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Infineon Technologies S29GL01GS11DHA023

Name: S29GL01GS11DHA023
Brand: Infineon Technologies
SKU: S29GL01GS11DHA023
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL01GS11DHA023

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL01GS11DHA023.pdf

Description:: IC FLASH 1GBIT CFI 64FBGA

Quantity:: RFQ Add To RFQ list

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Product details

Overview

S29GL01GS11DHA023 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It operates across industrial temperature range (–40°C to +85°C) and supports sector erase of uniform 128-kbyte blocks in embedded boot code storage applications.

For engineers reviewing the S29GL01GS11DHA023 datasheet, S29GL01GS11DHA023 pinout, S29GL01GS11DHA023 application, or S29GL01GS11DHA023 equivalent, key selection criteria include its 512-byte write buffer throughput (1.5 MBps), Versatile I/O support (1.65–3.6 V), CFI-compliant interface, and AEC-Q100 grade 3 qualification for automotive infotainment firmware storage.

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A25), supporting both standard read and 32-byte page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations autonomously, including suspend/resume capability and status reporting via status register, data polling, or RY/BY# pin.

The MIRRORBIT™ Eclipse architecture on 65-nm process enables simultaneous bit-line sensing for faster access and higher density. Internal hardware ECC performs real-time single-bit correction during read cycles without CPU intervention, and the 1024-byte OTP array includes two lockable regions for secure boot configuration storage.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	1 Gb (128 MB), organized as 8,388,608 × 16-bit words - supports full firmware image storage in resource-constrained microcontrollers.
Random Access Time	90 ns at VCC = VIO - enables direct XIP execution from flash with minimal CPU stall cycles.
Page Access Time	15 ns - accelerates sequential instruction fetch within 32-byte aligned pages.
Write Buffer Size	512 bytes (256 words) - reduces effective programming time by batching writes, critical for field firmware updates.
ECC Capability	Single-bit error correction per 512-byte sector - ensures data integrity without external error-handling logic.
Endurance & Retention	100,000 program/erase cycles; 20-year data retention - meets long-life requirements for industrial control and automotive ECUs.
Operating Voltage	VCC: 2.7–3.6 V; VIO: 1.65–VCC - allows interoperability with mixed-voltage SoC interfaces (e.g., 1.8 V I/O with 3.3 V core).
Temperature Grade	Industrial (–40°C to +85°C) - qualified for deployment in factory automation and telematics modules without derating.

Pinout & Package

Package: 56-pin TSOP (Type I, 400 mil width), JEDEC standard footprint compatible with legacy flash socket designs and automated PCB assembly.

Pin/Terminal	Circuit Role	Design Meaning
A0–A25	Address Inputs	26-bit word-aligned address bus (A25 valid for 1 Gb density); no byte addressing - simplifies address decoding in 16-bit microcontroller buses.
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports high-speed page reads and buffered writes without external latch.
CE#	Chip Enable	Active-low chip select; tCE = 90 ns - defines minimum latency between chip selection and valid data output.
OE#	Output Enable	Active-low read strobe; tOE = 25 ns - controls timing of data bus drive during asynchronous reads.
WE#	Write Enable	Active-low write strobe; initiates internal program/erase algorithms when combined with command sequences.
RY/BY#	Ready/Busy Output	Open-drain status indicator; low during embedded operations - enables hardware flow control without polling overhead.
RESET#	Hardware Reset	Active-low asynchronous reset; forces device into standby and clears internal state - required for power-cycle recovery.
WP#	Write Protect	Hardware sector protection enable; disables program/erase when asserted - prevents accidental firmware corruption.

Key Features

Feature	Design Value
Asynchronous Page Read	32-byte aligned page access with 15 ns cycle time - improves instruction fetch bandwidth over standard random access.
512-Byte Programming Buffer	Enables single-command programming of up to 512 bytes - cuts firmware update time by >4× vs. byte-by-byte writes.
Hardware ECC Engine	On-the-fly single-bit correction per 512-byte sector - eliminates need for software ECC routines and associated CPU load.
Uniform 128-KB Sector Erase	64 identically sized sectors across full memory map - simplifies partitioning for bootloader, OS, and application firmware zones.
CFI Parameter Table	Standardized JEDEC-compliant descriptor block - enables automatic driver detection and configuration in U-Boot and Linux MTD subsystems.
Versatile I/O Voltage	VIO range 1.65–3.6 V independent of VCC - supports direct interfacing with 1.8 V, 2.5 V, or 3.3 V SoC I/O rails without level shifters.

Applications

Automotive Instrument Cluster

Industrial PLC Firmware Storage

Use Scenario: Storing calibrated gauge graphics, CAN message lookup tables, and boot firmware in digital dashboards.

IC Role / Device Role / Timing Role: Non-volatile XIP-capable boot memory mapped directly to ARM Cortex-M7 instruction bus.

Use Value: 90 ns random access enables zero-wait-state execution; AEC-Q100 grade 3 qualification ensures reliability under thermal cycling and EMI stress.

Use Scenario: Holding ladder logic runtime images, I/O configuration profiles, and safety-critical firmware patches in modular controllers.

