Infineon Technologies S29GL01GS11DHB010
- Part No.:
- S29GL01GS11DHB010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GS11DHB010.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:898
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL01GS11DHB010 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, 65 nm MIRRORBIT™ Eclipse process, 3.0 V core supply (2.7–3.6 V), and industrial temperature grade (–40°C to +85°C). It delivers 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction - deployed in boot code storage for industrial HMIs and network edge routers.
For engineers reviewing the S29GL01GS11DHB010 datasheet, S29GL01GS11DHB010 pinout, S29GL01GS11DHB010 application, or S29GL01GS11DHB010 equivalent, key selection criteria include asynchronous 16-bit parallel interface timing, sector-level erase granularity (128 kB), OTP array security, Versatile I/O voltage range (1.65–3.6 V), and AEC-Q100 Grade 3 qualification support.
Technical Context
This device implements an embedded algorithm controller (EAC) that executes autonomous program/erase operations without host CPU intervention. It supports three status monitoring methods - status register polling, data polling, and RY/BY# pin assertion - enabling deterministic timing control in real-time boot sequences.
The flash array is organized into uniform 128-kbyte sectors with advanced sector protection (ASP), supporting both volatile and non-volatile lock modes per sector. The 1024-byte OTP array includes two independently lockable regions for secure device configuration and cryptographic key storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 1 Gb (128 MB) - supports full firmware image storage for ARM Cortex-A/M-class SoCs |
| Interface | Asynchronous 16-bit parallel - enables XIP execution without external glue logic |
| Access Time | 90 ns random / 15 ns page - meets boot ROM latency requirements for sub-100 ms cold start |
| Erase Unit | Uniform 128-kbyte sectors - simplifies firmware update partitioning and wear leveling |
| Program Buffer | 512-byte write buffer - reduces effective programming time by 3× vs. single-word writes |
| ECC | On-die hardware single-bit correction - eliminates need for external ECC logic in safety-critical boot paths |
| Endurance | 100,000 program/erase cycles - supports field firmware updates over 10+ year product lifecycle |
| Data Retention | 20 years at 85°C - validated for industrial deployments without refresh mechanisms |
Pinout & Package
Package: 56-pin TSOP (Type I, 14 mm × 20 mm, 0.55 mm pitch) - compatible with legacy PCB footprints and automated optical inspection workflows.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A25 | Address inputs | 26-bit word-aligned address bus; A25 is MSB for 1 Gb density (226 × 16 bits) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte/word writes via WE# and BYTE# control |
| CE# | Chip enable | Active-low device select; controls power state entry/exit and read/write arbitration |
| OE# | Output enable | Active-low read strobe; decouples output drivers to reduce bus contention during multi-device reads |
| WE# | Write enable | Active-low write strobe; latches command sequences and initiates embedded algorithms |
| RY/BY# | Ready/Busy indicator | Open-drain status pin; asserts low during program/erase; enables interrupt-driven host synchronization |
| RESET# | Hardware reset | Active-low asynchronous reset; forces device into known state and clears internal state machines |
| VCC | Core supply | 3.0 V ±10% core voltage; powers logic, array, and EAC - no separate VPP required |
| VIO | I/O supply | 1.65–3.6 V versatile I/O rail - allows direct interfacing with 1.8 V, 2.5 V, or 3.3 V controllers |
| WP# | Write protect | Hardware sector lock override; disables program/erase when asserted low |
Key Features
| Feature | Design Value |
|---|---|
| Page mode read | 32-byte aligned page access with 15 ns subsequent word latency - accelerates sequential instruction fetch in XIP mode |
| Embedded Algorithm Controller (EAC) | Autonomous program/erase execution with suspend/resume - enables host multitasking during flash operations |
| Advanced Sector Protection (ASP) | Volatile and non-volatile per-sector lock - supports secure bootloader partitioning and field-upgrade isolation |
| Common Flash Interface (CFI) | Standardized parameter table at fixed address - enables OS-agnostic flash driver auto-detection and initialization |
| Secure Silicon Region (OTP) | 1024-byte one-time-programmable array with dual lockable regions - stores immutable keys and device identity |
Applications
| Industrial HMI Boot Storage | Telecom Edge Router Firmware |
|---|---|
Use Scenario: Stores boot loader and Linux kernel image for fanless industrial HMIs operating in uncontrolled ambient environments. IC Role / Device Role / Timing Role: Primary non-volatile boot memory with XIP capability and deterministic 90 ns read latency. Use Value: Eliminates external SRAM copy step during boot; reduces BOM count and power-on sequence complexity. | Use Scenario: Hosts firmware images and configuration tables for carrier-grade edge routers requiring zero-downtime field upgrades. IC Role / Device Role / Timing Role: Dual-bank firmware storage with sector-level erase isolation for atomic A/B firmware switching. Use Value: Enables verified rollback on failed upgrade using independent 128-kB sector erase - no partial-write corruption risk. |
