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Infineon Technologies S29GL01GS11DHAV23
- Part No.:
- S29GL01GS11DHAV23
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GS11DHAV23.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,293
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Product details
Overview
S29GL01GS11DHAV23 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It operates across industrial temperature range (–40°C to +85°C) and supports sector erase of uniform 128-kbyte sectors in embedded boot code storage applications.
For engineers reviewing the S29GL01GS11DHAV23 datasheet, S29GL01GS11DHAV23 pinout, S29GL01GS11DHAV23 application, or S29GL01GS11DHAV23 equivalent, key selection criteria include asynchronous 16-bit parallel interface timing, Versatile I/O voltage support (1.65 V to VCC), 512-byte programming buffer throughput (1.5 MBps), OTP array security, and AEC-Q100 grade 3 qualification for automotive control modules.
Technical Context
This device implements MIRRORBIT™ Eclipse architecture on 65 nm process, enabling simultaneous read/write operations via suspend/resume commands and supporting execute-in-place (XIP) execution from flash. Its embedded algorithm controller (EAC) manages autonomous program/erase sequences without host intervention.
The flash uses word-aligned addressing (A0–A25), 32-byte page reads, and dual-voltage I/O (VIO independent from VCC), allowing interoperability with 1.8 V or 3.3 V logic systems while maintaining full 16-bit data path integrity and CFI-compliant parameter table access.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 1 Gb (128 MB) - supports full boot image + firmware partitioning in resource-constrained microcontrollers |
| Interface | Asynchronous parallel ×16 - enables direct MPU/NPU connection without glue logic or bridge ICs |
| Access Time | 90 ns random / 15 ns page - meets real-time boot latency requirements for industrial PLCs and automotive ECUs |
| Programming Buffer | 512 bytes - reduces average write time by 4× vs. single-word programming in firmware update routines |
| ECC | Hardware single-bit correction - eliminates need for external error-handling software in safety-critical storage |
| Endurance | 100,000 program/erase cycles - supports field firmware updates over 10+ years in deployed gateways |
| Data Retention | 20 years at 85°C - ensures reliable operation in under-hood automotive environments without refresh |
Pinout & Package
Package: 64-ball LAE Fortified BGA (9 mm × 9 mm, 0.8 mm pitch). RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A25 | Address inputs | Word-aligned address bus (26-bit); A25 active for 1 Gb density addressing |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports 1.65–3.6 V I/O voltage (VIO) |
| CE# | Chip enable | Active-low chip select; controls device power state and bus contention |
| OE# | Output enable | Active-low read strobe; gates output drivers during asynchronous read cycles |
| WE# | Write enable | Active-low write strobe; initiates command latching and embedded program/erase sequences |
| RY/BY# | Ready/Busy | Open-drain status indicator; signals completion of internal operations without polling |
| WP# | Write protect | Hardware sector lock override; disables program/erase when asserted low |
| VCC | Core supply | 3.0 V ±0.3 V core power; powers logic, charge pumps, and ECC engine |
| VIO | I/O supply | Independent 1.65–3.6 V I/O rail; decouples interface voltage from core for mixed-voltage systems |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O | VIO independently configurable from 1.65 V to VCC - enables seamless integration with 1.8 V FPGAs and 3.3 V MCUs |
| 512-byte programming buffer | 1.5 MBps effective write rate - accelerates firmware patching in OTA update workflows |
| Uniform 128-kB sectors | 1024 individually erasable sectors - allows fine-grained firmware partitioning and secure recovery image storage |
| OTP array | 1024-byte one-time-programmable region with two lockable zones - stores cryptographic keys and calibration data permanently |
| ASP protection | Volatile/non-volatile sector locking - prevents accidental overwrite during field service or debug sessions |
Applications
| Automotive Engine Control Unit (ECU) | Industrial Programmable Logic Controller (PLC) |
|---|---|
Use Scenario: Storing boot loader, safety-critical firmware, and calibration maps in diesel/gasoline engine management systems. IC Role / Device Role / Timing Role: Non-volatile XIP-capable boot memory with deterministic 90 ns access for real-time startup sequence. Use Value: AEC-Q100 Grade 3 qualification and 20-year data retention ensure reliability across vehicle lifetime without refresh. | Use Scenario: Hosting ladder logic runtime, I/O configuration tables, and firmware updates in factory automation controllers. IC Role / Device Role / Timing Role: High-density parallel flash providing fast read access for deterministic scan-cycle execution. Use Value: 128-kB uniform sectors allow isolated firmware rollback and secure field update partitioning. |
| Medical Diagnostic Imaging System | Avionics Flight Management Computer |