IC Role / Device Role / Timing Role: Parallel-connected firmware repository accessed via 16-bit microcontroller bus during cold start and field updates.

Use Value: 100,000 erase cycles and 20-year retention meet IEC 61508 SIL-3 longevity requirements for unattended operation.

Medical Imaging Bootloader

Avionics Display System

Use Scenario: Secure storage of FPGA configuration bitstreams and diagnostic self-test routines in portable ultrasound units.

IC Role / Device Role / Timing Role: OTP-protected boot loader memory with hardware write protection for regulatory compliance (IEC 62304 Class C).

Use Value: Two-lockable 512-byte OTP regions prevent unauthorized modification of boot vector and cryptographic keys.

Use Scenario: Storing display firmware, font assets, and ARINC 661 widget definitions in certified cockpit displays.

IC Role / Device Role / Timing Role: High-reliability parallel flash serving as primary firmware store for DO-254 Level A hardware design.

Use Value: Hardware ECC and sector-level erase granularity ensure deterministic update timing and fault containment per DAL-A requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL01GP11DHA023	Same density and timing, but uses 64-ball LAE BGA (9 mm × 9 mm) instead of 56-pin TSOP - smaller footprint, higher I/O density.	Preferred for space-constrained avionics modules where board area is premium and reflow compatibility is assured.	Select when PCB layout prioritizes miniaturization over socket-based serviceability and legacy test fixture reuse.
MX29GL128FDTI-90G	128 Mb (not 1 Gb), 90 ns access, 3.0 V, but lacks hardware ECC and OTP array - requires external error handling and secure boot management.	Suitable for cost-sensitive consumer gateways where firmware size <16 MB and ECC is implemented in software.	Choose only if memory density requirement is ≤128 Mb and system-level ECC can be added in host processor firmware.

Compared with S29GL01GP11DHA023, this TSOP variant offers easier prototyping and field replacement; versus MX29GL128FDTI-90G, it delivers 8× density, built-in ECC, and OTP security - essential for safety-critical firmware storage where bit errors or tampering must be prevented at the hardware level.

Availability

S29GL01GS11DHA023 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLC firmware storage, and medical imaging bootloader applications requiring stable component supply across extended product lifecycles.

Supply support for S29GL01GS11DHA023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and non-volatile memory solutions for mission-critical systems.

The GL-S family targets high-reliability embedded applications demanding fast XIP performance, robust data integrity, and long-term firmware storage - especially in automotive, industrial, and medical electronics where qualification and endurance are mandatory.

FAQ

Is S29GL01GS11DHA023 pin-compatible with earlier S29GL01Gxxx TSOP variants?

Yes - it maintains identical 56-pin TSOP pinout, signal assignment, and timing behavior with prior S29GL01Gxxx revisions. Address lines A0–A25, data bus DQ0–DQ15, and control signals CE#, OE#, WE#, RY/BY#, RESET#, and WP# occupy the same physical pins and function identically per datasheet Rev. *U. No PCB redesign is needed for drop-in replacement.

Does this part support both VCC = VIO and Versatile I/O modes?

Yes - it operates in dual voltage mode: when VIO = VCC (3.0 V), it achieves 90 ns random access; when VIO = 1.8 V (within 1.65–VCC range), it enters Versatile I/O mode with 100 ns access. The device automatically adapts I/O drive strength and input thresholds based on VIO voltage without external configuration.

How is hardware ECC triggered and verified during normal operation?

ECC is fully automatic and transparent: on every read access, the internal engine checks each 512-byte sector and corrects single-bit errors in real time. Correction status is reported via bit 15 of the status register (ECCERR flag). No host software intervention or additional read commands are required - correction occurs before data appears on DQ lines.

What sector protection methods are available beyond WP# pin assertion?

In addition to hardware write protection via WP#, the device supports Advanced Sector Protection (ASP) using volatile (SRAM-based) and non-volatile (flash-based) lock bits per 128-kB sector. These can be set/cleared via CFI command sequences and persist through power cycles when programmed non-volatily - enabling fine-grained, field-updatable firmware partitioning.

S29GL01GS11DHA023 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: -

Package/Case:: 64-LBGA

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 1Gbit

Memory Organization:: 128M x 8

Memory Interface:: CFI

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 110 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (9x9)

S29GL01GS11DHA023 FAQ

1.How can I place an order for S29GL01GS11DHA023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL01GS11DHA023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL01GS11DHA023 reliable?

The price and inventory of S29GL01GS11DHA023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS11DHA023 is usually 5 days.

3.What payment methods are accepted for S29GL01GS11DHA023?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS11DHA023 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL01GS11DHA023?

S29GL01GS11DHA023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL01GS11DHA023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL01GS11DHA023?

For technical support, including S29GL01GS11DHA023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS11DHA023 requirements.

6.How does Aetrix verify that S29GL01GS11DHA023 is sourced from the original manufacturer or authorized distributors?

All S29GL01GS11DHA023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS11DHA023 meets industry standards.

7.What is the process for return or replacement of S29GL01GS11DHA023?

All S29GL01GS11DHA023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS11DHA023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL01GS11DHA023 part is unused and in its original packaging.

Return procedure for S29GL01GS11DHA023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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