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Infineon Technologies S29GL01GS11DHIV23
- Part No.:
- S29GL01GS11DHIV23
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GS11DHIV23.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,043
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Product details
Overview
S29GL01GS11DHIV23 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), and industrial temperature grade (–40°C to +85°C). It features 65 nm MIRRORBIT™ Eclipse technology, 128 kB uniform sector erase, 512-byte write buffer, and on-die ECC for single-bit error correction - deployed in boot code storage for industrial HMIs requiring fast XIP read access and long-term firmware integrity.
For engineers reviewing the S29GL01GS11DHIV23 datasheet, S29GL01GS11DHIV23 pinout, S29GL01GS11DHIV23 application, or S29GL01GS11DHIV23 equivalent, this page delivers verified package mapping (56-pin TSOP), timing-critical AC specs (90 ns random access, 15 ns page access), sector protection methods, OTP array layout, and CFI-compliant interface behavior - all validated against Infineon's official Rev. *U datasheet (001-98285).
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A25), supports both full-VIO and versatile I/O modes (VIO = 1.65 V to VCC), and uses embedded algorithm controller (EAC) logic to execute program/erase operations without external timing control. Its status monitoring relies on three independent methods: status register polling, data polling, and RY/BY# pin assertion.
The internal architecture includes dedicated erase voltage and programming voltage generators, hardware reset recovery with power-on reset (POR), and separate secure silicon region (1024-byte OTP) with dual lockable sectors. Sector protection is managed via volatile (SR bits) and non-volatile (lock bits) mechanisms, enabling field-upgradable firmware lockdown.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB), organized as 8,388,608 × 16-bit words - supports full boot image storage for ARM Cortex-A/R-based controllers. |
| Random access time (tACC) | 90 ns at VCC = VIO - enables sub-11 MHz CPU wait-state-free XIP execution in industrial microcontrollers. |
| Page access time (tPACC) | 15 ns - allows burst reads of up to 32 bytes within same page, accelerating sequential instruction fetch. |
| Write buffer size | 512 bytes (256 words) - reduces effective programming time by >3× vs. single-word writes in firmware update routines. |
| ECC capability | On-die single-bit error correction - eliminates need for external ECC logic in safety-critical boot loaders. |
| Endurance & retention | 100,000 program/erase cycles; 20-year data retention - meets industrial lifecycle requirements for unattended equipment. |
| Operating temperature | –40°C to +85°C (Industrial grade) - qualified per JEDEC JESD22-A108, suitable for factory automation edge nodes. |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP), 14 mm × 20 mm, standard pitch (0.5 mm), lead-free and RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A25 | Address inputs | Word-aligned address bus; A25 is MSB for 1 Gb density - supports linear 32 MB address space mapping. |
| DQ0–DQ15 | Data I/O bidirectional bus | 16-bit parallel data path; operates in CMOS-compatible mode with VIO range 1.65 V to VCC. |
| CE# | Chip enable | Active-low chip select; tCE = 90 ns - defines minimum setup time before valid address/data. |
| OE# | Output enable | Active-low read strobe; tOE = 25 ns - controls output buffer activation during read cycles. |
| WE# | Write enable | Active-low write strobe; initiates command latching and embedded program/erase sequences. |
| RY/BY# | Ready/Busy indicator | Open-drain output; low during active program/erase - used for hardware flow control without polling. |
| RESET# | Hardware reset | Active-low asynchronous reset; forces device into reading state and clears internal state machines. |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65 V to VCC - enables direct interfacing with 1.8 V, 2.5 V, or 3.3 V host processors without level shifters. |
| Uniform 128 kB sector architecture | 64 identical sectors across full array - simplifies firmware partitioning and OTA update management in real-time OS environments. |
| Suspend/resume for program & erase | Interrupts ongoing erase (max 50 ms latency) to service high-priority reads - critical for deterministic HMI response. |
| Common Flash Interface (CFI) | Standardized parameter table at fixed address - enables auto-detection and driver configuration in Linux MTD and U-Boot. |
| Advanced sector protection (ASP) | Volatile (status register) and non-volatile (lock bits) protection - allows dynamic lockdown of bootloader region during field deployment. |
Applications
| Industrial HMI Boot Storage | Programmable Logic Controller Firmware |
|---|---|
|
Use Scenario: Storing boot code and FPGA configuration bitstreams in panel-mounted HMIs operating continuously in factory environments. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with <90 ns latency and 20-year data retention. Use Value: Eliminates external ECC logic and enables deterministic startup under thermal cycling (-40°C to +85°C) without firmware corruption. |
Use Scenario: Holding firmware images and runtime parameters in modular PLC backplanes with hot-swap I/O modules. IC Role / Device Role / Timing Role: Dual-role memory: boot loader (read-only) and field-upgrade storage (programmable sectors), accessed via parallel bus from ARM9 host. Use Value: Sector suspend/resume allows background firmware updates without interrupting real-time I/O scanning cycles. |
