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Infineon Technologies S29GL01GS11DHB013
- Part No.:
- S29GL01GS11DHB013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GS11DHB013.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,457
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Product details
Overview
S29GL01GS11DHB013 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction. It is used in boot code storage for industrial microcontrollers requiring fast XIP execution and reliable non-volatile program retention.
For engineers reviewing the S29GL01GS11DHB013 datasheet, S29GL01GS11DHB013 pinout, S29GL01GS11DHB013 application, or S29GL01GS11DHB013 equivalent, key selection criteria include its 128-kbyte uniform sector erase granularity, 512-byte write buffer throughput (1.5 MBps), Versatile I/O support (1.65–3.6 V), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and CFI-compliant interface for firmware update compatibility.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A25), supporting both standard read and 32-byte page-mode reads. Its embedded algorithm controller (EAC) manages autonomous program/erase operations, suspend/resume capability, and status reporting via status register, data polling, or RY/BY# pin.
Hardware ECC operates transparently during read cycles, correcting single-bit errors without software intervention. Sector protection uses configurable volatile/non-volatile lock bits per 128-kbyte sector, and includes a dedicated 1024-byte OTP array with two independently lockable regions for secure configuration storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB), enabling full boot image + firmware storage in single device |
| Random access time | 90 ns at VCC = VIO, meeting real-time XIP latency requirements for Cortex-M7/M4 systems |
| Page access time | 15 ns, allowing rapid sequential instruction fetch within same 32-byte page |
| Write buffer size | 512 bytes, reducing effective programming time by batching up to 256 words per command |
| ECC capability | Single-bit error correction per 512-byte sector, ensuring data integrity without host CPU overhead |
| Endurance & retention | 100,000 program/erase cycles and 20-year data retention at 85°C, suitable for long-life industrial deployments |
| Operating temperature | –40°C to +105°C (AEC-Q100 Grade 2), validated for under-hood automotive ECUs and industrial HMIs |
Pinout & Package
Package: 64-ball LAE Fortified BGA (9 mm × 9 mm, 0.8 mm pitch). Pinout conforms to JEDEC MO-270AB standard for parallel NOR flash.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A25 | Address inputs | 26-bit word address bus (A25 only active for 1 Gb density); supports byte/word alignment per CFI spec |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; compatible with 3.3 V LVTTL and 1.8 V I/O when VIO = 1.65–3.6 V |
| CE# | Chip enable | Active-low device select; enables internal state machine only when asserted with valid address |
| OE# | Output enable | Controls output drivers during read; high-Z when deasserted to prevent bus contention |
| WE# | Write enable | Initiates write/program/erase commands; latches command sequences on falling edge |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling ongoing embedded operation; used for hardware flow control |
| WP# | Write protect | Hardware sector lock override; disables program/erase when asserted low |
| VCC | Core supply | 2.7–3.6 V single supply powering core logic, charge pumps, and ECC engine |
| VIO | I/O supply | Independent 1.65–3.6 V rail enabling mixed-voltage system interfacing without level shifters |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | Supports 1.65–3.6 V VIO independently of VCC, eliminating external level shifters in mixed-voltage SoC designs |
| 512-byte write buffer | Enables 1.5 MBps effective programming rate-3× faster than single-word writes for firmware updates |
| Uniform 128-kbyte sectors | Simplifies partitioning of boot loader, application, and parameter storage with deterministic erase boundaries |
| Hardware ECC engine | Corrects single-bit errors on-the-fly during read, removing need for host-side error handling routines |
| Secure OTP array | 1024-byte one-time-programmable region with dual lock bits, ideal for storing cryptographic keys or calibration data |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot code and calibrated engine maps in diesel ECU with AEC-Q100 Grade 2 compliance requirement. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with <90 ns latency. Use Value: Enables deterministic cold-start timing and meets automotive thermal cycling reliability (–40°C to +105°C). | Use Scenario: Holding firmware and configuration data for modular programmable logic controllers in factory automation. IC Role / Device Role / Timing Role: Standalone parallel flash for field-upgradable firmware with sector-level protection against corruption. Use Value: Uniform 128-kbyte sectors allow safe over-the-air updates without erasing entire application image. |
| Medical Imaging System Boot Memory | Avionics Display Processor Storage |
