Infineon Technologies S29GL01GS10TFI023
- Part No.:
- S29GL01GS10TFI023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL01GS10TFI023.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 56TSOP
- Quantity:
- Payment:

- Shipping:

Inventory:4,832
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL01GS10TFI023 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 3.0 V core supply, 16-bit data bus, and MIRRORBIT™ Eclipse 65 nm technology. It delivers 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. Designed for embedded boot code storage in industrial control systems requiring high reliability and fast XIP execution.
For engineers reviewing the S29GL01GS10TFI023 datasheet, S29GL01GS10TFI023 pinout, S29GL01GS10TFI023 application, or S29GL01GS10TFI023 equivalent, key selection criteria include its 128-kbyte uniform sector erase, 512-byte programming buffer, Versatile I/O (1.65 V–VCC), AEC-Q100 Grade 3 qualification, and TSOP-56/LAA/LAE/VBU package compatibility.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A25), supporting both standard and page-mode reads. Its embedded algorithm controller handles program/erase operations autonomously, with suspend/resume capability and status reporting via RY/BY#, data polling, and status register.
The architecture integrates on-die ECC logic, sector protection (volatile/non-volatile), and a dedicated 1024-byte OTP array with dual lockable regions. It complies with Common Flash Interface (CFI) v1.4 and supports CFI query for runtime configuration detection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 1 Gb (128 MB); supports full boot image storage for mid-range microcontrollers. |
| Random Access Time | 90 ns at VCC = VIO; enables deterministic XIP execution latency in real-time firmware. |
| Page Access Time | 15 ns; allows rapid sequential reads within 32-byte aligned pages during code fetch bursts. |
| Programming Buffer | 512 bytes; reduces effective programming time by batching up to 256 words per command. |
| ECC Support | On-die hardware single-bit correction; eliminates need for external ECC logic in safety-critical systems. |
| Endurance & Retention | 100,000 program/erase cycles and 20-year data retention; validated for long-life industrial deployments. |
| Operating Temp | –40°C to +85°C (Industrial Grade); qualified per AEC-Q100 Grade 3 for automotive ECUs. |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP-I, Type I), 14 mm × 20 mm, 0.55 mm pitch. Compatible with standard PCB assembly processes and legacy socket designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A25 | Address Inputs | 26-bit address bus; A25 enables full 1 Gb addressing (2²⁶ × 16 bits = 128 MB). |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports word-wide transfers without byte-lane splitting. |
| CE# | Chip Enable | Active-low chip select; controls device participation in bus cycles; tCE = 90 ns max. |
| OE# | Output Enable | Active-low read strobe; gates output drivers; tOE = 25 ns max for timing-critical fetches. |
| WE# | Write Enable | Active-low write strobe; initiates program/erase commands and data latching. |
| RY/BY# | Ready/Busy Output | Open-drain status indicator; low during embedded operations; enables non-polling system synchronization. |
| RESET# | Hardware Reset | Active-low asynchronous reset; aborts ongoing program/erase and returns to read mode. |
| VCC | Core Supply | 3.0 V ±10% supply (2.7–3.6 V); powers core logic, ECC, and embedded algorithms. |
| VIO | I/O Supply | 1.65 V to VCC; decouples I/O voltage from core, enabling mixed-voltage host interfacing. |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous Page Read | 32-byte aligned page access with 15 ns intra-page cycle time-optimizes instruction fetch bandwidth in XIP applications. |
| Versatile I/O Voltage Range | VIO supports 1.65 V–VCC, allowing direct interfacing with 1.8 V, 2.5 V, or 3.3 V controllers without level shifters. |
| Uniform Sector Architecture | 128-kbyte sectors enable granular firmware updates and robust field upgrade partitioning without block fragmentation. |
| Embedded Program/Erase Suspend | Interrupt active program/erase to service high-priority reads; resumes from exact point-critical for real-time OS coexistence. |
| Secure OTP Array | 1024-byte one-time-programmable region with two independent lock bits-stores cryptographic keys or calibration data permanently. |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers with extended temperature operation. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with <90 ns latency. Use Value: Eliminates external RAM copy step; reduces BOM count and power-on initialization time by 35% versus serial flash. | Use Scenario: Holding certified boot code and sensor fusion firmware in camera-based driver assistance modules. IC Role / Device Role / Timing Role: AEC-Q100 Grade 3 qualified parallel NOR flash serving as secure, fast-access boot source for SoC. Use Value: Hardware ECC and sector locking meet ISO 26262 ASIL-B requirements for fault-tolerant startup integrity. |
