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Infineon Technologies S29GL01GS11DHI020
- Part No.:
- S29GL01GS11DHI020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GS11DHI020.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,221
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Product details
Overview
S29GL01GS11DHI020 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It operates across industrial temperature range (–40°C to +85°C) and supports sector erase of uniform 128-kbyte sectors in embedded boot code storage applications.
For engineers reviewing the S29GL01GS11DHI020 datasheet, S29GL01GS11DHI020 pinout, S29GL01GS11DHI020 application, or S29GL01GS11DHI020 equivalent, key selection criteria include asynchronous 16-bit interface timing, Versatile I/O (1.65–VCC VIO), 512-byte programming buffer throughput (1.5 MBps), OTP array security, and AEC-Q100 grade 3 qualification for automotive control modules.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A25), 32-byte page read architecture, and embedded algorithm controller (EAC) managing program/erase operations without host CPU intervention. It uses MIRRORBIT™ Eclipse 65-nm technology to enable simultaneous bit-line sensing and dual-bit storage per cell.
The internal ECC engine performs real-time single-bit correction during read cycles and reports uncorrectable multi-bit errors via status register. Sector protection includes volatile (lock bits) and non-volatile (ASP) methods, plus a dedicated 1024-byte OTP array with two independently lockable regions for secure configuration or calibration data.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB) - supports full boot image + firmware partitioning in resource-constrained microcontrollers |
| Interface type | Asynchronous parallel ×16 - enables XIP execution without external SRAM buffering |
| Random access time | 90 ns at VCC = VIO - meets real-time interrupt latency requirements in safety-critical automotive ECUs |
| Page access time | 15 ns - accelerates sequential instruction fetch within same 32-byte aligned page |
| Programming buffer | 512 bytes - reduces host overhead by batching up to 256 words per command, achieving 1.5 MBps effective write rate |
| ECC capability | Hardware single-bit correction - eliminates need for software ECC layer in bootloader design |
| Endurance & retention | 100,000 program/erase cycles / 20 years data retention - validated for infotainment system firmware updates over vehicle lifetime |
Pinout & Package
Package: 56-pin TSOP (Type I, 14 mm × 20 mm, 0.55 mm pitch). Pinout conforms to standard parallel NOR flash layout with CE#, OE#, WE#, RESET#, RY/BY#, and DQ0–DQ15 bidirectional data lines.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A25 | Address inputs | Word-aligned addressing; A25 active for 1 Gb density (AMAX = A25) |
| DQ0–DQ15 | Bidirectional data bus | 16-bit parallel interface; supports byte/word writes via WE# and byte enable logic |
| CE# | Chip enable | Active-low device selection; controls power state entry/exit and timing tCE (max 100 ns) |
| OE# | Output enable | Active-low read strobe; gates output drivers; timing tOE (max 35 ns under Versatile I/O) |
| WE# | Write enable | Active-low write strobe; initiates program/erase commands and data latching |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling ongoing embedded operation; used for polling or interrupt-driven status monitoring |
| RESET# | Hardware reset | Active-low asynchronous reset; forces device into standby and clears internal state machines |
| VCC | Core supply | 3.0 V nominal (2.7–3.6 V); powers core logic, EAC, and ECC engine |
| VIO | I/O supply | 1.65–VCC range; decouples interface voltage from core, enabling mixed-voltage system integration |
Key Features
| Feature | Design Value |
|---|---|
| 65 nm MIRRORBIT™ Eclipse process | Enables 1 Gb density in compact TSOP package while maintaining 90 ns random access and low active current (60 mA @ 5 MHz) |
| 512-byte programming buffer | Reduces host CPU intervention by 8× vs. single-word programming; improves firmware update efficiency in OTA-capable gateways |
| Hardware ECC with single-bit correction | Eliminates soft-error-induced boot failures; avoids software ECC overhead in ROM-resident bootloaders |
| Uniform 128-kbyte sector erase | Enables deterministic firmware update timing; supports atomic sector-level rollback in automotive ASW applications |
| Dedicated 1024-byte OTP array | Stores immutable calibration data or cryptographic keys; two lockable regions prevent accidental overwrite during field reprogramming |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot code, calibration maps, and ASW-compliant firmware images in diesel/gasoline engine controllers. IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP capability and deterministic 90 ns read latency for real-time ISR execution. Use Value: AEC-Q100 Grade 3 qualification ensures reliability at –40°C to +85°C; sector protection prevents corruption during power interruption during ECU reflashing. | Use Scenario: Holding firmware, configuration tables, and HMI assets in programmable logic controllers deployed in factory automation systems. IC Role / Device Role / Timing Role: Asynchronous parallel boot memory interfaced directly to ARM Cortex-M7 or RISC-V SoC with no glue logic. Use Value: 128-kbyte uniform sectors allow safe firmware patching without erasing entire image; OTP region secures vendor-specific IP blocks. |