| Automotive ADAS Camera Module | Medical Imaging Control Board |
Use Scenario: Stores calibration data and firmware for AEC-Q100 Grade 3 compliant camera modules in ADAS domain controllers. IC Role / Device Role / Timing Role: Secure configuration storage with OTP-based sensor calibration checksums and ASP-locked boot sectors. Use Value: Meets ISO 26262 ASIL-B functional safety requirements via hardware ECC and locked sector integrity. | Use Scenario: Retains FPGA configuration bitstreams and diagnostic firmware for FDA-cleared medical imaging boards with 20-year shelf life. IC Role / Device Role / Timing Role: Long-term data retention memory with 20-year retention at 85°C and ECC-protected read path. Use Value: Avoids periodic firmware refresh cycles; certified for Class II medical devices requiring traceable data integrity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GS10TFB010 | 64-ball LAE Fortified BGA (9 mm × 9 mm); same electrical specs and timing | Requires BGA rework capability; better thermal dissipation for high-temp continuous operation | Select for space-constrained designs where PCB real estate is prioritized over TSOP reworkability |
| S29GL01GS11DHB020 | Same TSOP package but AEC-Q100 Grade 2 (–40°C to +105°C); identical pinout and timing | Validated for under-hood automotive use; higher temperature endurance testing | Select when operating ambient exceeds 85°C or automotive qualification beyond Grade 3 is mandated |
Compared with S29GL01GS11DHB010, the TSOP-based S29GL01GS11DHB020 extends temperature range without layout change, while the LAE BGA variant trades serviceability for footprint reduction and thermal performance - all retain identical command set, CFI structure, and ECC behavior.
Availability
S29GL01GS11DHB010 is available at Aetrix Electronics and suitable for industrial HMIs, telecom edge routers, automotive ADAS modules, and medical imaging control boards requiring stable component supply across extended product lifecycles.
Supply support for S29GL01GS11DHB010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and non-volatile memory solutions for industrial and automotive markets.
The GL-S family targets high-reliability embedded systems requiring deterministic boot performance, long-term data retention, and hardware-enforced security - optimized for XIP-capable SoCs in safety-critical applications.
FAQ
What is the minimum VIO voltage supported for reliable operation?
The S29GL01GS11DHB010 supports VIO down to 1.65 V across its full industrial temperature range. At this voltage, all timing parameters remain within specification, including tACC (90 ns max) and tPACC (15 ns max), provided VCC is maintained between 2.7 V and 3.6 V. This enables direct interfacing with 1.8 V logic families without level shifters.
Does this device require an external VPP supply for programming or erasing?
No. The S29GL01GS11DHB010 integrates on-chip charge pumps for programming and erase voltages. Only VCC (2.7–3.6 V) and VIO (1.65–3.6 V) supplies are required. This eliminates external high-voltage generation circuitry and simplifies power design for embedded systems with strict BOM constraints.
How is the 1024-byte OTP array accessed and secured?
The OTP array resides at a dedicated address range (0x0000_0000–0x0000_03FF) and is accessed using standard CFI-compliant commands. Each of its two 512-byte regions can be permanently locked via dedicated lock bits in the status register - once locked, no further writes or erases are possible, even after power cycle or reset.
Can sector protection be configured dynamically during runtime?
Yes. Advanced Sector Protection (ASP) supports both volatile (cleared on power cycle) and non-volatile (persistent) lock modes per sector. Volatile locks are set via command sequences and provide temporary protection during firmware updates; non-volatile locks require explicit unlock commands and persist through power cycles for permanent boot sector protection.
S29GL01GS11DHB010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL01GS11DHB010 FAQ
1.How can I place an order for S29GL01GS11DHB010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GS11DHB010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GS11DHB010 reliable?
The price and inventory of S29GL01GS11DHB010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS11DHB010 is usually 5 days.
3.What payment methods are accepted for S29GL01GS11DHB010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS11DHB010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GS11DHB010?
S29GL01GS11DHB010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GS11DHB010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GS11DHB010?
For technical support, including S29GL01GS11DHB010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS11DHB010 requirements.
6.How does Aetrix verify that S29GL01GS11DHB010 is sourced from the original manufacturer or authorized distributors?
All S29GL01GS11DHB010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS11DHB010 meets industry standards.
7.What is the process for return or replacement of S29GL01GS11DHB010?
All S29GL01GS11DHB010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS11DHB010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GS11DHB010 part is unused and in its original packaging.
Return procedure for S29GL01GS11DHB010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GS11DHB010 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

