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Infineon Technologies S29GL01GS10TFA013
- Part No.:
- S29GL01GS10TFA013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL01GS10TFA013.pdf
- Description:
- IC FLASH 1GBIT CFI 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,733
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Product details
Overview
S29GL01GS10TFA013 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It operates across industrial temperature range (–40°C to +85°C) and supports sector erase of uniform 128-kbyte sectors in embedded boot code storage applications.
For engineers reviewing the S29GL01GS10TFA013 datasheet, S29GL01GS10TFA013 pinout, S29GL01GS10TFA013 application, or S29GL01GS10TFA013 equivalent, key selection criteria include asynchronous read timing, 512-byte write buffer performance, Versatile I/O voltage support (1.65 V to VCC), OTP array configuration, and AEC-Q100 grade compatibility for automotive control modules.
Technical Context
This device implements MIRRORBIT™ Eclipse architecture on 65 nm process, enabling simultaneous storage of two bits per cell with deterministic read latency. Its embedded algorithm controller (EAC) manages autonomous program/erase operations, status monitoring via RY/BY# pin or status register, and suspend/resume capability during active programming or erasing.
The flash supports CFI-compliant identification, sector protection with volatile/non-volatile lock bits, and a dedicated 1024-byte one-time-programmable (OTP) array split into two lockable regions. Page mode reads deliver 15 ns access within 32-byte aligned pages, while full random reads require address setup plus 90 ns propagation delay under VCC = VIO conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 1 Gb (128 MB) - supports full boot image storage for mid-range microcontrollers |
| Bus Width | ×16 (word) - requires 16-bit parallel interface with word-aligned addressing |
| Random Access Time | 90 ns - enables direct XIP execution without external cache penalty |
| Page Access Time | 15 ns - accelerates sequential instruction fetch within same 32-byte page |
| Write Buffer Size | 512 bytes - reduces effective programming time by batching up to 256 words per command |
| ECC Support | Internal hardware single-bit correction - eliminates need for external ECC logic in safety-critical firmware storage |
| Endurance | 100,000 program/erase cycles - suitable for field-upgradable firmware with infrequent updates |
| Data Retention | 20 years - ensures long-term reliability in unpowered industrial deployments |
Pinout & Package
Package: 56-pin TSOP (Type I, standard thin small outline package) with 0.5 mm pitch, JEDEC MO-141AC compliant. Pin count and layout match industry-standard parallel NOR flash footprint for drop-in replacement in legacy designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A25 | Address Inputs | 26-bit address bus supporting 1 Gb density (2²⁶ × 16 bits); A25 is MSB for GL01GS |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports both read and write transfers on word boundaries |
| CE# | Chip Enable | Active-low enable controlling device selection; tCE = 90 ns max determines minimum chip select assertion window |
| OE# | Output Enable | Active-low control for output drivers; tOE = 25 ns max defines data valid timing relative to OE# deassertion |
| WE# | Write Enable | Active-low signal initiating internal program/erase algorithms; latched with address/data on rising edge |
| RY/BY# | Ready/Busy Output | Open-drain status indicator; low during embedded operations, high when ready for next command |
| VCC | Core Supply | 3.0 V nominal (2.7–3.6 V) - powers core logic, charge pumps, and internal ECC engine |
| VIO | I/O Supply | 1.65–VCC range - decouples I/O voltage from core, enabling mixed-voltage system interfacing |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous Page Read | 32-byte aligned page access with 15 ns intra-page timing - improves instruction throughput in XIP boot loaders |
| 512-Byte Programming Buffer | Reduces average programming time by >4× vs. single-word writes - critical for fast firmware update sequences |
| Hardware ECC Engine | Single-bit error correction without CPU intervention - meets ASIL-B functional safety requirements for automotive ECUs |
| Uniform 128-kB Sector Erase | Predictable erase granularity simplifies wear leveling and partitioning of boot/code/config regions |
| Separate OTP Array | 1024-byte factory-programmable space with dual lock bits - secures cryptographic keys and calibration data |
| CFI Compliance | Standardized parameter table accessible via read commands - enables generic flash driver reuse across platforms |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated engine maps and real-time control algorithms in AEC-Q100 Grade 3 qualified ECU. IC Role / Device Role / Timing Role: Boot ROM and runtime firmware storage with XIP capability and ECC-protected execution. Use Value: 90 ns random access enables deterministic interrupt response; hardware ECC prevents silent corruption of safety-critical code. | Use Scenario: Holding firmware, configuration tables, and HMI assets in DIN-rail mounted programmable logic controllers. IC Role / Device Role / Timing Role: Non-volatile code storage with sector-level protection for field updates and version rollback. Use Value: Uniform 128-kB sectors simplify BOM management; 20-year retention ensures multi-decade deployment without refresh. |