| Medical Diagnostic Imaging Boot Memory | Avionics Data Recorder Firmware |
Use Scenario: Hosting certified boot firmware and FPGA configuration bitstreams in ultrasound or MRI subsystems requiring DO-254 compliance. IC Role / Device Role / Timing Role: Secure, high-reliability code storage with hardware ECC and 20-year data retention for life-critical devices. Use Value: Internal ECC eliminates need for redundant storage schemes; industrial temperature grade supports operation in cooled equipment enclosures. | Use Scenario: Storing flight-critical firmware and event logging buffers in black box recorders operating in extended thermal environments. IC Role / Device Role / Timing Role: Non-volatile memory with suspend/resume capability for program/erase during vibration-induced power transients. Use Value: Suspend command halts erase mid-cycle and resumes after power recovery-prevents data loss during aircraft turbulence events. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GS10DHIV10 | Same 1 Gb density and TSOP package, but rated for industrial-plus (–40°C to +105°C) and lacks AEC-Q100 qualification | Preferred for extended-temperature industrial gateways where automotive certification is unnecessary | Select when higher ambient operating temperature is required and automotive qualification is not mandated |
| MX29GL128FDTI-90G | 128 Mb density (1/8 capacity), 90 ns access, no integrated ECC, different CFI command set | Suitable for legacy designs with smaller firmware footprints and no ECC dependency | Choose only if firmware size fits 128 Mb and system-level ECC is implemented externally |
Compared with S29GL01GS11DHI020, the S29GL01GS10DHIV10 offers broader temperature tolerance but omits automotive qualification, while MX29GL128FDTI-90G trades capacity and ECC for cost-sensitive legacy platforms lacking hardware error correction.
Availability
S29GL01GS11DHI020 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware upgrades, and medical imaging boot memory applications requiring stable component supply and long-term lifecycle support.
Supply support for S29GL01GS11DHI020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.
The GL-S family targets high-reliability embedded systems requiring fast XIP-capable flash with robust data integrity features-designed specifically for automotive, industrial, and medical applications demanding AEC-Q100 compliance and 20-year data retention.
FAQ
What is the maximum operating frequency supported by S29GL01GS11DHI020?
The device does not use a clock signal and operates asynchronously. Its performance is defined by access times: 90 ns random access and 15 ns page access under full VCC = VIO conditions. System timing depends on host bus controller setup/hold requirements and CE#/OE#/WE# assertion timing, not a clock frequency.
Does S29GL01GS11DHI020 support both 3.3 V and 1.8 V I/O interfaces?
Yes-it supports Versatile I/O with VIO ranging from 1.65 V to VCC. When VCC = 3.3 V, VIO can be set to 1.8 V, enabling direct connection to 1.8 V logic without level shifters. This is confirmed in the "Versatile I/O feature" section of the datasheet and validated in DC characteristics tables.
How is the 1024-byte OTP array protected against accidental programming?
The OTP array has two independent lockable regions. Each region is secured via non-volatile lock bits that, once programmed, permanently disable further writes to that segment. Locking is performed using the standard command sequence (0xAA, 0x55, 0x20) followed by specific OTP address writes-no unlock command exists after locking.
Can S29GL01GS11DHI020 be used in place of older S29GL01GP devices?
No-S29GL01GS is not pin-compatible or command-compatible with the legacy S29GL01GP series. GS devices use updated MIRRORBIT™ Eclipse architecture, revised timing parameters, and enhanced CFI tables. Migration requires PCB layout changes, firmware driver updates, and validation of all timing margins per Rev. *U datasheet.
S29GL01GS11DHI020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL01GS11DHI020 FAQ
1.How can I place an order for S29GL01GS11DHI020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GS11DHI020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GS11DHI020 reliable?
The price and inventory of S29GL01GS11DHI020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS11DHI020 is usually 5 days.
3.What payment methods are accepted for S29GL01GS11DHI020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS11DHI020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GS11DHI020?
S29GL01GS11DHI020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GS11DHI020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GS11DHI020?
For technical support, including S29GL01GS11DHI020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS11DHI020 requirements.
6.How does Aetrix verify that S29GL01GS11DHI020 is sourced from the original manufacturer or authorized distributors?
All S29GL01GS11DHI020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS11DHI020 meets industry standards.
7.What is the process for return or replacement of S29GL01GS11DHI020?
All S29GL01GS11DHI020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS11DHI020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GS11DHI020 part is unused and in its original packaging.
Return procedure for S29GL01GS11DHI020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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