Use Scenario: Storing FPGA configuration bitstreams, image processing algorithms, and regulatory compliance logs. IC Role / Device Role / Timing Role: Secure, ECC-protected storage for certified medical firmware with traceable revision history. Use Value: Hardware ECC and OTP array meet IEC 62304 Class C software safety requirements for data integrity. | Use Scenario: Boot code and navigation database storage in DO-254-certified flight control hardware. IC Role / Device Role / Timing Role: Radiation-tolerant (tested per AEC-Q100) non-volatile memory with guaranteed 100K endurance for mission-critical updates. Use Value: Suspend/resume capability enables safe mid-erase interruption during airborne system reconfiguration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GS10DHIV23 | Same density and package, but rated for industrial-plus (–40°C to +105°C) temperature range | Required for extended-temperature industrial gateways or under-hood automotive modules beyond Grade 3 | Select when ambient operating temperature exceeds +85°C |
| MX29GL128FHI-90G | 128 Mb density (1/8 capacity), 90 ns access, no integrated ECC, different command set | Limited to non-safety-critical firmware storage where ECC and high endurance are not mandated | Choose only if cost sensitivity outweighs reliability and longevity requirements |
Compared with S29GL01GS10DHIV23, this part trades extended temperature rating for lower cost in standard industrial use; versus MX29GL128FHI-90G, it delivers 8× higher density, hardware ECC, and 10× greater endurance-critical for automotive and medical firmware integrity.
Availability
S29GL01GS11DHAV23 is available at Aetrix Electronics and suitable for automotive ECU design, industrial PLC firmware storage, and medical imaging system boot code deployment requiring stable component supply across multi-year production cycles.
Supply support for S29GL01GS11DHAV23 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global R&D and manufacturing infrastructure.
The GL-S family targets high-reliability embedded systems requiring deterministic boot performance, long-term data retention, and functional safety compliance-designed specifically for automotive, industrial, and medical applications demanding AEC-Q100 or IEC 62304 certification.
FAQ
What is the maximum operating frequency supported by S29GL01GS11DHAV23?
S29GL01GS11DHAV23 is an asynchronous parallel flash device with no clock input; its speed is defined by access times-not frequency. Maximum effective throughput is determined by 90 ns random access and 15 ns page-mode timing, enabling up to ~11 MBps read bandwidth in burst page mode with optimized address sequencing.
Does S29GL01GS11DHAV23 support both 1.8 V and 3.3 V I/O interfaces?
Yes. The device implements Infineon's Versatile I/O feature: VIO can be independently set from 1.65 V to VCC (2.7–3.6 V), allowing direct interfacing with 1.8 V FPGAs or 3.3 V microcontrollers without level shifters-verified in datasheet Section 8.3 and Table 10.5.
How is the 1024-byte OTP array structured and accessed?
The OTP array consists of two separately lockable 512-byte regions. Access requires issuing the CFI query command followed by specific unlock-bypass sequences; once locked (via dedicated OTP lock bits), regions become permanently read-only-detailed in Sections 2.7 and 3.3 of the datasheet.
Can S29GL01GS11DHAV23 replace older S29GL01GP devices in existing designs?
No direct drop-in replacement: S29GL01GS uses updated MIRRORBIT™ Eclipse architecture, different command set (e.g., new suspend/resume opcodes), and revised timing parameters. Pin compatibility exists, but firmware and timing margins must be revalidated per Section 5.4 and Table 11.4 of the datasheet.
S29GL01GS11DHAV23 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL01GS11DHAV23 FAQ
1.How can I place an order for S29GL01GS11DHAV23 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GS11DHAV23 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GS11DHAV23 reliable?
The price and inventory of S29GL01GS11DHAV23 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS11DHAV23 is usually 5 days.
3.What payment methods are accepted for S29GL01GS11DHAV23?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS11DHAV23 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GS11DHAV23?
S29GL01GS11DHAV23 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GS11DHAV23 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GS11DHAV23?
For technical support, including S29GL01GS11DHAV23 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS11DHAV23 requirements.
6.How does Aetrix verify that S29GL01GS11DHAV23 is sourced from the original manufacturer or authorized distributors?
All S29GL01GS11DHAV23 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS11DHAV23 meets industry standards.
7.What is the process for return or replacement of S29GL01GS11DHAV23?
All S29GL01GS11DHAV23 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS11DHAV23, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GS11DHAV23 part is unused and in its original packaging.
Return procedure for S29GL01GS11DHAV23:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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