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Infineon Technologies S29GL01GS11DHIV20
- Part No.:
- S29GL01GS11DHIV20
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GS11DHIV20.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:576
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Product details
Overview
S29GL01GS11DHIV20 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access and 15 ns page access, and integrates hardware ECC for single-bit error correction - deployed in automotive instrument clusters requiring deterministic boot code storage.
For engineers reviewing the S29GL01GS11DHIV20 datasheet, S29GL01GS11DHIV20 pinout, S29GL01GS11DHIV20 application, or S29GL01GS11DHIV20 equivalent, this device supports CFI-compliant firmware updates, sector-level erase with suspend/resume, and OTP-secured configuration storage in AEC-Q100 Grade 3 environments.
Technical Context
This device implements asynchronous parallel interface logic with dedicated CE#, OE#, and WE# control lines, supporting word-aligned addressing (A0–A25) and 32-byte page reads. Its embedded algorithm controller (EAC) manages all program/erase operations without host CPU intervention.
The internal architecture includes a 512-byte write buffer enabling burst programming at up to 1.5 MBps, plus a 1024-byte one-time-programmable (OTP) array with dual lockable regions for secure boot keys and calibration data.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB), organized as 8,388,608 × 16-bit words - supports full firmware image storage for mid-tier automotive ECUs. |
| Access time (random) | 90 ns at VCC = VIO - enables direct XIP execution of boot code without external cache latency penalties. |
| Page access time | 15 ns - allows rapid sequential reads within 32-byte aligned pages during firmware decompression or table lookups. |
| Write buffer size | 512 bytes - reduces effective programming time by batching up to 256 words per command, critical for OTA update efficiency. |
| ECC capability | Internal hardware single-bit error correction - eliminates need for external ECC logic in safety-critical boot ROM paths. |
| Endurance & retention | 100,000 program/erase cycles; 20-year data retention - meets ASIL-B functional safety requirements for nonvolatile configuration storage. |
| Operating temperature | –40°C to +85°C (Industrial Plus grade) - qualified per AEC-Q100 Grade 3 for under-hood automotive applications. |
Pinout & Package
Package: 56-pin TSOP (Type I, 400 mil width), JEDEC MO-141AC compliant. Pin count and layout match industry-standard parallel NOR footprint for drop-in replacement in legacy designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A25 | Address inputs | 26-bit address bus supporting full 128 MB address space; A25 is MSB for 1 Gb density. |
| DQ0–DQ15 | Data I/O bus | 16-bit bidirectional data path; supports word-wide reads/writes with no byte-lane splitting required. |
| CE# | Chip enable | Active-low chip select; controls device power state and enables multi-chip addressing in stacked memory configurations. |
| OE# | Output enable | Active-low read strobe; gates output drivers independently of CE# to support interleaved read timing. |
| WE# | Write enable | Active-low write strobe; initiates internal program/erase algorithms when combined with valid command sequences. |
| RY/BY# | Ready/Busy indicator | Open-drain status signal; low during embedded operations (program/erase), high when ready for next command. |
| RESET# | Hardware reset | Active-low asynchronous reset that aborts ongoing operations and returns device to read mode within 100 µs. |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65 V to VCC - enables direct interfacing with 1.8 V or 3.3 V SoCs without level shifters. |
| Uniform 128 kB sectors | 1024 individually erasable sectors - simplifies firmware partitioning and supports atomic OTA update rollback. |
| Advanced sector protection (ASP) | Volatile and non-volatile locking per sector - prevents accidental overwrite of bootloader or calibration data during field servicing. |
| CFI parameter table | Standardized JEDEC JESD68 query structure - enables automatic detection and configuration by generic flash programming tools. |
| Suspend/resume capability | Interrupts active program/erase to service high-priority reads - essential for real-time diagnostics during background firmware updates. |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
|
Use Scenario: Storing calibrated gauge graphics, driver-assist UI assets, and boot firmware in digital dashboards. IC Role / Device Role / Timing Role: Primary boot ROM and overlay memory mapped via AXI bus with deterministic 90 ns read latency. Use Value: Hardware ECC ensures integrity of safety-critical startup code; ASP prevents corruption during CAN-based firmware updates. |
Use Scenario: Holding ladder logic runtime images and configuration databases in modular control cabinets. IC Role / Device Role / Timing Role: Nonvolatile storage for field-upgradable firmware accessed via parallel bus on ARM Cortex-M7-based controllers. Use Value: 512-byte write buffer accelerates partial reprogramming of logic modules; 20-year retention avoids recalibration drift. |
| Medical Imaging Bootloader | Avionics Display System |
|
