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Infineon Technologies S29GL01GS11DHV010
- Part No.:
- S29GL01GS11DHV010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GS11DHV010.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,290
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Product details
Overview
S29GL01GS11DHV010 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 90 ns random access time, and 15 ns page access time. It implements MIRRORBIT™ Eclipse 65 nm technology, features 512-byte write buffer, hardware ECC for single-bit correction, and uniform 128 kB sectors - deployed in automotive instrument clusters requiring fast XIP boot code execution and robust firmware storage.
For engineers reviewing the S29GL01GS11DHV010 datasheet, S29GL01GS11DHV010 pinout, S29GL01GS11DHV010 application, or S29GL01GS11DHV010 equivalent, this device supports asynchronous read, suspend/resume programming/erase, CFI-compliant identification, OTP secure silicon region, and industrial-plus (–40°C to +105°C) operation - critical for deterministic boot timing and long-term firmware integrity in embedded control systems.
Technical Context
This device operates as a non-volatile parallel NOR flash with execute-in-place (XIP) capability, enabling direct CPU instruction fetch without RAM loading. Its architecture includes a dedicated erase voltage generator, programmable sector protection (volatile/non-volatile), and status register polling via RY/BY# pin or data polling on DQ7/DQ6.
The 512-byte programming buffer enables burst writes at up to 1.5 MBps, while 128 kB uniform sectors support fine-grained firmware updates. Internal hardware ECC corrects single-bit errors on-the-fly during read, and the CFI parameter table allows runtime configuration detection by host bootloaders.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 1 Gb (128 MB) - supports full firmware images including bootloader, OS, and application binaries in single-chip footprint. |
| Random Access Time | 90 ns at VCC = VIO - ensures sub-100 ns instruction fetch latency for real-time MCU boot sequences. |
| Page Access Time | 15 ns - enables rapid sequential reads within 32-byte aligned pages, accelerating code execution density. |
| Write Buffer Size | 512 bytes - reduces effective programming time by batching up to 256 words per command, improving firmware update throughput. |
| ECC Capability | Single-bit error correction - maintains data integrity over 20-year retention without external error-handling logic. |
| Endurance | 100,000 program/erase cycles - supports field firmware updates across extended product lifecycle in automotive ECUs. |
| Operating Temperature | –40°C to +105°C (Industrial Plus grade) - qualified for under-hood and dashboard-mounted control units. |
| Supply Voltage | VCC = 2.7–3.6 V, VIO = 1.65–VCC - enables flexible I/O interfacing with 1.8 V or 3.3 V host controllers without level shifters. |
Pinout & Package
Package: 64-ball LAE Fortified BGA (9 mm × 9 mm, 0.8 mm pitch). Pinout validated per Infineon datasheet 001-98285 Rev. *U, Section 12.2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A25 | Address Inputs | 26-bit address bus supporting full 128 MB address space; A25 is MSB for 1 Gb density. |
| DQ0–DQ15 | Data I/O (16-bit) | Bidirectional data bus; supports word-aligned reads/writes; compatible with x16 microcontroller interfaces. |
| CE# | Chip Enable | Active-low chip select; controls device power state and enables internal logic only when asserted. |
| OE# | Output Enable | Active-low read strobe; gates output drivers to prevent bus contention during multi-device configurations. |
| WE# | Write Enable | Active-low signal initiating write/program/erase commands; latches command sequences on rising edge. |
| RY/BY# | Ready/Busy Output | Open-drain status indicator; low = operation in progress, high = ready - used for hardware polling. |
| RESET# | Hardware Reset | Active-low asynchronous reset; forces device into known state and aborts ongoing operations. |
| WP# | Write Protect | Active-low hardware lock for top/bottom sectors; prevents accidental program/erase during power transitions. |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous Page Read | 32-byte aligned page access with 15 ns intra-page cycle time - accelerates linear code execution without cache dependency. |
| Hardware ECC Engine | On-die single-bit error correction with no software overhead - eliminates need for external ECC logic or redundant storage. |
| Uniform 128 kB Sectors | 1024 individually erasable sectors - enables atomic firmware patching and rollback-safe OTA updates. |
| Secure Silicon Region (OTP) | 1024-byte one-time-programmable array with two lockable regions - stores cryptographic keys or calibration data permanently. |
| Versatile I/O (VIO) | Independent VIO supply (1.65–VCC) - allows direct interface to 1.8 V or 3.3 V SoCs without external voltage translation. |
| CFI Compliance | Standard Common Flash Interface parameter table - enables automatic driver initialization and cross-platform firmware portability. |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
|
Use Scenario: Storing boot code, GUI assets, and real-time gauge firmware in digital dashboards with AEC-Q100 Grade 2 qualification. IC Role / Device Role / Timing Role: Primary XIP-capable NOR flash providing deterministic <100 ns instruction fetch for ARM Cortex-R5-based cluster MCUs. Use Value: 90 ns random access and hardware ECC ensure zero-boot-failure startup and 20-year data retention under thermal cycling. |
