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Infineon Technologies S29GL01GS11DHI010

Part No.:
S29GL01GS11DHI010
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
64-LBGA
Datasheet:
AetrixS29GL01GS11DHI010.pdf
Description:
IC FLASH 1GBIT PARALLEL 64FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,188

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Product details

Overview

S29GL01GS11DHI010 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access and 15 ns page access, and integrates hardware ECC for single-bit error correction. Used in boot code storage for industrial microcontrollers requiring deterministic XIP execution.

For engineers reviewing the S29GL01GS11DHI010 datasheet, S29GL01GS11DHI010 pinout, S29GL01GS11DHI010 application, or S29GL01GS11DHI010 equivalent, this device supports asynchronous read, sector erase, suspend/resume operations, OTP lockable regions, and CFI-compliant software interface - critical for firmware update reliability and long-term BOM stability in harsh environments.

Technical Context

This device implements an embedded algorithm controller (EAC) that executes autonomous program and erase sequences without host CPU intervention. Its 512-byte write buffer enables burst programming at up to 1.5 MBps, while uniform 128-kbyte sectors support granular firmware partitioning.

The Versatile I/O feature allows independent VIO (1.65 V to VCC) operation, decoupling I/O voltage from core logic - essential for interfacing with mixed-voltage SoCs. Hardware ECC operates transparently during read cycles, correcting single-bit errors before data delivery to the host bus.

Key Specifications

Parameter Value and Actual Design Meaning
Memory density 1 Gb (128 MB), organized as 8,388,608 × 16-bit words - sufficient for full bootloader + secure firmware image storage
Access time (random) 90 ns at VCC = VIO - enables direct XIP execution from flash without external cache penalty
Page access time 15 ns - accelerates sequential instruction fetch within 32-byte aligned pages
Write buffer size 512 bytes - reduces effective programming time by batching writes, minimizing host wait states
ECC capability Internal hardware single-bit error correction - eliminates need for external ECC logic or software overhead
Endurance & retention 100,000 program/erase cycles and 20-year data retention - validated for industrial lifecycle requirements
Operating temperature –40°C to +105°C (Industrial Plus grade) - qualified for extended thermal range in enclosed control cabinets

Pinout & Package

Package: 64-ball LAE Fortified BGA (9 mm × 9 mm, 0.8 mm pitch). Pinout conforms to standard parallel NOR flash interface with dedicated CE#, OE#, WE#, RESET#, RY/BY#, and 26 address lines (A0–A25) plus 16 bidirectional data lines (DQ0–DQ15).

Pin/Terminal Circuit Role Design Meaning
A0–A25 Address inputs 26-bit address bus supporting full 128 MB address space; A25 is MSB for 1 Gb density
DQ0–DQ15 Bidirectional data bus 16-bit word-wide interface; all reads/writes transfer one word per cycle
CE# Chip enable Active-low chip select; controls device power state and command latching timing
OE# Output enable Active-low control for data bus output drivers; used during read operations only
WE# Write enable Active-low strobe for write/program command initiation and data capture
RY/BY# Ready/Busy indicator Open-drain output signaling active internal operation (low) or completion (high)
RESET# Hardware reset Asynchronous active-low input forcing device into known initial state, clearing status registers

Key Features

Feature Design Value
Asynchronous page mode read 32-byte aligned page access with 15 ns intra-page latency - improves instruction throughput in XIP applications
Uniform 128-kbyte sectors 1024 individually erasable sectors - enables atomic firmware updates without disturbing adjacent code partitions
Advanced sector protection (ASP) Volatile and non-volatile locking per sector - prevents accidental overwrite of bootloader or calibration data
1024-byte OTP array Two lockable regions for permanent storage of keys, serial numbers, or security credentials
Common Flash Interface (CFI) Standardized parameter table accessible via read commands - enables OS-agnostic flash driver compatibility

Applications

Industrial PLC Firmware Storage Automotive ADAS Boot Memory

Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers operating continuously in factory environments.

IC Role / Device Role / Timing Role: Non-volatile boot memory providing deterministic XIP execution with <90 ns access to ensure hard real-time task startup.

Use Value: 20-year data retention and 100K erase cycles guarantee firmware integrity over full equipment lifecycle without refresh.

Use Scenario: Holding safety-critical boot code and sensor calibration data in automotive camera ECU modules certified to AEC-Q100 Grade 2.

