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Infineon Technologies S29GL01GS11DHIV13
- Part No.:
- S29GL01GS11DHIV13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GS11DHIV13.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,365
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Product details
Overview
S29GL01GS11DHIV13 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 3.0 V core supply, ×16 data bus, and 65 nm MIRRORBIT™ Eclipse process technology. It delivers 90 ns random access time and 15 ns page access time, supports 512-byte buffer programming, internal single-bit ECC, and uniform 128 kB sector erase - deployed in automotive instrument clusters requiring fast XIP boot code execution and robust data retention.
For engineers reviewing the S29GL01GS11DHIV13 datasheet, S29GL01GS11DHIV13 pinout, S29GL01GS11DHIV13 application, or S29GL01GS11DHIV13 equivalent, key selection criteria include industrial-plus temperature grade (–40°C to +105°C), AEC-Q100 Grade 2 qualification, Versatile I/O (1.65 V to VCC), OTP array support, and CFI-compliant interface for firmware update compatibility.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A25), 32-byte page read architecture, and embedded algorithm controller (EAC) managing program/erase sequences without host CPU intervention. Its dual-voltage I/O (VIO = 1.65 V to VCC) enables direct interfacing with 1.8 V or 3.3 V controllers while maintaining full 3.0 V core operation.
The integrated hardware ECC corrects single-bit errors on-the-fly during read operations and reports uncorrectable multi-bit errors via status register. Sector protection includes volatile (lock bits) and non-volatile (ASP) methods, plus a dedicated 1024-byte OTP array split into two lockable regions for secure boot code or calibration data storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB), organized as 8,388,608 × 16-bit words - supports full firmware images for mid-tier automotive ECUs. |
| Access time (random) | 90 ns at VCC = VIO - enables sub-11 MHz bus timing for legacy microcontroller interfaces without wait states. |
| Page access time | 15 ns - allows burst reads of up to 32 bytes within same page for efficient instruction fetch in XIP mode. |
| Programming buffer | 512 bytes - reduces average programming time by >70% vs. single-word writes for firmware patching. |
| Erase endurance | 100,000 cycles per sector - validated for over 15 years of field updates in telematics control units. |
| Data retention | 20 years at +85°C - meets long-life requirements for automotive infotainment and ADAS modules. |
| Operating temperature | –40°C to +105°C (Industrial Plus / AEC-Q100 Grade 2) - qualified for under-hood ECU deployment. |
| Versatile I/O range | VIO = 1.65 V to VCC - eliminates level-shifter need when interfacing with 1.8 V SoCs or 3.3 V MCUs. |
Pinout & Package
Package: 64-ball LAE Fortified BGA (9 mm × 9 mm, 0.8 mm pitch). Pinout conforms to Infineon's standard GL-S parallel NOR footprint with ×16 data bus (DQ0–DQ15), address lines A0–A25, and dedicated control signals (CE#, OE#, WE#, RY/BY#, RESET#, WP#).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A25 | Address inputs | 26-bit word-aligned address bus; A25 selects upper half of 1 Gb space - no byte addressing. |
| DQ0–DQ15 | Data I/O bidirectional bus | 16-bit parallel interface; supports both read and write transfers per cycle - no multiplexing. |
| CE# | Chip enable | Active-low chip select; must be asserted before OE#/WE# to enter valid read/write state. |
| OE# | Output enable | Controls output drivers during read; high-Z when deasserted - enables bus sharing. |
| WE# | Write enable | Initiates write/program/erase commands; latches command sequences on falling edge. |
| RY/BY# | Ready/Busy indicator | Open-drain output; low during embedded operations - used for polling or interrupt-driven status monitoring. |
| RESET# | Hardware reset | Asynchronous active-low reset; forces device into reading ID mode and aborts ongoing operations. |
| WP# | Write protect | Hardware sector lock override; disables program/erase when asserted - complements software ASP. |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC engine | Single-bit error correction with automatic detection and status flag - eliminates need for external error-handling logic in safety-critical boot paths. |
| 512-byte write buffer | Enables full-page programming in one command sequence - cuts firmware update time by factor of 4 vs. legacy 16-word buffers. |
| Uniform 128 kB sectors | 1024 identical erase blocks simplify partitioning for OTA update dual-bank schemes and wear leveling. |
| CFI parameter table | Standardized JEDEC-compliant descriptor read at fixed address - enables auto-detection and driver configuration in Linux MTD and U-Boot. |
| Dual-grade qualification | AEC-Q100 Grade 2 (–40°C to +105°C) and Industrial Plus - certified for powertrain and chassis control applications. |
| OTP array | 1024-byte one-time-programmable region with two independent lock bits - secures cryptographic keys or factory calibration data permanently. |
Applications
| Automotive Instrument Cluster | ADAS Domain Controller Boot Memory |
|---|---|
|
Use Scenario: Stores boot firmware and GUI assets for real-time rendering on TFT displays with fail-safe startup requirements. IC Role / Device Role / Timing Role: Primary XIP-executable code storage with deterministic 90 ns random access and hardware ECC for ASIL-B compliance. Use Value: Eliminates external RAM copy step during boot; 20-year data retention ensures calibration data integrity across vehicle lifetime. |
