My Inquiry
My Account
Infineon Technologies S29GL01GS10TFA020
- Part No.:
- S29GL01GS10TFA020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL01GS10TFA020.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,165
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL01GS10TFA020 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access and 15 ns page access, and integrates hardware ECC for single-bit error correction. It is used in boot code storage for industrial microcontrollers requiring fast XIP execution and reliable non-volatile program retention.
For engineers reviewing the S29GL01GS10TFA020 datasheet, S29GL01GS10TFA020 pinout, S29GL01GS10TFA020 application, or S29GL01GS10TFA020 equivalent, key selection criteria include its 128-kbyte uniform sector erase granularity, 512-byte write buffer throughput (1.5 MBps), Versatile I/O support (1.65–3.6 V), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and CFI-compliant interface for firmware portability.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A25), supports both standard and page-mode reads, and uses embedded algorithms for sector erase and buffered programming without external timing control. Its internal state machine handles command sequencing, status reporting via RY/BY# pin or status register, and automatic ECC generation/correction during read operations.
The architecture includes dedicated logic for suspend/resume of program/erase operations, advanced sector protection (volatile/non-volatile lock bits per 128-kbyte sector), and a separate 1024-byte OTP array with two independently lockable regions - enabling secure boot configuration and device-specific calibration storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB), organized as 8,388,608 × 16-bit words - sufficient for full firmware images in high-end industrial controllers. |
| Random access time | 90 ns at VCC = VIO - enables direct XIP execution from flash with minimal CPU stall cycles. |
| Page access time | 15 ns - allows rapid sequential reads within 32-byte aligned pages for tight inner loops. |
| Write buffer size | 512 bytes (256 words) - reduces average programming time by batching writes and minimizing command overhead. |
| ECC capability | Internal hardware single-bit error correction - eliminates need for external ECC logic or software correction routines. |
| Endurance & retention | 100,000 program/erase cycles and 20-year data retention - meets long-life requirements for unattended embedded systems. |
| Operating temperature | –40°C to +105°C (AEC-Q100 Grade 2) - qualified for under-hood automotive and high-ambient industrial environments. |
Pinout & Package
Package: 64-ball LAE Fortified BGA (9 mm × 9 mm, 0.8 mm pitch). Pinout validated per Infineon datasheet 001-98285 Rev. *U, Section 12.2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A25 | Address inputs | 26-bit word address bus; A25 is MSB for 1 Gb density (8,388,608 words). |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports 1.65–3.6 V I/O voltage (VIO) independent of VCC. |
| CE# | Chip enable | Active-low chip select; controls device power state and enables command decoding. |
| OE# | Output enable | Active-low read strobe; gates output drivers during read operations. |
| WE# | Write enable | Active-low write strobe; initiates program/erase command latching and data loading. |
| RY/BY# | Ready/Busy indicator | Open-drain active-low signal indicating internal operation progress (e.g., erase completion). |
| WP# | Write protect | Hardware sector lock override; disables program/erase when asserted low. |
| RESET# | Hardware reset | Asynchronous active-low reset that halts ongoing operations and returns device to read mode. |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65–3.6 V independently of VCC - simplifies interfacing with mixed-voltage SoCs without level shifters. |
| 512-byte write buffer | Enables 1.5 MBps effective programming rate - cuts firmware update time vs. byte-by-byte programming. |
| Uniform 128-kbyte sectors | 64 identical sectors simplify partitioning for bootloader, application, and parameter storage with deterministic erase times. |
| Hardware ECC engine | Corrects single-bit errors on-the-fly during read - ensures data integrity without software overhead or latency penalty. |
| OTP array with dual lock | 1024-byte one-time-programmable region split into two independently lockable blocks - secures unique device IDs and calibration constants. |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot loader, real-time OS kernel, and GUI assets in digital dashboard ECUs. IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP capability and AEC-Q100 Grade 2 thermal reliability. Use Value: 90 ns random access enables responsive UI rendering; 100,000-cycle endurance supports field firmware updates over 15+ years. | Use Scenario: Holding firmware, configuration tables, and safety-critical logic in programmable logic controllers deployed in factory automation. IC Role / Device Role / Timing Role: High-reliability boot memory with hardware ECC and sector-level write protection. Use Value: Internal ECC eliminates silent corruption risk; uniform 128-kbyte sectors allow atomic firmware rollback after failed updates. |
| Medical Imaging System Boot | Telecom Base Station Control |
