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Infineon Technologies S29GL01GS11DHIV10
- Part No.:
- S29GL01GS11DHIV10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GS11DHIV10.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:471
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Product details
Overview
S29GL01GS11DHIV10 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction. Used in boot code storage for industrial microcontrollers requiring XIP execution and reliable non-volatile program retention.
For engineers reviewing the S29GL01GS11DHIV10 datasheet, S29GL01GS11DHIV10 pinout, S29GL01GS11DHIV10 application, or S29GL01GS11DHIV10 equivalent, key selection criteria include its 128-kbyte uniform sector erase architecture, 512-byte write buffer throughput (1.5 MBps), Versatile I/O support (1.65–3.6 V), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and CFI-compliant interface for firmware update compatibility.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A25), supporting both random and page-mode reads. Its embedded algorithm controller (EAC) manages autonomous program/erase operations, status monitoring via RY/BY# pin or status register, and suspend/resume capability during active programming or erasing.
The flash array is organized into uniform 128-kbyte sectors, each individually lockable via Advanced Sector Protection (ASP) using volatile or non-volatile methods. A dedicated 1024-byte OTP array with two lockable regions supports secure configuration storage, while internal hardware ECC corrects single-bit errors on-the-fly during read operations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 1 Gb (128 MB) - supports full boot image storage for high-end MCUs and SoCs |
| Interface | Parallel ×16 asynchronous - enables direct XIP execution without external buffering |
| Access Time | 90 ns random / 15 ns page - meets real-time boot latency requirements in industrial controllers |
| Write Buffer | 512 bytes - reduces effective programming time by batching up to 256 words per command |
| ECC | Hardware single-bit correction - ensures data integrity without host CPU overhead |
| Endurance | 100,000 program/erase cycles - suitable for field-updatable firmware with frequent patching |
| Data Retention | 20 years at +85°C - guarantees long-term reliability in unattended embedded deployments |
Pinout & Package
Package: 64-ball LAE Fortified BGA (9 mm × 9 mm, 0.8 mm pitch). Pinout validated per Infineon datasheet 001-98285 Rev. *U, Section 12.2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A25 | Address inputs | Word-aligned addressing; A25 used only for 1 Gb density (S29GL01GS) |
| DQ0–DQ15 | Data I/O bidirectional bus | 16-bit parallel data path; supports Versatile I/O (1.65–3.6 V) |
| CE# | Chip enable | Active-low device select; controls power state entry/exit |
| OE# | Output enable | Active-low read strobe; gates output drivers during read cycles |
| WE# | Write enable | Active-low control for write/program/erase command latching |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling ongoing embedded operation completion |
| RESET# | Hardware reset | Active-low signal forcing device into known initial state, clearing status registers |
| VCC | Core supply | 2.7–3.6 V single supply powering core logic and flash array |
| VIO | I/O supply | 1.65–3.6 V independent I/O voltage enabling mixed-voltage system interfacing |
Key Features
| Feature | Design Value |
|---|---|
| Page-mode read (32-byte aligned) | 15 ns access within same page - accelerates sequential instruction fetch in XIP applications |
| Uniform 128-kbyte sectors | 1024 individually erasable sectors - enables fine-grained firmware partitioning and OTA updates |
| Advanced Sector Protection (ASP) | Volatile/non-volatile locking per sector - prevents accidental overwrite of bootloader or calibration data |
| Secure OTP array (1024 bytes) | Two lockable regions - stores cryptographic keys or device-specific configuration securely |
| CFI parameter table | Standardized JEDEC-compliant descriptor - enables automatic driver detection and configuration in OS/bootloader |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot firmware and real-time control code in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP execution with deterministic 90 ns read latency and 20-year data retention. Use Value: Eliminates need for external RAM loading; supports field firmware updates via sector-erase granularity and hardware ECC. | Use Scenario: Hosting safety-critical boot code and sensor calibration tables in automotive camera ECU modules certified to AEC-Q100 Grade 2. IC Role / Device Role / Timing Role: Qualified parallel NOR flash with –40°C to +105°C operation and 100,000-cycle endurance for mission-critical startup sequences. Use Value: Meets ASIL-B functional safety requirements through built-in ECC, sector lock protection, and CFI-based validation. |
| Medical Imaging System BIOS | Telecom Base Station Configuration |
