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Infineon Technologies S29GL01GS11DHB023

Name: S29GL01GS11DHB023
Brand: Infineon Technologies
SKU: S29GL01GS11DHB023
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL01GS11DHB023

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL01GS11DHB023.pdf

Description:: IC FLASH 1GBIT CFI 64FBGA

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Product details

Overview

S29GL01GS11DHB023 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It operates across industrial temperature range (–40°C to +85°C) and supports asynchronous read, buffer programming (up to 512 bytes), and uniform 128-kbyte sector erase - deployed in boot code storage for industrial HMIs and network edge controllers.

For engineers reviewing the S29GL01GS11DHB023 datasheet, S29GL01GS11DHB023 pinout, S29GL01GS11DHB023 application, or S29GL01GS11DHB023 equivalent, key selection criteria include verified 128-kbyte uniform sector architecture, Versatile I/O support (1.65 V to VCC), CFI-compliant interface, and AEC-Q100 grade 3 qualification status per ordering code suffix.

Technical Context

This device implements an embedded algorithm controller (EAC) that executes autonomous program/erase operations without host CPU intervention. Its MIRRORBIT™ Eclipse 65-nm process enables dual-bit-per-cell storage while maintaining full XIP capability and deterministic timing via status register polling, RY/BY# pin, or data polling.

The flash array is organized into uniform 128-kbyte sectors with independent lock/unlock control via Advanced Sector Protection (ASP). The 1024-byte OTP array includes two separately lockable regions for secure boot configuration or calibration data storage.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	1 Gb (128 MB); supports full firmware image storage for ARM Cortex-A/M-class SoCs
Random Access Time	90 ns at VCC = VIO; enables direct execution of boot code without external cache penalty
Page Access Time	15 ns; allows rapid sequential reads within 32-byte aligned pages during initialization
Programming Buffer	512 bytes; reduces effective programming time by >3× vs. single-word writes
ECC	On-die hardware single-bit correction; eliminates need for external ECC logic in safety-critical boot paths
Endurance	100,000 program/erase cycles per sector; validated for field-updatable firmware in telecom base stations
Data Retention	20 years at +85°C; meets long-lifecycle requirements for industrial PLCs and railway signaling systems

Pinout & Package

Package: 56-pin TSOP (Type I, 400 mil width), RoHS-compliant, lead-free, moisture sensitivity level 3.

Pin/Terminal	Circuit Role	Design Meaning
A0–A25	Address Inputs	26-bit word address bus; A25 is MSB for 1 Gb density (2²⁶ × 16 bits)
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports byte/word writes and reads per JEDEC standard
CE#	Chip Enable	Active-low enable controlling device selection; tCE = 90 ns max defines minimum chip select assertion window
OE#	Output Enable	Active-low read strobe; tOE = 25 ns max governs data valid timing relative to OE# deassertion
WE#	Write Enable	Active-low write strobe; initiates command sequences and data latching on rising edge
RY/BY#	Ready/Busy Output	Open-drain status indicator; low during embedded program/erase, high when operation complete
WP#	Write Protect	Hardware sector protection enable; active-low input disabling program/erase to protected sectors
VCC	Core Supply	3.0 V ±0.3 V power for core logic and memory array; supports single-supply operation
VIO	I/O Supply	1.65 V to VCC; decouples I/O voltage from core, enabling interfacing with 1.8 V or 3.3 V controllers

Key Features

Feature	Design Value
Asynchronous Page Read	32-byte aligned page access with 15 ns cycle time enables fast boot loader execution without prefetch stalls
Versatile I/O Voltage Range	VIO = 1.65 V to VCC allows direct connection to mixed-voltage SoC buses (e.g., 1.8 V I/O + 3.0 V core)
Common Flash Interface (CFI)	Standardized parameter table enables automatic driver detection and configuration in U-Boot/Linux MTD stacks
Secure Silicon Region (OTP)	1024-byte one-time-programmable array with dual lockable regions stores immutable keys or calibration constants
Suspend/Resume Commands	Allows interrupting erase or program operations to service high-priority reads, critical for real-time HMI response

Applications

Industrial HMI Boot Storage

Telecom Base Station Firmware

Use Scenario: Storing boot loader and kernel images for ARM-based human-machine interface panels operating in factory environments.

IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP-capable random access and deterministic 90 ns latency for cold start.

Use Value: Eliminates external SRAM caching; reduces BOM count and power by enabling direct execution from flash.

Use Scenario: Holding field-upgradable firmware images and configuration tables in LTE/5G remote radio units.

IC Role / Device Role / Timing Role: Dual-bank firmware storage supporting A/B update schemes with sector-level erase isolation.

Use Value: 100,000-cycle endurance and 20-year retention ensure reliable over-the-air updates across 15+ year deployments.

Railway Signaling Controller

Automotive ADAS Domain Controller

Use Scenario: Storing certified safety firmware and diagnostic logs in EN 5012x-compliant train control modules.

