFA010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GS10TFA010?
S29GL01GS10TFA010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GS10TFA010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GS10TFA010?
For technical support, including S29GL01GS10TFA010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS10TFA010 requirements.
6.How does Aetrix verify that S29GL01GS10TFA010 is sourced from the original manufacturer or authorized distributors?
All S29GL01GS10TFA010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS10TFA010 meets industry standards.
7.What is the process for return or replacement of S29GL01GS10TFA010?
All S29GL01GS10TFA010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS10TFA010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GS10TFA010 part is unused and in its original packaging.
Return procedure for S29GL01GS10TFA010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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