Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL01GS11DHA020

Name: S29GL01GS11DHA020
Brand: Infineon Technologies
SKU: S29GL01GS11DHA020
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: S29GL01GS11DHA020

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL01GS11DHA020.pdf

Description:: IC FLASH 1GBIT CFI 64FBGA

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:2,897

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

S29GL01GS11DHA020 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access and 15 ns page access, and integrates hardware ECC for single-bit error correction-enabling reliable code storage in automotive instrument clusters requiring AEC-Q100 Grade 2 (–40°C to +105°C) operation.

For engineers reviewing the S29GL01GS11DHA020 datasheet, S29GL01GS11DHA020 pinout, S29GL01GS11DHA020 application, or S29GL01GS11DHA020 equivalent, this device supports XIP-capable boot code execution, sector-level erase with suspend/resume, OTP lockable regions, CFI-compliant interface, and Versatile I/O (1.65 V to VCC) for mixed-voltage system integration.

Technical Context

The S29GL01GS11DHA020 implements an asynchronous parallel interface with word-aligned addressing (A0–A25), supporting 32-byte page reads and 512-byte buffer programming. Its embedded algorithm controller (EAC) manages autonomous program/erase operations, status monitoring via RY/BY# pin or status register, and automatic ECC generation/correction during read cycles.

It features uniform 128 kB sectors (1024 total), advanced sector protection (volatile/non-volatile locking), and a dedicated 1024-byte one-time-programmable (OTP) array split into two lockable regions-used for secure boot configuration or calibration data storage in safety-critical automotive ECUs.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory density	1 Gb (128 MB), organized as 8,388,608 × 16-bit words - supports full firmware image storage for mid-tier automotive microcontrollers.
Access time	90 ns random access, 15 ns page access - enables real-time XIP execution of safety-critical boot code without external cache.
Supply voltage	VCC = 2.7–3.6 V; VIO = 1.65 V to VCC - allows direct interfacing with 1.8 V or 3.3 V host processors without level shifters.
Programming buffer	512-byte write buffer - reduces effective programming time by >3× vs. single-word writes, critical for field firmware updates.
ECC capability	On-die hardware single-bit error correction - eliminates need for external ECC logic and improves long-term data integrity in high-temperature environments.
Endurance & retention	100,000 program/erase cycles; 20-year data retention at 85°C - meets ASIL-B functional safety requirements for ECU non-volatile storage.
Operating grade	AEC-Q100 Grade 2 (–40°C to +105°C) - qualified for under-hood automotive applications including engine control and ADAS domain controllers.

Pinout & Package

Package: 64-ball LAE Fortified BGA (9 mm × 9 mm, 0.8 mm pitch). RoHS-compliant, lead-free, moisture sensitivity level 3 (MSL3).

Pin/Terminal	Circuit Role	Design Meaning
A0–A25	Address inputs	26-bit word address bus (A25 active for 1 Gb density); latched on CE# or OE# assertion edge.
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports 1.65–3.6 V I/O voltage via VIO pin; TTL-compatible levels.
CE#	Chip enable	Active-low device select; controls power-down entry and command latch timing (tCE = 100 ns max).
OE#	Output enable	Active-low read strobe; enables output drivers only during valid read cycles (tOE = 35 ns max).
WE#	Write enable	Active-low write strobe; initiates program/erase commands and data latching (tWE = 40 ns min).
RY/BY#	Ready/Busy indicator	Open-drain output; low during internal operations (program/erase), high when ready - enables polling-free status monitoring.
VCC	Core supply	2.7–3.6 V main supply for core logic, charge pumps, and memory array - powers all internal functions.
VIO	I/O supply	1.65–VCC supply for input buffers and output drivers - decouples I/O voltage from core, enabling mixed-voltage designs.
RESET#	Hardware reset	Active-low asynchronous reset; forces device into reading state and clears internal command registers.

Key Features

Feature	Design Value
Asynchronous page read	32-byte aligned page access with 15 ns cycle time - accelerates sequential instruction fetch in XIP mode without burst clocking.
Buffered programming	Up to 512 bytes per program operation - cuts firmware update time by minimizing command overhead and bus arbitration latency.
Hardware ECC	Single-bit error correction with no software intervention - ensures deterministic read reliability in radiation-prone or thermally stressed environments.
Advanced sector protection	Volatile (SRAM-based) and non-volatile (flash-based) locking per 128 kB sector - enables secure boot partitioning and runtime firmware write-protection.
OTP array	1024-byte one-time-programmable region with dual lock bits - stores immutable cryptographic keys or calibration constants resistant to field reprogramming.

Applications

Automotive Instrument Cluster

ADAS Domain Controller Boot Memory

Use Scenario: Stores boot firmware, GUI assets, and driver calibration tables for digital dashboards operating continuously at 105°C ambient.

IC Role / Device Role / Timing Role: Primary XIP-capable code storage with AEC-Q100 Grade 2 qualification and hardware ECC for ASIL-B compliance.

Use Value: Eliminates external ECC logic and enables deterministic boot timing due to 90 ns random access and 15 ns page mode performance.

Use Scenario: Holds safety-critical boot loader and sensor fusion firmware in radar/vision domain controllers exposed to thermal cycling.

IC Role / Device Role / Timing Role: Non-volatile boot memory with suspend/resume erase capability and OTP-secured key storage for secure boot chain.

Use Value: Supports over-the-air (OTA) firmware updates via 512-byte buffered programming while maintaining data integrity across 100,000+ cycles.

