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Infineon Technologies S29GL01GS11DHV023
- Part No.:
- S29GL01GS11DHV023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GS11DHV023.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,832
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Product details
Overview
S29GL01GS11DHV023 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction-used in boot code storage and firmware execution in industrial controllers.
For engineers reviewing the S29GL01GS11DHV023 datasheet, S29GL01GS11DHV023 pinout, S29GL01GS11DHV023 application, or S29GL01GS11DHV023 equivalent, key selection criteria include its 128-kbyte uniform sector erase architecture, 512-byte write buffer, Versatile I/O (1.65–3.6 V), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and TSOP-56/LAA/LAE/VBU package options.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A25), supports XIP-capable read operations via 32-byte page mode (15 ns intra-page access), and embeds a state-machine-based Embedded Algorithm Controller (EAC) for autonomous program/erase/suspend/resume sequences without external timing control.
It features dual-voltage I/O (VIO independent of VCC), hardware-assisted ECC covering all array reads, and Advanced Sector Protection with volatile/non-volatile lock bits per 128-kbyte sector-enabling secure firmware update partitioning and OTP region locking for calibration data.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 1 Gb (128 MB) organized as 8,388,608 × 16-bit words |
| Access Time | 90 ns random access (VCC = VIO); enables fast boot code fetch in real-time systems |
| Page Read | 32-byte aligned page mode with 15 ns cycle time-reduces average read latency for sequential instructions |
| Write Buffer | 512-byte buffer supporting single-command multi-word programming-cuts firmware update time vs. byte-by-byte writes |
| ECC | On-the-fly single-bit error correction with status reporting-ensures data integrity without software overhead |
| Endurance | 100,000 program/erase cycles per sector-supports field firmware upgrades over 10+ years |
| Data Retention | 20 years at 85°C-validates long-term reliability in unattended industrial deployments |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP-I, Type I), 14 mm × 20 mm, 0.5 mm pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A25 | Address inputs | 26-bit address bus supporting full 128-MB address space (A25 = MSB) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports multiplexed read/write transfers |
| CE# | Chip enable | Active-low device select; controls power-down entry when deasserted |
| OE# | Output enable | Active-low read strobe; gates output drivers during read cycles |
| WE# | Write enable | Active-low write strobe; initiates internal program/erase algorithms |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active embedded operation (low = busy) |
| RESET# | Hardware reset | Active-low asynchronous reset that halts ongoing operations and clears status registers |
| VCC | Core supply | 2.7–3.6 V core voltage powering logic, array, and EAC |
| VIO | I/O supply | 1.65–3.6 V independent I/O rail-enables interfacing with 1.8 V or 3.3 V host processors |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O (VIO) | Independent 1.65–3.6 V I/O rail allows direct connection to mixed-voltage SoCs without level shifters |
| 512-byte Write Buffer | Reduces effective programming time by up to 4× versus single-word writes in firmware update routines |
| Hardware ECC | Single-bit correction with automatic detection-eliminates need for external error-handling firmware |
| Uniform 128-kB Sectors | Enables precise, non-disruptive firmware patching without erasing unrelated application code |
| OTP Array | 1024-byte one-time-programmable region with two lockable sections-secures calibration constants and security keys |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: Non-volatile XIP-capable code storage with deterministic 90 ns read latency for hard real-time task initialization. Use Value: Eliminates external RAM copy step during boot; 20-year data retention ensures firmware persistence across equipment lifecycle. | Use Scenario: Holding safety-critical boot images and sensor calibration data in automotive camera ECUs certified to AEC-Q100 Grade 2. IC Role / Device Role / Timing Role: Secure, high-reliability firmware repository with hardware ECC and OTP lockdown for ASIL-B compliance. Use Value: Meets ISO 26262 requirements via built-in error correction, sector protection, and 100K-cycle endurance for OTA updates. |
| Medical Imaging System BIOS | Telecom Base Station Configuration |