Use Scenario: Holding diagnostic firmware and hardware initialization routines in portable ultrasound devices requiring regulatory compliance and long service life. IC Role / Device Role / Timing Role: High-reliability boot ROM with 20-year data retention and hardware ECC to prevent silent corruption in safety-class systems. Use Value: Reduces qualification burden by eliminating need for external error-checking logic or redundant storage schemes. | Use Scenario: Storing FPGA configuration bitstreams and runtime parameters in 5G radio units deployed in outdoor cabinets with wide thermal cycling. IC Role / Device Role / Timing Role: Industrial-grade parallel flash with Versatile I/O (1.65–3.6 V) interfacing to multi-rail FPGAs and PMICs. Use Value: Enables single-component solution across diverse board-level voltage domains without level-shifting circuitry. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GS11TFIV10 | Same die, 56-pin TSOP package instead of 64-ball LAE BGA | Larger footprint, less suitable for space-constrained telecom or automotive modules | Select when board layout prioritizes reworkability over miniaturization |
| S29GL01GS10DHIV10 | Identical package and pinout, but rated for Industrial (–40°C to +85°C) not Automotive Grade 2 | Not AEC-Q100 qualified; lacks extended temperature validation and screening | Select for cost-sensitive industrial applications where +105°C operation is unnecessary |
Compared with S29GL01GS11TFIV10 and S29GL01GS10DHIV10, the S29GL01GS11DHIV10 uniquely combines AEC-Q100 Grade 2 qualification, LAE BGA packaging for high-density routing, and identical electrical performance-making it optimal for automotive and harsh-environment designs requiring both reliability and compactness.
Availability
S29GL01GS11DHIV10 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system BIOS requiring stable component supply across extended product lifecycles.
Supply support for S29GL01GS11DHIV10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, with global R&D and manufacturing infrastructure.
The GL-S family targets high-reliability embedded systems needing fast, dense, and robust non-volatile code storage-designed specifically for XIP-capable microcontrollers in automotive, industrial, and medical applications.
FAQ
Is S29GL01GS11DHIV10 pin-compatible with earlier S29GLxxxS generations?
Yes, it maintains identical pinout and command set compatibility with S29GL512S, S29GL256S, and S29GL128S within the same package variant. Address bus width scales with density (A25 active only for 1 Gb), but all control and data pins retain function and timing alignment per JEDEC-standard parallel NOR protocols.
Does this device support burst read or synchronous interface modes?
No. S29GL01GS11DHIV10 is strictly asynchronous and does not support burst, clocked, or DDR modes. It relies on CE#, OE#, and WE# handshaking for all operations, with page-mode read offering accelerated access only within 32-byte aligned boundaries-not true burst behavior.
What is the role of the STB pin shown in the block diagram?
The STB (Strobe) pins are internal signals used exclusively within the chip's Y-decoder and gating logic; they are not exposed as package terminals. No external connection or control is required-the device uses standard CE#/OE#/WE# protocol without additional strobes.
Can the OTP region be reprogrammed after locking?
No. Once either OTP lock bit is set (via specific CFI command sequence), that region becomes permanently read-only. The two lockable sections operate independently, allowing one region to remain programmable while the other is secured-enabling staged key provisioning in secure boot implementations.
S29GL01GS11DHIV10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL01GS11DHIV10 FAQ
1.How can I place an order for S29GL01GS11DHIV10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GS11DHIV10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GS11DHIV10 reliable?
The price and inventory of S29GL01GS11DHIV10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS11DHIV10 is usually 5 days.
3.What payment methods are accepted for S29GL01GS11DHIV10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS11DHIV10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GS11DHIV10?
S29GL01GS11DHIV10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GS11DHIV10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GS11DHIV10?
For technical support, including S29GL01GS11DHIV10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS11DHIV10 requirements.
6.How does Aetrix verify that S29GL01GS11DHIV10 is sourced from the original manufacturer or authorized distributors?
All S29GL01GS11DHIV10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS11DHIV10 meets industry standards.
7.What is the process for return or replacement of S29GL01GS11DHIV10?
All S29GL01GS11DHIV10 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS11DHIV10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GS11DHIV10 part is unused and in its original packaging.
Return procedure for S29GL01GS11DHIV10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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