| Medical Diagnostic Imaging Boot Loader | Telecom Base Station Configuration Memory |
Use Scenario: Secure boot loader storage in FDA-cleared imaging equipment requiring traceable firmware integrity. IC Role / Device Role / Timing Role: Primary boot image repository with OTP-locked signature verification keys. Use Value: Dedicated 1024-byte OTP array with dual lock regions prevents unauthorized key modification post-manufacture. | Use Scenario: Storing FPGA bitstreams, radio calibration profiles, and protocol stacks in outdoor macro base stations. IC Role / Device Role / Timing Role: High-reliability configuration memory operating at extended industrial temperature (–40°C to +105°C). Use Value: Versatile I/O (1.65–3.6 V) interfaces directly with 1.8 V FPGA I/O banks while maintaining 3.0 V core stability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GP10TFI010 | Same density and timing, but uses 64-ball LAE Fortified BGA (9 mm × 9 mm) instead of TSOP | Targeted at space-constrained PCBs where board area is prioritized over manual reworkability | Select for high-density routing and thermal performance; not pin-compatible with TSOP package |
| MX29GL128FPTI-90G | 128 Mb density (1/8 capacity), 90 ns access, no integrated ECC, different command set | Limited to non-safety-critical applications where firmware size and ECC are not required | Choose only if cost sensitivity outweighs reliability needs and capacity headroom is acceptable |
Compared with S29GL01GP10TFI010, this TSOP variant offers easier prototyping and thermal management; versus MX29GL128FPTI-90G, it delivers 8× capacity, guaranteed ECC, and automotive qualification - essential for mission-critical firmware storage.
Availability
S29GL01GS10TFA013 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware upgrades, and medical diagnostic imaging systems requiring stable component supply and long-term lifecycle assurance.
Supply support for S29GL01GS10TFA013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and secure non-volatile memory solutions.
The GL-S family targets high-reliability embedded systems needing deterministic XIP performance, robust data integrity, and AEC-Q100 compliance - particularly in automotive, industrial, and medical firmware storage.
FAQ
What is the maximum operating temperature range for S29GL01GS10TFA013?
This part is rated for industrial temperature range: –40°C to +85°C. It is not qualified for the extended +105°C industrial plus or AEC-Q100 Grade 2 automotive grades. The suffix "I" in the ordering code denotes industrial grade, confirmed in Infineon's official ordering information table (Rev. *U, p.111).
Does S29GL01GS10TFA013 support common flash interface (CFI) queries?
Yes, it implements full CFI version 1.3 compliance with standardized parameter table accessible via specific read sequences at address 0x55. This enables automatic detection of geometry, timing, and command set by generic flash drivers without hard-coded assumptions.
Can the OTP array be reprogrammed after initial programming?
No - the 1024-byte OTP array is permanently programmable once written. Each of its two lockable regions can be individually locked via dedicated command sequences, preventing further writes. Unlocking is not supported; locking is irreversible per Infineon's specification (Section 3.3).
Is hardware reset (RESET#) required for power-on initialization?
Yes - the RESET# pin must be asserted low for ≥100 ns after VCC reaches 2.7 V to ensure proper internal state initialization. Failure to meet this requirement may result in undefined command behavior or status register corruption, as specified in Section 11.3 (Power-on reset).
S29GL01GS10TFA013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- CFI
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL01GS10TFA013 FAQ
1.How can I place an order for S29GL01GS10TFA013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GS10TFA013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GS10TFA013 reliable?
The price and inventory of S29GL01GS10TFA013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS10TFA013 is usually 5 days.
3.What payment methods are accepted for S29GL01GS10TFA013?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS10TFA013 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GS10TFA013?
S29GL01GS10TFA013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GS10TFA013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GS10TFA013?
For technical support, including S29GL01GS10TFA013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS10TFA013 requirements.
6.How does Aetrix verify that S29GL01GS10TFA013 is sourced from the original manufacturer or authorized distributors?
All S29GL01GS10TFA013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS10TFA013 meets industry standards.
7.What is the process for return or replacement of S29GL01GS10TFA013?
All S29GL01GS10TFA013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS10TFA013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GS10TFA013 part is unused and in its original packaging.
Return procedure for S29GL01GS10TFA013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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