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Infineon Technologies S29GL01GS10TFA023
- Part No.:
- S29GL01GS10TFA023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL01GS10TFA023.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:4,378
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Product details
Overview
S29GL01GS10TFA023 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 3.0 V core supply, 16-bit data bus, and MIRRORBIT™ Eclipse 65 nm technology. It delivers 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. Designed for embedded boot code storage in industrial control systems requiring high reliability and fast XIP execution.
For engineers reviewing the S29GL01GS10TFA023 datasheet, S29GL01GS10TFA023 pinout, S29GL01GS10TFA023 application, or S29GL01GS10TFA023 equivalent, key selection criteria include uniform 128-kbyte sector erase, 512-byte write buffer throughput (1.5 MBps), Versatile I/O (1.65–3.6 V), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and CFI-compliant interface for firmware portability.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A25), supporting both standard read and 32-byte page-mode reads. Its embedded algorithm controller (EAC) manages all program/erase operations autonomously, including suspend/resume capability and status reporting via status register, data polling, or RY/BY# pin.
The flash array is organized into uniform 128-kbyte sectors with advanced sector protection (ASP) enabling independent volatile/non-volatile locking per sector. The integrated 1024-byte OTP array includes two lockable regions for secure configuration storage, and ECC logic operates transparently during read cycles without software intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 1 Gb (128 MB) - supports full boot image storage for mid-range microcontrollers |
| Interface | Parallel ×16 asynchronous - enables direct XIP execution without external buffering |
| Access Time | 90 ns random / 15 ns page - meets real-time interrupt latency requirements in industrial PLCs |
| Write Buffer | 512 bytes - reduces average programming time by >70% vs. single-word writes |
| ECC | Hardware single-bit correction - eliminates need for external error-handling firmware |
| Endurance | 100,000 program/erase cycles - suitable for field-upgradable firmware with frequent updates |
| Data Retention | 20 years at 85°C - ensures long-term reliability in uncooled industrial enclosures |
Pinout & Package
Package: 64-ball LAE Fortified BGA (9 mm × 9 mm, 0.8 mm pitch). RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A25 | Address inputs | 26-bit word address bus (A25 active for 1 Gb density); latched on CE# low |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports Versatile I/O voltage (1.65–3.6 V) |
| CE# | Chip enable | Active-low device select; controls power state and access initiation |
| OE# | Output enable | Active-low read strobe; gates output drivers during read cycles |
| WE# | Write enable | Active-low write strobe; initiates program/erase command sequences |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling internal operation progress (low = busy) |
| RESET# | Hardware reset | Active-low asynchronous reset; forces device into known initial state |
| VCC | Core supply | 3.0 V ±0.3 V supply for core logic and flash array (2.7–3.6 V operational range) |
| VIO | I/O supply | Independent I/O voltage rail (1.65–3.6 V) enabling mixed-voltage system interfacing |
Key Features
| Feature | Design Value |
|---|---|
| Page-mode read (32-byte aligned) | 15 ns cycle time within same page - accelerates sequential instruction fetch in XIP applications |
| 512-byte write buffer | Single-command programming of up to 512 bytes - minimizes CPU overhead during firmware update |
| Hardware ECC | Transparent single-bit error correction on every read - eliminates soft-error-induced crashes |
| Uniform 128-kB sectors | 64 identical erase blocks - simplifies partitioning for bootloader + application + parameter storage |
| Advanced sector protection (ASP) | Volatile and non-volatile lock per sector - enables secure field updates without permanent lockout |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot firmware and real-time control logic in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with ≤90 ns latency. Use Value: Uniform 128-kB sectors allow safe dual-bank firmware updates; 20-year data retention ensures maintenance-free operation over equipment lifetime. | Use Scenario: Holding safety-critical boot code and sensor calibration data in automotive camera ECU modules operating at 105°C ambient. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified parallel NOR flash serving as primary boot device for SoC initialization. Use Value: Hardware ECC prevents silent corruption of boot code; Versatile I/O supports 1.8 V MCU interface while powered from 3.3 V rail. |
| Medical Imaging System BIOS | Telecom Base Station Configuration |