Use Scenario: Holds safety monitor firmware and sensor fusion algorithms updated via secure OTA channels. IC Role / Device Role / Timing Role: Dual-bank update target with sector-level erase isolation - enables atomic firmware swaps without runtime interruption. Use Value: 100,000 erase cycles support >500 field updates over 15 years; OTP region stores root-of-trust keys. |
| Industrial PLC Firmware Storage | Medical Imaging System Configuration Memory |
|
Use Scenario: Retains ladder logic programs and I/O mapping tables across power cycles in harsh factory environments. IC Role / Device Role / Timing Role: Non-volatile program storage with hardware write protection (WP#) and sector lock (ASP) against accidental overwrite. Use Value: Versatile I/O (1.65–3.6 V) interfaces directly with 2.5 V FPGA configuration buses - no level shifters required. |
Use Scenario: Stores DICOM metadata templates, calibration profiles, and regulatory audit logs in FDA-cleared imaging devices. IC Role / Device Role / Timing Role: Secure configuration archive with OTP-locked calibration constants and ECC-protected log entries. Use Value: AEC-Q100 Grade 2 qualification ensures reliability in temperature-controlled medical enclosures; CFI enables automated driver provisioning. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GP11TFIV10 | Same 1 Gb density and 65 nm process, but uses 56-pin TSOP package and lacks AEC-Q100 qualification. | Targeted at industrial control panels with board-level cooling, not automotive under-hood use. | Select when cost-sensitive designs require through-hole assembly and do not need automotive qualification. |
| MX29GL128FDT2I-90G | 128 Mb density, 90 ns access, no built-in ECC, and no OTP array - requires external error handling. | Suitable for non-safety-critical consumer electronics where firmware size fits within 16 MB. | Choose only if system already implements software ECC and firmware image is small enough to fit lower density. |
Compared with S29GL01GP11TFIV10, this part adds AEC-Q100 Grade 2 and BGA packaging for thermal reliability; versus MX29GL128FDT2I-90G, it delivers 8× density, hardware ECC, and OTP security - critical for automotive and medical firmware integrity.
Availability
S29GL01GS11DHIV13 is available at Aetrix Electronics and suitable for automotive instrument clusters, ADAS domain controllers, industrial PLCs, and medical imaging systems requiring stable component supply across extended product lifecycles.
Supply support for S29GL01GS11DHIV13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.
This device belongs to the GL-S MIRRORBIT™ Eclipse flash family, designed specifically for automotive and industrial applications demanding high-density, fast-access, and AEC-Q100-qualified non-volatile memory with integrated data integrity features.
FAQ
Is S29GL01GS11DHIV13 pin-compatible with earlier S29GL01Gxxx variants?
Yes - it shares identical pinout and signal definitions with all S29GL01G-series parts in the 64-ball LAE BGA package. Address lines A0–A25, data bus DQ0–DQ15, and control signals (CE#, OE#, WE#, RY/BY#, RESET#, WP#) match exactly. No PCB redesign is needed when upgrading from S29GL01GS10DHIV10 or S29GL01GS11DHIV10.
Does this device support synchronous read mode?
No - S29GL01GS11DHIV13 operates exclusively in asynchronous mode. All read accesses are controlled by CE#, OE#, and address setup/hold timing per datasheet AC specifications. There is no clock input or DLL circuitry; timing relies solely on static address valid windows and bus turnaround delays.
How is the OTP array accessed and locked?
The 1024-byte OTP array resides at physical address 0x0000_0000 and is accessed using standard CFI command sequences. Locking is performed via two independent 16-bit lock bits: OTP_LOCK0 protects bytes 0–511, OTP_LOCK1 protects bytes 512–1023. Once set, lock bits cannot be cleared - verified by reading status register bit 7 after lock command execution.
What happens during power loss in the middle of a sector erase?
The embedded algorithm controller (EAC) detects VCC drop below POR threshold and halts the erase sequence. The sector enters an undefined state - neither fully erased nor original - and must be re-erased after power restoration. Status register bit 5 (ERS) indicates incomplete erase; recovery requires issuing a new sector erase command after verifying device readiness.
S29GL01GS11DHIV13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL01GS11DHIV13 FAQ
1.How can I place an order for S29GL01GS11DHIV13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GS11DHIV13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GS11DHIV13 reliable?
The price and inventory of S29GL01GS11DHIV13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS11DHIV13 is usually 5 days.
3.What payment methods are accepted for S29GL01GS11DHIV13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS11DHIV13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GS11DHIV13?
S29GL01GS11DHIV13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GS11DHIV13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GS11DHIV13?
For technical support, including S29GL01GS11DHIV13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS11DHIV13 requirements.
6.How does Aetrix verify that S29GL01GS11DHIV13 is sourced from the original manufacturer or authorized distributors?
All S29GL01GS11DHIV13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS11DHIV13 meets industry standards.
7.What is the process for return or replacement of S29GL01GS11DHIV13?
All S29GL01GS11DHIV13 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS11DHIV13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GS11DHIV13 part is unused and in its original packaging.
Return procedure for S29GL01GS11DHIV13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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