Use Scenario: Loading FPGA configuration bitstreams and diagnostic firmware in MRI/CT scanner mainboards. IC Role / Device Role / Timing Role: Secure, high-density boot memory with OTP-locked calibration data and tamper-resistant sector protection. Use Value: Dual-lock OTP region preserves factory calibration; ASP prevents accidental overwrite of safety-critical boot code. | Use Scenario: Storing baseband processor firmware and protocol stack binaries in 4G/5G remote radio units operating in outdoor enclosures. IC Role / Device Role / Timing Role: Industrial-grade parallel NOR flash with extended temperature operation and CFI compatibility for multi-vendor toolchain support. Use Value: CFI parameter table enables automated flash programming across different JTAG/debug tools; 20-year retention guarantees firmware persistence across product lifecycle. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GP10TFI020 | Same density and timing, but TSOP-56 package (not BGA); lacks AEC-Q100 qualification. | Targeted at cost-sensitive industrial PCBs where BGA assembly is avoided. | Select when board space permits TSOP and automotive qualification is unnecessary. |
| MX29GL128FPTI-90G | 128 Mb (not 1 Gb), 90 ns access, no integrated ECC, no OTP array. | Suitable for legacy designs with smaller firmware footprints and external error handling. | Choose only if density and ECC are not required; not a drop-in replacement. |
Compared with S29GL01GP10TFI020, this part adds automotive qualification and BGA footprint for compact layouts; versus MX29GL128FPTI-90G, it provides 8× density, hardware ECC, and OTP security - critical for next-generation firmware integrity.
Availability
S29GL01GS10TFA020 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical imaging systems, and telecom base stations requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S29GL01GS10TFA020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and high-reliability memory solutions for mission-critical applications.
The GL-S family targets embedded systems needing fast XIP-capable flash with automotive-grade robustness, combining high density, low-power operation, and hardware-assisted data integrity features.
FAQ
What is the maximum supported VIO voltage for S29GL01GS10TFA020?
The device supports VIO from 1.65 V to VCC, with VCC rated 2.7–3.6 V. Therefore, maximum VIO is 3.6 V when VCC = 3.6 V. This allows direct interfacing with 3.3 V or lower I/O domains without external level shifters, reducing BOM count and layout complexity in mixed-voltage systems.
Does S29GL01GS10TFA020 require external ECC circuitry?
No. It includes an internal hardware ECC engine that automatically detects and corrects single-bit errors during read operations. The ECC is transparent to the host system - no software driver or external logic is needed. This ensures data integrity in harsh environments while preserving read performance and simplifying firmware design.
Can the OTP array be reprogrammed after locking?
No. Once either of the two 512-byte OTP regions is locked via the appropriate command sequence, it becomes permanently read-only. Programming is allowed only before lock activation. This one-time programmability ensures cryptographic keys, calibration data, or device identifiers remain immutable after factory programming - meeting functional safety and anti-tampering requirements.
Is S29GL01GS10TFA020 compatible with legacy S29GL01Gxxx devices using the same command set?
Yes. It implements the standard AMD/Fujitsu command set and Common Flash Interface (CFI) parameter table, ensuring backward compatibility with existing flash programmers and bootloader code designed for earlier GL-family parts. Command sequences for read, program, erase, and status polling remain identical - enabling seamless migration without firmware changes.
S29GL01GS10TFA020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL01GS10TFA020 FAQ
1.How can I place an order for S29GL01GS10TFA020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GS10TFA020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GS10TFA020 reliable?
The price and inventory of S29GL01GS10TFA020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS10TFA020 is usually 5 days.
3.What payment methods are accepted for S29GL01GS10TFA020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS10TFA020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GS10TFA020?
S29GL01GS10TFA020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GS10TFA020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GS10TFA020?
For technical support, including S29GL01GS10TFA020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS10TFA020 requirements.
6.How does Aetrix verify that S29GL01GS10TFA020 is sourced from the original manufacturer or authorized distributors?
All S29GL01GS10TFA020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS10TFA020 meets industry standards.
7.What is the process for return or replacement of S29GL01GS10TFA020?
All S29GL01GS10TFA020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS10TFA020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GS10TFA020 part is unused and in its original packaging.
Return procedure for S29GL01GS10TFA020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GS10TFA020 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