| Medical Imaging System BIOS | Telecom Base Station Configuration |
Use Scenario: Hosting diagnostic self-test routines and FPGA configuration bitstreams in portable ultrasound devices. IC Role / Device Role / Timing Role: High-reliability firmware repository with 20-year data retention and 100k-cycle endurance. Use Value: Meets IEC 62304 Class C software lifecycle requirements without periodic refresh or backup mechanisms. | Use Scenario: Storing FPGA configuration images and protocol stack parameters in 5G remote radio units operating at –40°C to +85°C. IC Role / Device Role / Timing Role: Industrial-grade parallel flash with Versatile I/O supporting 1.8 V FPGA interface and 128-kbyte sector updates. Use Value: Enables field-upgradable radio firmware with zero downtime via background sector erase and atomic write. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GP10TFI020 | Same density and pinout, but uses older 90 nm process; 110 ns random access vs. 90 ns. | Lacks AEC-Q100 Grade 3 qualification; limited to commercial/industrial temp only. | Select only if cost sensitivity outweighs performance and automotive compliance needs. |
| MX29GL128FPTI-90G | 128 Mbit (16 MB), not 1 Gbit; 90 ns access, but no integrated ECC or OTP array. | Requires external ECC logic and lacks secure key storage-unsuitable for safety-certified designs. | Consider only for legacy 16 MB footprint upgrades where density and security are secondary. |
Compared with S29GL01GP10TFI020 and MX29GL128FPTI-90G, the S29GL01GS10TFI023 uniquely combines 1 Gb density, 90 ns access, on-die ECC, AEC-Q100 Grade 3, and OTP-making it the sole choice for next-gen automotive and industrial XIP systems demanding scalability and functional safety.
Availability
S29GL01GS10TFI023 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system BIOS requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S29GL01GS10TFI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and high-reliability memory solutions for industrial and automotive markets.
The GL-S family targets embedded systems needing fast, secure, and scalable parallel NOR flash-designed specifically for XIP-capable boot memory in safety-critical and long-lifecycle applications.
FAQ
Is S29GL01GS10TFI023 pin-compatible with earlier S29GL01GP variants?
Yes-S29GL01GS10TFI023 shares identical 56-pin TSOP-I pinout and signal definitions with S29GL01GP10TFI020, including A0–A25, DQ0–DQ15, CE#/OE#/WE#, and RY/BY#. No PCB redesign is required for drop-in replacement, though timing margins improve due to faster 90 ns access.
Does this device support 1.8 V I/O interfacing without level shifters?
Yes-its Versatile I/O feature allows VIO from 1.65 V to VCC. With VCC = 3.0 V, VIO can be set to 1.8 V, enabling direct connection to 1.8 V FPGAs or microcontrollers without external voltage translation circuitry.
How is the 1024-byte OTP array protected against accidental overwrite?
The OTP array has two independent lock bits-one for each 512-byte region. Once programmed, each lock bit disables further writes to its region permanently. Locking is irreversible and requires specific unlock-bypass command sequences before programming, preventing inadvertent corruption.
What failure modes does the internal ECC correct, and how is correction reported?
The hardware ECC detects and corrects all single-bit errors per 512-byte sector during read operations. Correction occurs transparently; no software intervention is needed. Uncorrectable multi-bit errors trigger the ECC Status Register bit (ESR[1]), which can be polled or interrupt-driven via RY/BY# assertion.
S29GL01GS10TFI023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL01GS10TFI023 FAQ
1.How can I place an order for S29GL01GS10TFI023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GS10TFI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GS10TFI023 reliable?
The price and inventory of S29GL01GS10TFI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS10TFI023 is usually 5 days.
3.What payment methods are accepted for S29GL01GS10TFI023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS10TFI023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GS10TFI023?
S29GL01GS10TFI023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GS10TFI023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GS10TFI023?
For technical support, including S29GL01GS10TFI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS10TFI023 requirements.
6.How does Aetrix verify that S29GL01GS10TFI023 is sourced from the original manufacturer or authorized distributors?
All S29GL01GS10TFI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS10TFI023 meets industry standards.
7.What is the process for return or replacement of S29GL01GS10TFI023?
All S29GL01GS10TFI023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS10TFI023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GS10TFI023 part is unused and in its original packaging.
Return procedure for S29GL01GS10TFI023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GS10TFI023 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…

