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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL01GS10TFI013

Name: S29GL01GS10TFI013
Brand: Infineon Technologies
SKU: S29GL01GS10TFI013
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL01GS10TFI013

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 56-TFSOP (0.724", 18.40mm Width)

Datasheet:: S29GL01GS10TFI013.pdf

Description:: IC FLASH 1GBIT PARALLEL 56TSOP

Quantity:: RFQ Add To RFQ list

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Inventory:4,346

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Product details

Overview

S29GL01GS10TFI013 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 90 ns random access time, 15 ns page access time, and industrial temperature grade (–40°C to +85°C). It implements MIRRORBIT™ Eclipse 65 nm technology, features 512-byte write buffer, hardware ECC for single-bit correction, and uniform 128 kB sector erase-used in boot code storage and firmware execution in embedded controllers.

For engineers reviewing the S29GL01GS10TFI013 datasheet, S29GL01GS10TFI013 pinout, S29GL01GS10TFI013 application, or S29GL01GS10TFI013 equivalent, key selection factors include asynchronous parallel interface timing, Versatile I/O voltage range (1.65 V to VCC), OTP array support, CFI compliance, and AEC-Q100 grade 3 qualification for automotive control modules.

Technical Context

This device operates as an x16 asynchronous parallel NOR flash, supporting Execute-in-Place (XIP) with fast random read (90 ns) and accelerated page-mode reads (15 ns per word within 32-byte aligned pages). Its embedded algorithm controller handles program/erase operations autonomously, including suspend/resume and status monitoring via RY/BY#, data polling, or status register.

The architecture integrates dedicated erase voltage and programming voltage generators, on-die ECC logic, and sector protection control with volatile/non-volatile locking. It uses word-aligned addressing (A0–A25), supports command-set compatibility with JEDEC-standard CFI, and includes a 1024-byte one-time-programmable (OTP) array split into two lockable regions.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	1 Gb (128 MB) - supports full boot image and application firmware storage in space-constrained embedded systems
Interface	Asynchronous x16 parallel - enables direct CPU bus connection without glue logic or bridge ICs
Access Time	90 ns random / 15 ns page - meets real-time boot latency requirements for industrial PLCs and automotive ECUs
Write Buffer	512-byte (256-word) - reduces effective programming time by >3× vs. single-word writes in firmware update routines
ECC	On-die hardware single-bit correction - eliminates need for external error-handling logic in safety-critical applications
Endurance	100,000 program/erase cycles - ensures reliable field updates over 10+ years of operation in remote telemetry units
Data Retention	20 years at +85°C - guarantees firmware integrity across full industrial temperature lifecycle without refresh

Pinout & Package

Package: 56-pin TSOP (Type I, 400 mil width), compliant with JEDEC MO-142AB. Pinout validated per Infineon datasheet 001-98285 Rev. *U, Section 12.1.

Pin/Terminal	Circuit Role	Design Meaning
A0–A25	Address inputs	Word-aligned addressing (26-bit); A25 active for 1 Gb density; supports linear memory mapping
DQ0–DQ15	Data I/O bus	x16 bidirectional data path; compatible with 16-bit microcontroller buses and FPGA memory interfaces
CE#	Chip enable	Active-low device select; enables low-power standby when deasserted during idle periods
OE#	Output enable	Controls data bus drivers during read; allows shared bus arbitration with other peripherals
WE#	Write enable	Initiates internal program/erase commands; latches address/data on falling edge
RY/BY#	Ready/Busy output	Open-drain status indicator; asserts low during embedded operations to prevent bus contention
VCC	Core supply	3.0 V ±0.3 V (2.7–3.6 V); powers logic, charge pumps, and ECC engine
VIO	I/O supply	1.65 V to VCC; decouples I/O voltage from core for mixed-voltage system interfacing

Key Features

Feature	Design Value
Versatile I/O (VIO)	Independent 1.65–3.6 V I/O rail enables seamless integration with 1.8 V, 2.5 V, or 3.3 V host processors
Hardware ECC	Single-bit error correction implemented in silicon-no software overhead or latency penalty during read cycles
512-byte Write Buffer	Enables burst programming of up to 256 words per command, reducing firmware update time by factor of 3.2× vs. byte-wise writes
Uniform 128 kB Sectors	64 identically sized sectors simplify partitioning for bootloader, OS, and application firmware with deterministic erase boundaries
OTP Array	1024-byte one-time-programmable region with dual lock bits-secures cryptographic keys and calibration data against overwrite

Applications

Automotive Engine Control Unit (ECU)

Industrial Programmable Logic Controller (PLC)

Use Scenario: Storing calibrated fuel injection maps and real-time diagnostic firmware in AEC-Q100 grade 3 ECU.

IC Role / Device Role / Timing Role: Boot ROM and runtime firmware store; provides XIP-capable code execution with ≤90 ns instruction fetch latency.

Use Value: Meets ASIL-B functional safety requirements via on-die ECC, 100K-cycle endurance, and guaranteed 20-year data retention at 85°C.

Use Scenario: Hosting ladder logic interpreter and I/O configuration tables in DIN-rail mounted PLCs operating continuously at 70°C ambient.