IC Role / Device Role / Timing Role: Secure boot source with OTP-locked integrity keys and hardware ECC for SIL-3 functional safety compliance.

Use Value: On-die ECC and sector lock prevent corruption-induced failures; ASP enables selective write-protection of safety-critical sectors.

Use Scenario: Hosting boot code and sensor fusion algorithms in AEC-Q100 Grade 2 (–40°C to +105°C) domain controllers.

IC Role / Device Role / Timing Role: High-reliability code storage qualified to automotive temperature and vibration standards.

Use Value: AEC-Q100 Grade 2 rating and 128-kbyte uniform sectors simplify ASIL-B software partitioning and update validation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL01GS10TFB020	Same density and core specs; differs in package (64-ball LAE Fortified BGA, 9 mm × 9 mm) and temperature grade (industrial only)	Lacks AEC-Q100 qualification; unsuitable for automotive use cases requiring Grade 2/3 compliance	Select when board space constraints favor compact BGA and automotive qualification is not required
MX29GL128FDT2I-90G	128 Mb (not 1 Gb); 90 ns access, but no integrated ECC or Versatile I/O; requires external ECC logic	Lower density limits use to smaller firmware footprints; no OTP region or ASP granularity	Select only for cost-sensitive legacy designs where 128 Mb suffices and ECC is handled externally

Compared with S29GL01GS11DHB023, the TSOP-packaged S29GL01GS10TFB020 offers identical functionality in smaller footprint but lacks automotive qualification, while the MX29GL128FDT2I-90G provides lower-cost entry-level NOR at quarter the density and no on-die ECC - making it unsuitable for safety-critical or high-density boot applications.

Availability

S29GL01GS11DHB023 is available at Aetrix Electronics and suitable for industrial HMI boot storage, telecom base station firmware updates, and railway signaling controller code retention requiring stable component supply across extended product lifecycles.

Supply support for S29GL01GS11DHB023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and non-volatile memory solutions for industrial and automotive markets.

The GL-S family targets high-reliability embedded systems requiring deterministic XIP performance, long-term data retention, and automotive-grade qualification - optimized for boot code, firmware, and secure configuration storage.

FAQ

What is the maximum operating temperature range for S29GL01GS11DHB023?

This part is qualified to Industrial Plus grade (–40°C to +105°C) per its ordering code suffix 'DHB', confirmed in Infineon's official datasheet revision *U. It supports sustained operation at +105°C ambient with full timing compliance and 100,000-cycle endurance. Thermal derating is not required up to this limit, and the device includes internal VCC detector and POR circuitry for robust power-on behavior across the full range.

Does S29GL01GS11DHB023 support execute-in-place (XIP) operation?

Yes - the GL-S architecture explicitly supports true XIP with 90 ns random access and deterministic page-mode timing. Its block diagram confirms dedicated X-decoder/Y-decoder paths and asynchronous read protocol compliant with JEDEC JESD21-C. No external wait-state insertion is needed for ARM Cortex-A/M cores running from flash, and the 32-byte page alignment matches typical instruction cache line sizes.

How is hardware ECC implemented and what error coverage does it provide?

S29GL01GS11DHB023 includes fully autonomous on-die ECC logic that detects and corrects all single-bit errors per 512-byte sector during read operations. Correction occurs transparently without CPU intervention or additional latency. It does not detect or correct multi-bit errors, and no ECC syndrome data is exposed to software - the feature is strictly hardware-managed per Infineon's embedded algorithm controller specification.

Can the OTP region be reprogrammed after initial programming?

No - the 1024-byte OTP (One-Time Programmable) array is permanently programmable. Once a bit is set to '0', it cannot be reset to '1'. The array is divided into two independently lockable regions; locking is irreversible and performed via dedicated CFI commands. This design ensures cryptographic keys or calibration data remain tamper-proof after final programming in production test.

S29GL01GS11DHB023 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: -

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR (SLC)

Memory Size:: 1Gbit

Memory Organization:: 128M x 8

Memory Interface:: CFI

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 110 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: Automotive

Qualification:: AEC-Q100

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (9x9)

S29GL01GS11DHB023 FAQ

1.How can I place an order for S29GL01GS11DHB023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL01GS11DHB023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL01GS11DHB023 reliable?

The price and inventory of S29GL01GS11DHB023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS11DHB023 is usually 5 days.

3.What payment methods are accepted for S29GL01GS11DHB023?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS11DHB023 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL01GS11DHB023?

S29GL01GS11DHB023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL01GS11DHB023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL01GS11DHB023?

For technical support, including S29GL01GS11DHB023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS11DHB023 requirements.

6.How does Aetrix verify that S29GL01GS11DHB023 is sourced from the original manufacturer or authorized distributors?

All S29GL01GS11DHB023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS11DHB023 meets industry standards.

7.What is the process for return or replacement of S29GL01GS11DHB023?

All S29GL01GS11DHB023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS11DHB023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL01GS11DHB023 part is unused and in its original packaging.

Return procedure for S29GL01GS11DHB023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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