Use Scenario: Securing boot sequence and DICOM metadata lookup tables in portable ultrasound devices. IC Role / Device Role / Timing Role: Trusted boot source with OTP-locked cryptographic keys and sector-protected diagnostic firmware. Use Value: Dual-lock OTP region isolates root-of-trust keys from field-serviceable partitions; AEC-Q100 Grade 3 qualification covers medical thermal profiles. |
Use Scenario: Hosting display initialization code and font glyphs for cockpit multifunction displays (MFDs). IC Role / Device Role / Timing Role: XIP-capable flash executing directly from address space to minimize boot time in DO-178C-certified systems. Use Value: Page-mode read (15 ns) enables rapid glyph rendering; suspend/resume allows concurrent diagnostics without display freeze. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GP11TFIV20 | Same density and core specs, but 64-ball LAE Fortified BGA (9 mm × 9 mm) package - no TSOP footprint compatibility. | Used where board space constraints prohibit TSOP; requires PCB redesign and requalification of signal integrity. | Select only when miniaturization outweighs legacy footprint reuse and thermal management favors BGA. |
| MX29GL128FPTI-90G | 128 Mb density (1/8 capacity), 90 ns access, no integrated ECC, no OTP array - lacks hardware error correction and secure key storage. | Deployed in cost-sensitive industrial HMIs where firmware size fits 16 MB and ECC handled externally. | Choose only if application firmware fits sub-128 MB and system-level ECC implementation is already validated. |
Compared with S29GL01GP11TFIV20, this TSOP variant offers mechanical compatibility with existing sockets and simplified thermal design; versus MX29GL128FPTI-90G, it provides 8× density, built-in ECC, and OTP security - eliminating external error handling and key management overhead.
Availability
S29GL01GS11DHIV20 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLC firmware storage, medical imaging bootloaders, and avionics display systems requiring stable component supply across extended product lifecycles.
Supply support for S29GL01GS11DHIV20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and trusted security solutions, with global R&D centers and ISO/TS 16949-certified wafer fabs.
This part belongs to the GL-S MIRRORBIT™ Eclipse flash family, designed specifically for high-reliability embedded systems demanding fast XIP performance, long-term data integrity, and AEC-Q100-compliant operation in harsh environments.
FAQ
Does S29GL01GS11DHIV20 support both 1.8 V and 3.3 V I/O interfaces?
Yes - its Versatile I/O feature supports VIO from 1.65 V to VCC, allowing direct connection to 1.8 V logic families (e.g., ARM Cortex-A series) or 3.3 V microcontrollers without external level shifters. VIO must be supplied independently and remain within ±5% tolerance during operation.
What is the function of the STB pin on this device?
The STB (Strobe) pin is not present on S29GL01GS11DHIV20 - it appears only on certain S29GLxxxP BGA variants. This TSOP version uses standard CE#/OE#/WE# control signals and has no STB pin; pin 1 is NC (No Connect) per the 56-pin TSOP pinout diagram in Section 12.1 of the datasheet.
Can the OTP array be reprogrammed after initial lock?
No - the 1024-byte OTP array supports only one-time programming per bit. Once a sector is locked (via dedicated command), its contents become permanently read-only. Unlocking is impossible; the lock state is stored in nonvolatile fuses and survives power cycles and resets.
How does suspend/resume affect active erase operations?
Suspend halts an ongoing sector erase after completing the current erase pulse (typically <100 ms), preserving all partially erased cells in a known, readable state. Resume restarts from the exact point of suspension - no data loss or timing penalty occurs, and the RY/BY# signal returns high within 2 µs of suspend command acceptance.
S29GL01GS11DHIV20 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL01GS11DHIV20 FAQ
1.How can I place an order for S29GL01GS11DHIV20 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GS11DHIV20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GS11DHIV20 reliable?
The price and inventory of S29GL01GS11DHIV20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS11DHIV20 is usually 5 days.
3.What payment methods are accepted for S29GL01GS11DHIV20?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS11DHIV20 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GS11DHIV20?
S29GL01GS11DHIV20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GS11DHIV20 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GS11DHIV20?
For technical support, including S29GL01GS11DHIV20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS11DHIV20 requirements.
6.How does Aetrix verify that S29GL01GS11DHIV20 is sourced from the original manufacturer or authorized distributors?
All S29GL01GS11DHIV20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS11DHIV20 meets industry standards.
7.What is the process for return or replacement of S29GL01GS11DHIV20?
All S29GL01GS11DHIV20 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS11DHIV20, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GS11DHIV20 part is unused and in its original packaging.
Return procedure for S29GL01GS11DHIV20:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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