Use Scenario: Hosting diagnostic BIOS and FPGA configuration bitstreams in portable ultrasound devices requiring radiation-tolerant storage. IC Role / Device Role / Timing Role: Radiation-hardened (by process) boot memory with page-mode reads accelerating system self-test sequences. Use Value: 15 ns intra-page access reduces POST time by >30% vs. legacy NOR; AEC-Q100 Grade 2 rating validates thermal stability. | Use Scenario: Storing FPGA configuration, RF calibration tables, and protocol stacks in 5G remote radio units exposed to wide temperature swings. IC Role / Device Role / Timing Role: High-density, thermally robust configuration store supporting -40°C to +105°C operation without derating. Use Value: Uniform 128-kB sectors allow independent update of RF firmware without disrupting baseband processing code. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GS10DHV020 | Same density and package, but rated for Industrial grade (–40°C to +85°C) only; no AEC-Q100 qualification | Lacks automotive temperature range and qualification-unsuitable for under-hood or ADAS use | Select when cost sensitivity outweighs extended temperature or automotive certification needs |
| MX29GL128FPTI-90G | 128 Mb (not 1 Gb); 90 ns access; lacks hardware ECC and Versatile I/O; uses standard 3.3 V I/O only | Lower density limits firmware partitioning; no ECC requires external error handling | Choose only for legacy designs where footprint compatibility and lower cost are prioritized over scalability and reliability |
Compared with S29GL01GS11DHV023, the S29GL01GS10DHV020 sacrifices automotive qualification for lower unit cost, while the MX29GL128FPTI-90G offers reduced density and no ECC-making both less suitable for new designs requiring AEC-Q100 compliance, 1-Gb capacity, or autonomous error correction.
Availability
S29GL01GS11DHV023 is available at Aetrix Electronics and suitable for industrial automation, automotive ADAS modules, and medical imaging systems requiring stable component supply, long-lifecycle support, and AEC-Q100 Grade 2 qualification.
Supply support for S29GL01GS11DHV023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and high-reliability memory solutions for mission-critical applications.
The GL-S family targets embedded systems needing XIP-capable, high-endurance NOR flash with automotive-grade reliability, advanced data protection, and seamless integration into heterogeneous voltage platforms.
FAQ
What is the maximum operating temperature range for S29GL01GS11DHV023?
The S29GL01GS11DHV023 is qualified for Industrial Plus and Automotive Grade 2 operation, supporting continuous operation from –40°C to +105°C. This rating is validated per AEC-Q100 stress test standards and applies to all electrical specifications including access time, program/erase cycles, and data retention.
Does this device support execute-in-place (XIP) functionality?
Yes-S29GL01GS11DHV023 supports true XIP operation via its asynchronous parallel interface and 90 ns random access time. The 32-byte page mode (15 ns intra-page access) further accelerates instruction fetch sequences, enabling direct CPU execution from flash without copying to RAM.
How does the 512-byte write buffer improve firmware update performance?
The 512-byte write buffer allows up to 256 words to be loaded and programmed in a single embedded algorithm cycle. This reduces effective programming time by up to 4× compared to single-word writes, significantly shortening field firmware update windows and minimizing system downtime during maintenance.
Is hardware ECC enabled by default, and how is it reported?
Hardware ECC is always active during read operations and requires no configuration. Single-bit errors are corrected transparently; detection and correction status is reported via the ECC Status Address Space Offset (ASO) register (address 0x001C) and reflected in the Status Register bit [1].
S29GL01GS11DHV023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL01GS11DHV023 FAQ
1.How can I place an order for S29GL01GS11DHV023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GS11DHV023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GS11DHV023 reliable?
The price and inventory of S29GL01GS11DHV023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS11DHV023 is usually 5 days.
3.What payment methods are accepted for S29GL01GS11DHV023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS11DHV023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GS11DHV023?
S29GL01GS11DHV023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GS11DHV023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GS11DHV023?
For technical support, including S29GL01GS11DHV023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS11DHV023 requirements.
6.How does Aetrix verify that S29GL01GS11DHV023 is sourced from the original manufacturer or authorized distributors?
All S29GL01GS11DHV023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS11DHV023 meets industry standards.
7.What is the process for return or replacement of S29GL01GS11DHV023?
All S29GL01GS11DHV023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS11DHV023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GS11DHV023 part is unused and in its original packaging.
Return procedure for S29GL01GS11DHV023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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