Industrial PLC Firmware Storage

Medical Imaging System Configuration Memory

Use Scenario: Retains ladder logic programs and I/O mapping tables in programmable logic controllers deployed in factory-floor enclosures (–40°C to +85°C).

IC Role / Device Role / Timing Role: High-reliability parallel NOR flash with CFI interface for legacy controller compatibility and field-serviceable firmware upgrades.

Use Value: Enables hot-swap firmware replacement using sector erase with suspend/resume - avoids system downtime during maintenance.

Use Scenario: Stores DICOM configuration profiles, calibration matrices, and regulatory audit logs in FDA-cleared imaging equipment with 20-year data retention requirement.

IC Role / Device Role / Timing Role: Secure, long-life non-volatile memory with OTP lockable regions for immutable regulatory data and ECC-protected operational parameters.

Use Value: Meets IEC 62304 Class C software lifecycle requirements through 20-year retention and hardware-assisted error correction.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL01GS10TFI020	Same 1 Gb density and 65 nm process, but TSOP-56 package (not BGA) and Industrial grade (–40°C to +85°C).	Lacks AEC-Q100 qualification and Versatile I/O; limited to board-space-tolerant industrial systems without under-hood thermal stress.	Select when cost-sensitive industrial designs require pin-compatible drop-in replacement without automotive qualification.
MX29GL128FHI-90G	128 Mb (not 1 Gb), 90 ns access, 3.3 V only (no Versatile I/O), no integrated ECC, 55 nm process.	Lower density and no hardware ECC limits use to non-safety-critical legacy systems where firmware size <16 MB and error resilience is handled externally.	Select only for backward-compatible upgrades in existing 128 Mb–based platforms where BGA footprint and ECC are not required.

Compared with S29GL01GS11DHA020, the TSOP variant trades automotive qualification and BGA miniaturization for lower assembly cost, while the MX29GL128F lacks both density scalability and on-die ECC-making the S29GL01GS11DHA020 uniquely suited for new AEC-Q100-compliant, high-integrity automotive firmware storage.

Availability

S29GL01GS11DHA020 is available at Aetrix Electronics and suitable for automotive instrument clusters, ADAS domain controllers, industrial PLCs, and medical imaging systems requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for S29GL01GS11DHA020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and R&D infrastructure.

The GL-S family targets automotive and industrial embedded systems requiring high-density, high-reliability parallel NOR flash with AEC-Q100 qualification, XIP capability, and integrated data integrity features.

FAQ

What is the purpose of the Versatile I/O (VIO) pin on the S29GL01GS11DHA020?

The VIO pin supplies independent voltage (1.65 V to VCC) to input buffers and output drivers, enabling direct interface with host processors operating at 1.8 V, 2.5 V, or 3.3 V without external level shifters. This decouples I/O signaling from core logic voltage, simplifying mixed-voltage board design and reducing BOM count in automotive gateways and domain controllers.

Does the S29GL01GS11DHA020 support true XIP (execute-in-place) operation?

Yes-it supports true XIP via asynchronous 16-bit parallel interface with 90 ns random access and 15 ns page mode timing, allowing microcontrollers to fetch and execute code directly from flash without loading into RAM. The device's fast initial access and low-latency intra-page reads meet real-time deterministic timing requirements for ASIL-B boot sequences.

How does the hardware ECC function during normal read operations?

Hardware ECC operates transparently during every read: on-die circuitry detects and corrects single-bit errors in real time using stored parity bits, with no CPU intervention or latency penalty. Uncorrectable multi-bit errors trigger status register flags (ECC_FAIL bit), enabling host firmware to initiate recovery-ensuring data integrity without software overhead in safety-critical applications.

Can the OTP array be used for storing cryptographic keys in secure boot implementations?

Yes-the 1024-byte OTP array is divided into two independently lockable regions; once locked, contents cannot be erased or rewritten. This makes it suitable for storing immutable root-of-trust keys, hash digests, or certificate fingerprints in secure boot chains compliant with ISO/SAE 21434 and UNECE R155 requirements for automotive cybersecurity.

S29GL01GS11DHA020 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: -

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR (SLC)

Memory Size:: 1Gbit

Memory Organization:: 128M x 8

Memory Interface:: CFI

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 110 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: Automotive

Qualification:: AEC-Q100

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (9x9)

S29GL01GS11DHA020 FAQ

1.How can I place an order for S29GL01GS11DHA020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL01GS11DHA020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL01GS11DHA020 reliable?

The price and inventory of S29GL01GS11DHA020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS11DHA020 is usually 5 days.

3.What payment methods are accepted for S29GL01GS11DHA020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS11DHA020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL01GS11DHA020?

S29GL01GS11DHA020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL01GS11DHA020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL01GS11DHA020?

For technical support, including S29GL01GS11DHA020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS11DHA020 requirements.

6.How does Aetrix verify that S29GL01GS11DHA020 is sourced from the original manufacturer or authorized distributors?

All S29GL01GS11DHA020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS11DHA020 meets industry standards.

7.What is the process for return or replacement of S29GL01GS11DHA020?

All S29GL01GS11DHA020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS11DHA020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL01GS11DHA020 part is unused and in its original packaging.

Return procedure for S29GL01GS11DHA020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

2026-08-11 LDO Regulator: Dropout Voltage, Noise, PSRR and Power Dissipation

LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…

2026-08-06 Conditional Access Module: CAM, CI/CI+ and DVB Security

Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…

2026-08-03 Electronic Component Obsolescence: EOL Risks, Replacement Options and Last-Time Buy Strategy

Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.