Use Scenario: Hosting boot ROM and FPGA configuration bitstream in portable ultrasound devices requiring 20-year data retention. IC Role / Device Role / Timing Role: High-reliability code storage with hardware ECC to prevent latent bit flips in radiation-prone environments. Use Value: Internal single-bit ECC eliminates need for redundant storage or checksum validation overhead. | Use Scenario: Storing display firmware and font assets in DO-254-certifiable cockpit display units. IC Role / Device Role / Timing Role: CFI-compliant NOR flash enabling standardized driver integration across multiple avionics platforms. Use Value: Common Flash Interface table allows automatic detection and configuration by ARINC-653-compliant OS loaders. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GS10TFI010 | Same 1 Gb density and 65 nm process, but TSOP-56 package and industrial (–40°C to +85°C) grade | Lacks AEC-Q100 qualification and Versatile I/O; requires level shifting for 1.8 V hosts | Select when board layout constraints favor TSOP or automotive qualification is unnecessary |
| MX29GL128FHT2I-90G | 128 Mb density, 90 ns access, no integrated ECC, 48-pin TSOP | Lower density limits use to smaller firmware images; no hardware error correction increases host validation burden | Select only for cost-sensitive legacy designs where ECC is handled externally |
Compared with S29GL01GS11DHB013, the TSOP variant trades automotive qualification and flexible I/O for simpler packaging, while the Macronix part reduces density and omits ECC-making the Infineon device optimal for new AEC-Q100-compliant, high-integrity embedded designs requiring full 1 Gb capacity and autonomous error resilience.
Availability
S29GL01GS11DHB013 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware upgrades, and medical imaging system boot memory requiring stable component supply across extended temperature and long lifecycle programs.
Supply support for S29GL01GS11DHB013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions.
The GL-S family targets automotive and industrial embedded systems needing robust, high-density parallel NOR flash with built-in ECC, AEC-Q100 compliance, and seamless CFI interoperability.
FAQ
What is the purpose of the Versatile I/O (VIO) feature?
The Versatile I/O feature allows independent biasing of the DQ[15:0] pins from 1.65 V to VCC (max 3.6 V), enabling direct interface with mixed-voltage SoCs-such as those with 1.8 V I/O domains-without external level shifters. This reduces BOM count and signal integrity risk in space-constrained designs.
Does S29GL01GS11DHB013 support execute-in-place (XIP) operation?
Yes. With 90 ns random access time and page-mode read capability (15 ns subsequent accesses), it supports true XIP execution for ARM Cortex-M and Power Architecture cores. The device delivers instruction fetches directly over the parallel bus without requiring DRAM shadowing or cache prefetching.
How does the hardware ECC function during normal read operations?
Hardware ECC operates transparently during every read cycle: the internal engine checks each 512-byte sector and automatically corrects single-bit errors before data reaches the DQ bus. No host intervention or additional timing overhead is required, and uncorrectable multi-bit errors trigger status register flags for software handling.
Can the OTP array be reprogrammed after initial programming?
No. The 1024-byte OTP array is permanently programmable-once a bit is set to '0', it cannot be reset to '1'. Two independent lock bits (OTP Lock 0 and OTP Lock 1) provide irreversible protection for each 512-byte region, making it suitable for cryptographic keys or factory calibration constants.
S29GL01GS11DHB013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL01GS11DHB013 FAQ
1.How can I place an order for S29GL01GS11DHB013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GS11DHB013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GS11DHB013 reliable?
The price and inventory of S29GL01GS11DHB013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS11DHB013 is usually 5 days.
3.What payment methods are accepted for S29GL01GS11DHB013?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS11DHB013 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GS11DHB013?
S29GL01GS11DHB013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GS11DHB013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GS11DHB013?
For technical support, including S29GL01GS11DHB013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS11DHB013 requirements.
6.How does Aetrix verify that S29GL01GS11DHB013 is sourced from the original manufacturer or authorized distributors?
All S29GL01GS11DHB013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS11DHB013 meets industry standards.
7.What is the process for return or replacement of S29GL01GS11DHB013?
All S29GL01GS11DHB013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS11DHB013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GS11DHB013 part is unused and in its original packaging.
Return procedure for S29GL01GS11DHB013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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