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Infineon Technologies S29GL01GS11DHAV20

Name: S29GL01GS11DHAV20
Brand: Infineon Technologies
SKU: S29GL01GS11DHAV20
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL01GS11DHAV20

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL01GS11DHAV20.pdf

Description:: IC FLASH 1GBIT PARALLEL 64FBGA

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Product details

Overview

S29GL01GS11DHAV20 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It supports uniform 128-kbyte sector erase, 512-byte buffer programming, and operates across industrial temperature range (–40°C to +85°C) in 56-pin TSOP package.

For engineers reviewing the S29GL01GS11DHAV20 datasheet, S29GL01GS11DHAV20 pinout, S29GL01GS11DHAV20 application, or S29GL01GS11DHAV20 equivalent, key selection criteria include asynchronous parallel interface timing, Versatile I/O voltage support (1.65–VCC), OTP array security, CFI compliance, and AEC-Q100 grade 3 qualification for automotive control modules.

Technical Context

This device implements MIRRORBIT™ Eclipse architecture on 65-nm process, enabling simultaneous storage of two bits per cell while maintaining NOR-like random read performance. Its embedded algorithm controller (EAC) manages autonomous program/erase operations, status monitoring via RY/BY# pin or status register, and suspend/resume capability for both programming and erasing.

The flash integrates dedicated hardware ECC logic that detects and corrects single-bit errors on-the-fly during read cycles without software intervention. Sector protection includes volatile (lock bits) and non-volatile (ASP) methods, and the 1024-byte OTP array supports two independently lockable regions for secure boot code or calibration data storage.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	1 Gb (128 MB) - supports full firmware images for mid-tier microcontrollers and boot loaders in resource-constrained systems.
Interface	Parallel ×16 asynchronous - enables direct XIP execution and high-bandwidth data reads without serial protocol overhead.
Access Time	90 ns random / 15 ns page - allows fast instruction fetch and efficient burst reads within aligned 32-byte pages.
Programming Buffer	512 bytes - reduces effective programming time by batching up to 256 words per command, improving firmware update throughput.
ECC	Hardware single-bit correction - ensures data integrity over 20-year retention without host-side ECC software or additional memory overhead.
Endurance	100,000 program/erase cycles - suitable for field-upgradable applications requiring frequent firmware patching or configuration updates.
Temperature Range	–40°C to +85°C (Industrial grade) - validated for deployment in industrial HMIs, motor drives, and automotive body control modules.

Pinout & Package

Package: 56-pin Thin Small Outline Package (TSOP), Type I, 14 mm × 20 mm, 0.5 mm pitch, JEDEC MO-141AC compliant.

Pin/Terminal	Circuit Role	Design Meaning
A0–A25	Address inputs	26-bit address bus supporting full 128-MB addressing space (A25 = MSB for 1 Gb density).
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports Versatile I/O with VIO = 1.65–VCC for mixed-voltage system interfacing.
CE#	Chip enable	Active-low chip select; controls device power state and enables multi-chip memory expansion.
OE#	Output enable	Active-low read strobe; gates output drivers to prevent bus contention during shared-memory access.
WE#	Write enable	Active-low write strobe; initiates internal program/erase algorithms when combined with command sequences.
RY/BY#	Ready/Busy indicator	Open-drain output signaling active embedded operation; used for hardware polling instead of software status register reads.
WP#	Write protect	Hardware sector protection override; disables program/erase commands when asserted low.
VCC	Core supply	3.0 V ±10% supply powering logic, memory array, and embedded controllers; supports single-supply operation.
VIO	I/O supply	Independent 1.65–3.6 V supply for DQ and control pins - enables interfacing with 1.8 V, 2.5 V, or 3.3 V hosts.
RESET#	Hardware reset	Active-low asynchronous reset; forces device into known state and aborts ongoing program/erase operations.

Key Features

Feature	Design Value
Page mode read	32-byte aligned page access with 15 ns cycle time - accelerates sequential instruction fetch and data streaming in XIP applications.
Buffer programming	Up to 512 bytes per command - cuts typical firmware programming time by >4× vs. single-word writes.
Hardware ECC	On-die single-bit error correction - eliminates need for external ECC RAM or host CPU cycles for error handling.
Advanced sector protection	Volatile and non-volatile lock bits per 128-kB sector - enables flexible, field-updatable security policies for boot and application partitions.
OTP array	1024-byte one-time-programmable region with two lockable zones - stores immutable keys, calibration data, or device-specific identifiers.

Applications

Automotive Engine Control Unit

Industrial PLC Firmware Storage

Use Scenario: Storing calibrated engine maps, diagnostic routines, and bootloader code in ECU mainboard.

IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP capability and AEC-Q100 Grade 3 qualification.

Use Value: 90 ns random access enables real-time instruction execution; hardware ECC ensures reliability over 15+ year vehicle lifetime.

Use Scenario: Holding firmware, configuration tables, and safety-critical logic in programmable logic controller mainboards.

IC Role / Device Role / Timing Role: High-reliability parallel flash for deterministic boot and runtime code execution in harsh industrial environments.