Use Scenario: Storing diagnostic firmware and regulatory-compliant boot images in FDA-cleared imaging equipment requiring traceable firmware integrity. IC Role / Device Role / Timing Role: Secure silicon region (OTP) stores cryptographic keys; ECC ensures bit-level reliability during power cycling. Use Value: Two lockable 512-byte OTP regions enable secure key provisioning; 100,000 erase cycles support repeated certification revalidation. | Use Scenario: Hosting FPGA configuration bitstreams and runtime parameter tables in 5G remote radio units exposed to wide temperature swings. IC Role / Device Role / Timing Role: High-density parallel flash with suspend/resume capability allows background reconfiguration without interrupting RF processing. Use Value: Sector erase suspend enables priority interrupt handling during long erase operations; RY/BY# pin provides precise timing for system coordination. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GS10TFI020 | Same density and architecture but Industrial grade (–40°C to +85°C), no AEC-Q100 qualification | Lacks automotive temperature and stress validation; unsuitable for under-hood deployment | Select when cost-sensitive industrial designs do not require extended temperature or automotive qualification |
| MX29GL128FPTI-90G | 128 Mb density (1/8 capacity), 90 ns access, no integrated ECC, different command set | Requires external error handling; insufficient capacity for full boot + app storage in modern SoCs | Consider only for legacy 128 Mb footprint compatibility where ECC and density are not critical |
Compared with S29GL01GS10TFA023, the S29GL01GS10TFI020 offers identical performance at lower qualification cost, while MX29GL128FPTI-90G trades density and ECC for pin compatibility with older designs-neither matches the combined automotive readiness, 1 Gb capacity, and hardware ECC of the original.
Availability
S29GL01GS10TFA023 is available at Aetrix Electronics and suitable for industrial control systems, automotive ADAS ECUs, and medical imaging devices requiring stable component supply across extended product lifecycles.
Supply support for S29GL01GS10TFA023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and high-reliability memory solutions for mission-critical applications.
The GL-S family targets embedded systems needing robust, high-speed parallel NOR flash with automotive-grade reliability, XIP capability, and integrated data integrity features.
FAQ
What is the purpose of the Versatile I/O (VIO) feature in S29GL01GS10TFA023?
The Versatile I/O feature allows independent voltage supply (1.65 V to 3.6 V) to the DQ pins, decoupling I/O signaling from the 3.0 V core supply. This enables direct interfacing with 1.8 V, 2.5 V, or 3.3 V microcontrollers without level shifters, reducing BOM count and signal integrity risk in mixed-voltage designs.
Does S29GL01GS10TFA023 support true XIP (execute-in-place) operation?
Yes - its 90 ns random access time and asynchronous parallel interface allow direct CPU instruction fetch from flash without copying to RAM. The 32-byte page-mode read (15 ns cycles) further accelerates sequential execution, making it suitable for real-time deterministic code execution in industrial and automotive applications.
How does the 512-byte write buffer improve firmware update efficiency?
The buffer accepts up to 512 bytes in a single command sequence, reducing CPU intervention and bus arbitration overhead. At 1.5 MBps effective throughput, it cuts total programming time by ~75% versus single-word writes - critical for minimizing downtime during field firmware upgrades in deployed systems.
Can the OTP array be used for storing cryptographic keys in secure boot implementations?
Yes - the 1024-byte OTP array contains two independently lockable 512-byte regions. Once locked, contents cannot be modified or read back, making it suitable for storing root-of-trust keys, device identifiers, or calibration secrets in certified secure boot chains compliant with IEC 62443 or ISO/SAE 21434.
S29GL01GS10TFA023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL01GS10TFA023 FAQ
1.How can I place an order for S29GL01GS10TFA023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GS10TFA023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GS10TFA023 reliable?
The price and inventory of S29GL01GS10TFA023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS10TFA023 is usually 5 days.
3.What payment methods are accepted for S29GL01GS10TFA023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS10TFA023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GS10TFA023?
S29GL01GS10TFA023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GS10TFA023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GS10TFA023?
For technical support, including S29GL01GS10TFA023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS10TFA023 requirements.
6.How does Aetrix verify that S29GL01GS10TFA023 is sourced from the original manufacturer or authorized distributors?
All S29GL01GS10TFA023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS10TFA023 meets industry standards.
7.What is the process for return or replacement of S29GL01GS10TFA023?
All S29GL01GS10TFA023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS10TFA023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GS10TFA023 part is unused and in its original packaging.
Return procedure for S29GL01GS10TFA023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GS10TFA023 Tags
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