IC Role / Device Role / Timing Role: Automotive-grade parallel NOR flash with –40°C to +105°C operation and hardware ECC for fault-tolerant boot path.

Use Value: Internal ECC corrects single-bit errors induced by radiation or aging, eliminating risk of corrupted boot sequence.

Medical Imaging System BIOS Energy Meter Secure Configuration

Use Scenario: Hosting BIOS and FPGA configuration bitstreams in portable ultrasound devices requiring regulatory-compliant firmware persistence.

IC Role / Device Role / Timing Role: High-reliability flash with OTP region storing cryptographic keys and device-specific calibration parameters.

Use Value: Two lockable OTP regions prevent tampering with security credentials while enabling field-upgradable calibration data.

Use Scenario: Storing tariff tables, metering algorithms, and utility authentication keys in smart electricity meters deployed in outdoor substations.

IC Role / Device Role / Timing Role: Industrial-plus grade flash with ASP sector locking to protect revenue-critical firmware from unauthorized modification.

Use Value: Volatile/non-volatile sector protection ensures tamper-resistant operation even during brownout or reset conditions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
S29GL01GS11TFI010 Same die, 56-pin TSOP package instead of 64-ball LAE BGA - larger footprint, no ball-grid routing constraints Preferred for legacy PCB designs with through-hole or wide-pitch surface-mount layouts Select when board rework, thermal management, or test probe access favors TSOP over BGA
S29GL01GS10TFI020 Identical functionality but rated for Industrial (–40°C to +85°C) rather than Industrial Plus (–40°C to +105°C) temperature range Suitable for indoor industrial applications without extended thermal stress Choose for cost-sensitive deployments where ambient temperature remains below +85°C

Compared with S29GL01GS11DHI010, the TSOP variant offers mechanical simplicity and debug accessibility, while the lower-grade alternative trades thermal margin for unit cost reduction - both retain identical timing, ECC, and CFI behavior.

Availability

S29GL01GS11DHI010 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system BIOS requiring stable component supply across multi-year production programs.

Supply support for S29GL01GS11DHI010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.

This part belongs to the GL-S MIRRORBIT™ Eclipse flash product line, designed specifically for high-reliability embedded systems needing fast XIP performance, long-term data retention, and robust firmware protection in industrial and automotive environments.

FAQ

Does S29GL01GS11DHI010 support byte-level writes?

No. This device operates exclusively on 16-bit word boundaries due to its ×16 data bus architecture. All write and program operations require aligned 16-bit data transfers; unaligned or byte-only writes are not supported and will result in undefined behavior or command rejection.

What is the purpose of the RY/BY# pin?

RY/BY# is an open-drain ready/busy indicator that asserts low during internal program or erase operations and returns high upon completion. It provides hardware-synchronized status feedback, eliminating the need for continuous polling of the status register during long-duration embedded operations.

Can the OTP array be reprogrammed after locking?

No. Once either of the two OTP regions is permanently locked via the appropriate CFI command sequence, its contents become immutable. The lock is irreversible and enforced by on-die fuses - no software or voltage-based unlock mechanism exists.

Is VIO required to match VCC during operation?

No. The Versatile I/O feature allows VIO to operate independently from 1.65 V to VCC. For example, VCC can be 3.3 V while VIO is set to 1.8 V to interface directly with low-voltage SoC I/O banks - no level-shifting circuitry is needed.

S29GL01GS11DHI010 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
GL-S
Package/Case:
64-LBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
1Gbit
Memory Organization:
64M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
60ns
Access Time:
110 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
64-FBGA (9x9)

S29GL01GS11DHI010 FAQ

1.How can I place an order for S29GL01GS11DHI010 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL01GS11DHI010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL01GS11DHI010 reliable?

The price and inventory of S29GL01GS11DHI010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS11DHI010 is usually 5 days.

3.What payment methods are accepted for S29GL01GS11DHI010?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS11DHI010 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL01GS11DHI010?

S29GL01GS11DHI010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL01GS11DHI010 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL01GS11DHI010?

For technical support, including S29GL01GS11DHI010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS11DHI010 requirements.

6.How does Aetrix verify that S29GL01GS11DHI010 is sourced from the original manufacturer or authorized distributors?

All S29GL01GS11DHI010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS11DHI010 meets industry standards.

7.What is the process for return or replacement of S29GL01GS11DHI010?

All S29GL01GS11DHI010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS11DHI010, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL01GS11DHI010 part is unused and in its original packaging.

Return procedure for S29GL01GS11DHI010:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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