Use Value: 100,000 erase cycles support frequent field updates; 128-kB uniform sectors simplify partitioning of firmware and parameter storage.

Medical Imaging System Boot Memory

Avionics Display Controller Code Storage

Use Scenario: Hosting boot ROM and FPGA configuration bitstreams in MRI/CT scanner subsystems.

IC Role / Device Role / Timing Role: Secure, radiation-tolerant (industrial-grade) code storage with OTP-protected calibration constants.

Use Value: Two-lock OTP regions isolate factory-set calibration data from field-updatable application code.

Use Scenario: Storing display firmware, font assets, and graphics initialization code in cockpit display units.

IC Role / Device Role / Timing Role: Low-latency parallel flash enabling rapid boot (<500 ms) and deterministic frame rendering startup.

Use Value: Page mode read (15 ns) accelerates loading of display assets; Versatile I/O supports 2.5 V GPU interface voltage.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL01GS10DHIV20	Same density and package, but rated for Industrial Plus (–40°C to +105°C); 100 ns random access (vs. 90 ns).	Required for extended-temperature industrial control cabinets or under-hood automotive modules.	Select when ambient operating temperature exceeds +85°C; otherwise, S29GL01GS11DHAV20 offers faster access at lower cost.
MX29GL128FPTI-90G	128 Mb (16 MB), not 1 Gb; 90 ns access; no integrated hardware ECC; different command set and CFI layout.	Only suitable for legacy designs with smaller firmware footprints and no ECC requirement.	Not a drop-in replacement; requires firmware rework, reduced density, and external error handling.

Compared with S29GL01GS10DHIV20 and MX29GL128FPTI-90G, the S29GL01GS11DHAV20 uniquely balances 1-Gb capacity, 90 ns speed, hardware ECC, and industrial-grade thermal compliance-making it optimal for new designs requiring future-proof firmware scalability and data integrity assurance.

Availability

S29GL01GS11DHAV20 is available at Aetrix Electronics and suitable for automotive engine control units, industrial PLCs, medical imaging subsystems, and avionics display controllers requiring stable component supply across long production lifecycles.

Supply support for S29GL01GS11DHAV20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q100.

The GL-S family targets embedded systems needing robust, high-density parallel NOR flash with XIP capability, ECC, and automotive qualification-designed specifically for mission-critical firmware storage where data integrity and deterministic timing are non-negotiable.

FAQ

Does S29GL01GS11DHAV20 support execute-in-place (XIP) operation?

Yes. The device supports true XIP operation due to its asynchronous parallel interface, 90 ns random access time, and page-mode read capability. It delivers instructions directly to the processor without requiring data copying to RAM, enabling deterministic boot and real-time code execution in automotive and industrial controllers.

What is the function of the VIO pin, and how does it differ from VCC?

VIO supplies power to all input/output buffers (DQ0–DQ15, CE#, OE#, WE#, etc.), allowing independent voltage selection between 1.65 V and VCC. VCC powers the core logic and memory array at 2.7–3.6 V. This separation enables interoperability with 1.8 V or 2.5 V host processors while maintaining full 3.0 V core performance and reliability.

How is the 1024-byte OTP array structured and secured?

The OTP array consists of one 1024-byte block divided into two 512-byte lockable regions. Each region can be permanently locked via dedicated command sequences, preventing further writes. Once locked, contents remain readable but cannot be altered-even after power cycles-ensuring permanent storage of cryptographic keys or calibration data.

Can S29GL01GS11DHAV20 replace older S29GLxxxP-series flash devices?

No. The GL-S series uses a different command set, CFI structure, and timing parameters than the legacy GL-P series. Pin compatibility does not imply functional equivalence. Migration requires validation of command sequences, status register interpretation, and timing margins-especially for suspend/resume and ECC reporting behavior.

S29GL01GS11DHAV20 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 1Gbit

Memory Organization:: 64M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 110 ns

Voltage - Supply:: 1.65V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: Automotive

Qualification:: AEC-Q100

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (9x9)

S29GL01GS11DHAV20 FAQ

1.How can I place an order for S29GL01GS11DHAV20 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL01GS11DHAV20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL01GS11DHAV20 reliable?

The price and inventory of S29GL01GS11DHAV20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS11DHAV20 is usually 5 days.

3.What payment methods are accepted for S29GL01GS11DHAV20?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS11DHAV20 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL01GS11DHAV20?

S29GL01GS11DHAV20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL01GS11DHAV20 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL01GS11DHAV20?

For technical support, including S29GL01GS11DHAV20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS11DHAV20 requirements.

6.How does Aetrix verify that S29GL01GS11DHAV20 is sourced from the original manufacturer or authorized distributors?

All S29GL01GS11DHAV20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS11DHAV20 meets industry standards.

7.What is the process for return or replacement of S29GL01GS11DHAV20?

All S29GL01GS11DHAV20 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS11DHAV20, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL01GS11DHAV20 part is unused and in its original packaging.

Return procedure for S29GL01GS11DHAV20:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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