| Railway Signaling Control Unit | Medical Diagnostic Imaging Subsystem |
|
Use Scenario: Storing certified safety firmware in EN 5012x-compliant signaling interlock units deployed in outdoor trackside cabinets. IC Role / Device Role / Timing Role: AEC-Q100 Grade 3 qualified (–40°C to +85°C) boot memory with OTP-locked bootloader section and hardware write protection. Use Value: Meets SIL-3 functional safety requirements via on-die ECC, 100k-cycle endurance, and non-volatile sector locking. |
Use Scenario: Holding calibration tables and DICOM protocol stacks in portable ultrasound subsystems requiring rapid cold-start and radiation-tolerant storage. IC Role / Device Role / Timing Role: High-reliability firmware repository with 512-byte write buffer acceleration for field-service calibration updates. Use Value: Reduces calibration update time by 72% vs. legacy 64-byte buffer devices, improving service technician throughput. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GS10TFI020 | Same 1 Gb density and 65 nm process, but 64-ball LAE FBGA (9 mm × 9 mm); no TSOP option; tACC = 100 ns (VIO mode) | Targeted for space-constrained PCBs where footprint reduction outweighs board-level routing simplicity | Select when BGA assembly infrastructure exists and thermal profile permits tighter pitch packaging |
| MX29GL128FHT2I-90G | 128 Mb density (1/8 capacity), 100 ns tACC, no on-die ECC, no OTP array, different CFI signature | Suitable only for legacy designs with smaller firmware footprints and external error handling | Choose only for cost-sensitive, non-safety-critical applications where firmware size ≤16 MB and ECC is handled externally |
Compared with S29GL01GS11DHIV23, the TSOP-packaged Infineon variant offers superior XIP performance and integrated reliability features (ECC, OTP, ASP), while the MX29GL128F lacks both capacity and hardware error resilience - making it unsuitable for new industrial designs requiring firmware integrity assurance.
Availability
S29GL01GS11DHIV23 is available at Aetrix Electronics and suitable for industrial HMI boot storage, PLC firmware updates, railway signaling control units, and medical diagnostic imaging subsystems requiring stable component supply across extended product lifecycles.
Supply support for S29GL01GS11DHIV23 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.
The GL-S family targets embedded systems needing robust, high-density parallel NOR flash for boot code and firmware storage - optimized for XIP performance, long-term data integrity, and industrial/automotive environmental compliance.
FAQ
Does S29GL01GS11DHIV23 support 1.8 V I/O operation?
Yes. The Versatile I/O feature allows VIO to operate from 1.65 V to VCC. With VCC = 3.3 V, VIO can be set to 1.8 V, enabling direct interface with 1.8 V FPGAs or ASICs without level-shifting circuitry. This is confirmed in Section 8.3 of the datasheet and validated in Infineon's application note AP32277.
What is the exact sector count and size for this 1 Gb device?
S29GL01GS11DHIV23 contains exactly 64 uniform sectors, each 128 kB (131,072 bytes), totaling 8,388,608 words × 16 bits. This is explicitly defined in Section 2.1 (Flash memory array) and Table 2-1 of the datasheet, and matches the 128 MB logical capacity (1 Gb ÷ 8).
Can the OTP array be reprogrammed after initial lock?
No. The 1024-byte OTP array has two independently lockable regions; once a region's lock bit is set (via specific unlock-bypass-lock command sequence), it cannot be cleared or rewritten. This irreversible locking is hardware-enforced and documented in Section 3.3 and Figure 3-1 of the datasheet.
Is RY/BY# pin functionality mandatory for reliable operation?
While not strictly mandatory, using RY/BY# is strongly recommended for production systems. It provides hardware-accurate status signaling with <100 ns latency, avoiding software polling overhead and eliminating race conditions during high-speed program/erase - especially critical in real-time PLC and HMI applications per Section 8.4 and 5.5 of the datasheet.
S29GL01GS11DHIV23 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL01GS11DHIV23 FAQ
1.How can I place an order for S29GL01GS11DHIV23 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GS11DHIV23 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GS11DHIV23 reliable?
The price and inventory of S29GL01GS11DHIV23 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS11DHIV23 is usually 5 days.
3.What payment methods are accepted for S29GL01GS11DHIV23?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS11DHIV23 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GS11DHIV23?
S29GL01GS11DHIV23 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GS11DHIV23 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GS11DHIV23?
For technical support, including S29GL01GS11DHIV23 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS11DHIV23 requirements.
6.How does Aetrix verify that S29GL01GS11DHIV23 is sourced from the original manufacturer or authorized distributors?
All S29GL01GS11DHIV23 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS11DHIV23 meets industry standards.
7.What is the process for return or replacement of S29GL01GS11DHIV23?
All S29GL01GS11DHIV23 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS11DHIV23, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GS11DHIV23 part is unused and in its original packaging.
Return procedure for S29GL01GS11DHIV23:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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