IC Role / Device Role / Timing Role: Non-volatile program memory with deterministic erase/write timing for field-upgradable control logic.

Use Value: Uniform 128 kB sectors allow atomic firmware updates without interrupting control loop execution using suspend/resume commands.

Medical Imaging System Boot Loader

Telecom Base Station Firmware Storage

Use Scenario: Secure boot image storage for FDA-cleared MRI subsystem controllers requiring tamper-proof firmware validation.

IC Role / Device Role / Timing Role: Primary boot device with OTP-locked public key for secure boot chain verification.

Use Value: Dual-lock OTP region prevents unauthorized modification of cryptographic keys while maintaining CFI-compliant field reprogramming capability.

Use Scenario: Storing FPGA configuration bitstreams and baseband processing firmware in outdoor 5G remote radio units exposed to thermal cycling.

IC Role / Device Role / Timing Role: High-reliability firmware repository supporting hot-swap updates via buffered programming and sector-level protection.

Use Value: 110 ns max access time under Versatile I/O conditions ensures deterministic timing margins for DDR3/DDR4 memory controller initialization sequences.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL01GS10TFI020	Same die, 64-ball LAE Fortified BGA (9 mm × 9 mm); no TSOP option	Targeted at space-constrained PCBs where 56-pin TSOP footprint is prohibitive	Select for high-density routing or thermal performance needs; requires BGA rework capability
MX29GL128FPTI-90G	128 Mb density, 90 ns access, no hardware ECC, no OTP array, different command set	Limited to non-safety-critical firmware storage where ECC and secure key storage are not required	Choose only if cost sensitivity outweighs reliability and security requirements; not drop-in compatible

Compared with S29GL01GS10TFI013, the TSOP-packaged alternative offers identical functionality in legacy-compatible form factor, while the Macronix part lacks ECC and OTP-making it unsuitable for automotive or medical use where data integrity and secure provisioning are mandatory.

Availability

S29GL01GS10TFI013 is available at Aetrix Electronics and suitable for automotive engine control units, industrial programmable logic controllers, and medical imaging system boot loaders requiring stable component supply across extended product lifecycles.

Supply support for S29GL01GS10TFI013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions for industrial and mission-critical applications.

The GL-S family targets embedded systems needing robust, high-density parallel NOR flash with XIP capability, ECC, and automotive-grade qualification-designed specifically for boot code, firmware, and secure configuration storage in harsh environments.

FAQ

Is S29GL01GS10TFI013 pin-compatible with earlier S29GLxxxS series devices?

Yes-this TSOP-packaged 1 Gb device shares identical pinout and command set with S29GL512S/S29GL256S/S29GL128S in the same 56-pin TSOP package. Address bus width expands to A25 for full 1 Gb addressing, but lower-order pins remain functionally and physically aligned per JEDEC MO-142AB.

Does S29GL01GS10TFI013 support both 1.8 V and 3.3 V I/O interfaces?

Yes-its Versatile I/O feature allows VIO to operate from 1.65 V to VCC (max 3.6 V). When VCC = 3.0 V, VIO may be set to 1.8 V for interfacing with 1.8 V FPGAs or 3.3 V for legacy microcontrollers, with no level-shifting circuitry required.

What is the purpose of the 1024-byte OTP array?

The OTP array provides two independently lockable 512-byte regions for storing immutable data such as asymmetric cryptographic keys, device-specific calibration coefficients, or secure boot manifests. Once locked, contents cannot be erased or rewritten-ensuring permanent integrity of critical security assets.

Can S29GL01GS10TFI013 be used in systems requiring AEC-Q100 Grade 2 qualification?

No-S29GL01GS10TFI013 carries Industrial (–40°C to +85°C) and AEC-Q100 Grade 3 (–40°C to +85°C) qualification only. For Grade 2 (–40°C to +105°C), Infineon offers S29GL01GS11TFI020 in LAE BGA package, which undergoes extended high-temperature stress testing and screening.

S29GL01GS10TFI013 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 56-TFSOP (0.724", 18.40mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 1Gbit

Memory Organization:: 64M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 56-TSOP

S29GL01GS10TFI013 FAQ

1.How can I place an order for S29GL01GS10TFI013 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL01GS10TFI013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL01GS10TFI013 reliable?

The price and inventory of S29GL01GS10TFI013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS10TFI013 is usually 5 days.

3.What payment methods are accepted for S29GL01GS10TFI013?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS10TFI013 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL01GS10TFI013?

S29GL01GS10TFI013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL01GS10TFI013 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL01GS10TFI013?

For technical support, including S29GL01GS10TFI013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS10TFI013 requirements.

6.How does Aetrix verify that S29GL01GS10TFI013 is sourced from the original manufacturer or authorized distributors?

All S29GL01GS10TFI013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS10TFI013 meets industry standards.

7.What is the process for return or replacement of S29GL01GS10TFI013?

All S29GL01GS10TFI013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS10TFI013, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL01GS10TFI013 part is unused and in its original packaging.

Return procedure for S29GL01GS10TFI013:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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