Use Scenario: Holding firmware and configuration data for DIN-rail mounted programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: Non-volatile storage for safety-critical ladder logic and I/O mapping tables, accessed via parallel bus on ARM9-based controller. Use Value: 100,000 erase cycles and –40°C to +105°C rating enable reliable field updates and decades-long deployment without refresh. |
| Medical Imaging Boot Memory | Avionics Display System |
|
Use Scenario: Hosting boot firmware and diagnostic routines for portable ultrasound devices requiring FDA-compliant firmware integrity. IC Role / Device Role / Timing Role: Secure boot source with OTP-locked calibration constants and ECC-protected kernel image. Use Value: CFI identification and sector protection allow certified bootloader validation and tamper-resistant field upgrades. |
Use Scenario: Storing display firmware and font assets in DO-178C-certified cockpit displays where deterministic read latency is mandatory. IC Role / Device Role / Timing Role: High-reliability parallel flash delivering guaranteed 90 ns access for real-time graphics rendering pipelines. Use Value: Uniform 128 kB sectors and suspend/resume erase support safe firmware swaps mid-operation during flight phases. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GS10DHV010 | Same density and package, but rated for Industrial (–40°C to +85°C) instead of Industrial Plus (–40°C to +105°C). | Lacks extended temperature margin required for under-hood automotive use. | Select when ambient operating temperature remains ≤+85°C and cost optimization is prioritized. |
| MX29GL128FHI-90G | 128 Mb (16 MB), not 1 Gb; 90 ns access; lacks integrated ECC and OTP region. | Insufficient capacity for full firmware images; requires external ECC handling. | Only suitable for legacy designs with smaller code footprints and no security requirements. |
Compared with S29GL01GS11DHV010, the S29GL01GS10DHV010 sacrifices thermal margin for lower cost, while MX29GL128FHI-90G offers reduced density and no on-die ECC - making the original part uniquely suited for high-integrity, high-density, thermally demanding embedded boot applications.
Availability
S29GL01GS11DHV010 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical imaging boot systems, and avionics displays requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S29GL01GS11DHV010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q100 standards.
This device belongs to the GL-S MIRRORBIT™ Eclipse NOR flash product line, engineered for high-reliability embedded boot and firmware storage in automotive, industrial, and aerospace systems demanding XIP performance, long-term data retention, and hardware-level security.
FAQ
Does S29GL01GS11DHV010 support serial interface protocols like SPI or QSPI?
No. This device is a parallel NOR flash with a 16-bit data bus (DQ0–DQ15) and discrete control signals (CE#, OE#, WE#, RY/BY#). It does not implement SPI, QSPI, or any serial command protocol. Interface is strictly asynchronous parallel, requiring full address/data bus connection to a compatible microcontroller or FPGA.
What is the function of the STB pin listed in the block diagram?
The STB (Strobe) pins (STB and STB) are internal test signals used during wafer-level testing and are not connected to package balls. They are not user-accessible, have no functional role in system design, and must be left unconnected in PCB layout per Infineon's design guidelines in Section 12.2 of the datasheet.
Can the OTP region be reprogrammed after initial programming?
No. The 1024-byte OTP (One-Time Programmable) array is physically fused after programming. Once a bit is set to '0', it cannot be changed back to '1'. Each of the two lockable regions can be permanently locked via dedicated commands, preventing further writes - ensuring cryptographic keys or calibration data remain immutable.
How does the Versatile I/O (VIO) feature affect system-level voltage translation?
VIO allows independent supply of the I/O buffers (1.65 V to VCC), enabling direct connection to 1.8 V or 3.3 V host processors without external level shifters. When VIO = 1.8 V, input thresholds and output drive levels conform to 1.8 V logic; when VIO = 3.3 V, they match 3.3 V CMOS levels - simplifying mixed-voltage board design.
S29GL01GS11DHV010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL01GS11DHV010 FAQ
1.How can I place an order for S29GL01GS11DHV010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GS11DHV010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GS11DHV010 reliable?
The price and inventory of S29GL01GS11DHV010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS11DHV010 is usually 5 days.
3.What payment methods are accepted for S29GL01GS11DHV010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS11DHV010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GS11DHV010?
S29GL01GS11DHV010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GS11DHV010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GS11DHV010?
For technical support, including S29GL01GS11DHV010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS11DHV010 requirements.
6.How does Aetrix verify that S29GL01GS11DHV010 is sourced from the original manufacturer or authorized distributors?
All S29GL01GS11DHV010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS11DHV010 meets industry standards.
7.What is the process for return or replacement of S29GL01GS11DHV010?
All S29GL01GS11DHV010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS11DHV010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GS11DHV010 part is unused and in its original packaging.
Return procedure for S29GL01GS11DHV010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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