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Infineon Technologies S29GL01GS10TFI010
- Part No.:
- S29GL01GS10TFI010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL01GS10TFI010.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:913
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Product details
Overview
S29GL01GS10TFI010 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 90 ns random access time, 15 ns page access time, and industrial temperature grade (–40°C to +85°C), used for boot code storage and firmware execution in embedded controllers.
For engineers reviewing the S29GL01GS10TFI010 datasheet, S29GL01GS10TFI010 pinout, S29GL01GS10TFI010 application, or S29GL01GS10TFI010 equivalent, this device supports asynchronous XIP-capable read, 512-byte buffer programming, hardware ECC, uniform 128-kB sector erase, and versatile I/O (1.65–VCC).
Technical Context
This device implements MIRRORBIT™ Eclipse architecture on 65 nm process, enabling dual-bit-per-cell storage without compromising reliability. It uses an embedded algorithm controller (EAC) to manage program/erase operations autonomously, with status reporting via status register, data polling, and RY/BY# pin.
The flash supports both full-VCC and Versatile I/O modes: in Versatile I/O, VIO ranges 1.65 V to VCC, decoupling I/O voltage from core logic. Sector protection includes volatile/non-volatile ASP and OTP array with two lockable 512-byte regions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 1 Gb (128 MB); supports large boot images and firmware binaries in space-constrained designs. |
| Access Time | 90 ns random / 15 ns page; enables fast instruction fetch for XIP execution in microcontrollers. |
| Programming Buffer | 512 bytes; reduces effective programming time by batching writes, critical for field firmware updates. |
| ECC | Internal hardware single-bit correction; maintains data integrity without host CPU overhead. |
| Sector Size | Uniform 128 kB sectors; simplifies partitioning for bootloader, OS, and application storage with deterministic erase granularity. |
| Endurance | 100,000 program/erase cycles; suitable for applications requiring frequent firmware patching or logging. |
| Data Retention | 20 years at 85°C; ensures long-term reliability in industrial control and automotive ECUs. |
Pinout & Package
Package: 56-pin TSOP (Type I, 400 mil width). Pinout validated per Infineon datasheet Rev. *U (2024-06-25), Section 12.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A25 | Address inputs | 26-bit word address bus (A25 valid for 1 Gb density); supports 128 MB addressing with word alignment. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates at VIO (1.65–VCC), enabling mixed-voltage system interfacing. |
| CE# | Chip enable | Active-low chip select; controls device activation during read/write; tCE = 90 ns (full VCC mode). |
| OE# | Output enable | Active-low output gate; enables data bus drivers during read; tOE = 25 ns (full VCC mode). |
| WE# | Write enable | Active-low write strobe; initiates program/erase commands; latches command sequences into internal state machine. |
| RY/BY# | Ready/Busy indicator | Open-drain status output; low during embedded operations (program/erase), high when ready for next command. |
| RESET# | Hardware reset | Active-low asynchronous reset; forces device into known state and aborts ongoing operations. |
| VCC | Core supply | 3.0 V nominal (2.7–3.6 V); powers core logic, charge pumps, and EAC; independent of VIO. |
| VIO | I/O supply | 1.65–VCC; sets I/O voltage level; allows interface with 1.8 V, 2.5 V, or 3.3 V host processors. |
Key Features
| Feature | Design Value |
|---|---|
| Page Mode Read | 32-byte aligned page access with 15 ns subsequent reads; accelerates sequential instruction fetch in XIP applications. |
| Buffer Programming | Up to 512-byte write buffer; cuts programming time vs. single-word writes, essential for OTA firmware updates. |
| Hardware ECC | On-the-fly single-bit error correction; eliminates need for external ECC logic or software overhead in safety-critical systems. |
| Advanced Sector Protection | Volatile and non-volatile lock bits per 128 kB sector; prevents accidental overwrite of bootloader or calibration data. |
| OTP Array | 1024-byte one-time-programmable region with two independently lockable 512-byte blocks; stores secure keys or device-specific configuration. |
Applications
| Industrial PLC Firmware Storage | Automotive ECU Boot Memory |
|---|---|
Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with <90 ns latency and 20-year data retention. Use Value: Eliminates external RAM copy step during boot; reduces BOM count and power-up delay while meeting IEC 61131-3 runtime requirements. | Use Scenario: Holding ASW-compliant boot code and diagnostic firmware in engine control units certified to AEC-Q100 Grade 3 (–40°C to +85°C). IC Role / Device Role / Timing Role: Safety-relevant boot memory with hardware ECC and sector-level write protection to prevent corruption during voltage transients. Use Value: Meets ISO 26262 ASIL-B functional safety requirements for boot integrity without external error-checking circuitry. |
| Medical Imaging System BIOS | Network Router Boot Flash |
Use Scenario: Hosting BIOS and FPGA configuration bitstreams in portable ultrasound and MRI subsystems requiring high reliability and thermal stability. IC Role / Device Role / Timing Role: Dual-role memory supporting both firmware execution and configuration storage with 100,000-cycle endurance. Use Value: Enables field-upgradable imaging algorithms and calibration tables while maintaining FDA-grade data integrity over 10+ year product lifecycle. | Use Scenario: Storing U-Boot, Linux kernel, and network stack firmware in carrier-grade edge routers deployed in uncontrolled ambient conditions. IC Role / Device Role / Timing Role: High-density parallel boot flash interfaced to ARM Cortex-A series SoCs via 16-bit bus with Versatile I/O support. Use Value: Supports rapid firmware recovery after power loss via RY/BY# monitoring and suspend/resume during remote updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GT10TFI010 | Same density and timing, but automotive AEC-Q100 Grade 2 (–40°C to +105°C); higher temp rating and qualification testing. | Required for under-hood automotive modules where ambient exceeds 85°C. | Select when extended temperature operation and automotive qualification are mandatory. |
| MX29GL128FPTI-90G | 128 Mb (16 MB) density, 90 ns access, no built-in ECC; requires external error handling logic. | Lower-cost option for non-safety-critical consumer gateways with smaller firmware footprints. | Choose only if firmware size ≤16 MB and ECC can be implemented in host software or external logic. |
Compared with S29GL01GT10TFI010, the S29GL01GS10TFI010 trades extended temperature range for lower cost and industrial qualification; versus MX29GL128FPTI-90G, it delivers 8× density, integrated ECC, and faster buffer programming-critical for complex embedded boot architectures.
Availability
S29GL01GS10TFI010 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ECU boot memory, and medical imaging system BIOS requiring stable component supply across multi-year production cycles.
Supply support for S29GL01GS10TFI010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and non-volatile memory solutions for industrial and automotive markets.
The GL-S family targets high-reliability embedded systems needing XIP-capable parallel NOR flash with integrated ECC, sector protection, and wide I/O voltage flexibility for heterogeneous processor interfaces.
FAQ
Does S29GL01GS10TFI010 support execute-in-place (XIP) operation?
Yes. The device supports true asynchronous XIP with 90 ns random access and 15 ns page-mode reads, allowing microcontrollers to execute code directly from flash without copying to RAM. Its MIRRORBIT™ Eclipse architecture and embedded algorithm controller ensure deterministic timing for instruction fetch cycles.
What is the function of the Versatile I/O (VIO) feature?
VIO allows independent setting of I/O voltage between 1.65 V and VCC, enabling direct interface with host processors operating at 1.8 V, 2.5 V, or 3.3 V without level shifters. This reduces board complexity and signal integrity risk in mixed-voltage embedded systems.
How does the 512-byte programming buffer improve firmware update performance?
The buffer allows up to 512 bytes to be loaded before initiating a single embedded program operation, reducing total programming time by ~70% compared to single-word writes. This accelerates field firmware updates and minimizes system downtime during maintenance windows.
Is hardware reset (RESET#) required for reliable power-on initialization?
Yes. Asserting RESET# for ≥100 ns after VCC stabilizes ensures the device enters a known state, clears pending operations, and disables outputs until initialization completes. Skipping hardware reset may result in undefined bus states or failed command execution during cold start.
S29GL01GS10TFI010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL01GS10TFI010 FAQ
1.How can I place an order for S29GL01GS10TFI010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GS10TFI010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GS10TFI010 reliable?
The price and inventory of S29GL01GS10TFI010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS10TFI010 is usually 5 days.
3.What payment methods are accepted for S29GL01GS10TFI010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS10TFI010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GS10TFI010?
S29GL01GS10TFI010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GS10TFI010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GS10TFI010?
For technical support, including S29GL01GS10TFI010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS10TFI010 requirements.
6.How does Aetrix verify that S29GL01GS10TFI010 is sourced from the original manufacturer or authorized distributors?
All S29GL01GS10TFI010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS10TFI010 meets industry standards.
7.What is the process for return or replacement of S29GL01GS10TFI010?
All S29GL01GS10TFI010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS10TFI010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GS10TFI010 part is unused and in its original packaging.
Return procedure for S29GL01GS10TFI010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GS10TFI010 Tags
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