Infineon Technologies S29GL01GS11FHB020
- Part No.:
- S29GL01GS11FHB020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GS11FHB020.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,216
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Product details
Overview
S29GL01GS11FHB020 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction. It is used in boot code storage for industrial microcontrollers requiring fast XIP execution and reliable non-volatile program retention.
For engineers reviewing the S29GL01GS11FHB020 datasheet, S29GL01GS11FHB020 pinout, S29GL01GS11FHB020 application, or S29GL01GS11FHB020 equivalent, key selection criteria include its 128-kbyte uniform sector erase granularity, 512-byte write buffer, Versatile I/O (1.65–VCC), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and CFI-compliant command set for firmware update compatibility.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A25), supports both standard and page-mode reads, and uses embedded algorithms for sector erase and buffered programming. Its internal state machine handles command execution, status reporting via RY/BY# pin or status register, and automatic ECC generation/correction during read.
The GL-S architecture separates address decoding (X/Y decoders), voltage generation (for erase/program), and sector protection logic, enabling independent suspend/resume of program and erase operations. Sector-level ASP allows volatile/non-volatile locking per 128-kbyte block, while the 1024-byte OTP array provides secure boot configuration storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB), organized as 8,388,608 × 16-bit words - enables full boot image storage for high-end MCUs. |
| Access time (random) | 90 ns at VCC = VIO - meets real-time boot latency requirements for industrial control systems. |
| Page access time | 15 ns - accelerates sequential instruction fetch in XIP mode across 32-byte aligned pages. |
| Write buffer size | 512 bytes (256 words) - reduces effective programming time by batching writes without host CPU intervention. |
| ECC capability | Internal hardware single-bit error correction - ensures data integrity over 20-year retention without software overhead. |
| Endurance | 100,000 program/erase cycles per sector - supports field firmware updates in telecom and automotive gateways. |
| Operating temperature | –40°C to +105°C (AEC-Q100 Grade 2) - qualified for under-hood automotive ECUs and industrial edge controllers. |
| Supply voltage | VCC = 2.7–3.6 V, VIO = 1.65–VCC - enables interoperability with mixed-voltage SoCs and low-power MCU I/O domains. |
Pinout & Package
Package: 64-ball LAE Fortified BGA (9 mm × 9 mm, 0.8 mm pitch). RoHS-compliant, lead-free, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A25 | Address inputs | 26-bit word-aligned address bus; A25 is MSB for 1 Gb density (8,388,608 words). |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte/word writes and reads with no external byte masking. |
| CE# | Chip enable | Active-low chip select; controls device power state and enables command latching. |
| OE# | Output enable | Active-low read strobe; gates output drivers during read cycles to reduce bus contention. |
| WE# | Write enable | Active-low write strobe; initiates command loading or data programming when CE# and OE# are inactive. |
| RY/BY# | Ready/Busy indicator | Open-drain output; low during embedded operations (erase/program), high when ready for next command. |
| RESET# | Hardware reset | Active-low asynchronous reset; forces device into reading ID mode and aborts ongoing operations. |
| WP# | Write protect | Active-low hardware sector lock override; disables program/erase when asserted, independent of ASP settings. |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65 V to VCC - eliminates level shifters when interfacing with 1.8 V or 3.3 V host processors. |
| Asynchronous page-mode read | 32-byte page access with 15 ns cycle time - improves instruction throughput in XIP applications without burst clocking. |
| Embedded sector erase algorithm | Self-timed 128-kbyte sector erase with suspend/resume - enables real-time task preemption during firmware updates. |
| Common Flash Interface (CFI) | Standardized parameter table at known address - enables OS-agnostic flash drivers and bootloader auto-detection. |
| Secure OTP array | 1024-byte one-time-programmable region with two lockable sectors - stores immutable root keys or calibration data. |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot code and calibrated engine maps in diesel ECU with AEC-Q100 Grade 2 compliance required. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP execution and secure firmware update storage. Use Value: 105°C operation ensures reliability under hood; hardware ECC prevents silent corruption of critical calibration tables. |
Use Scenario: Holding ladder logic runtime and configuration data in modular PLCs deployed in factory automation environments. IC Role / Device Role / Timing Role: High-reliability program memory supporting field firmware upgrades via HMI or Ethernet interface. Use Value: 100,000 erase cycles and 20-year retention guarantee long service life without scheduled replacement. |
| Telecom Base Station Boot ROM | Medical Imaging System BIOS |
Use Scenario: Hosting boot loader and FPGA configuration bitstreams in 5G remote radio units operating continuously at elevated ambient temperatures. IC Role / Device Role / Timing Role: Dual-role memory for boot initialization and runtime firmware patching with minimal latency impact. Use Value: Page-mode read (15 ns) accelerates FPGA reconfiguration; sector protection prevents accidental overwrite during OTA updates. |
Use Scenario: Storing certified diagnostic BIOS and safety-critical startup routines in FDA-regulated MRI controller boards. IC Role / Device Role / Timing Role: Certified non-volatile memory for deterministic boot sequence and tamper-resistant configuration storage. Use Value: OTP array secures cryptographic keys; AEC-Q100 Grade 2 thermal rating validates stability in enclosed medical enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GS10FHJ020 | Same die, 56-pin TSOP package, no AEC-Q100 qualification - rated only for industrial (–40°C to +85°C). | Limited to non-automotive embedded systems where board space permits larger TSOP footprint and thermal margin is sufficient. | Select when cost-sensitive industrial designs require drop-in compatibility but do not need automotive qualification or BGA miniaturization. |
| MX29GL128FPTI-90G | 128 Mb (16 MB) density, 90 ns access, 3.0 V supply, but lacks hardware ECC and OTP array; different command set. | Not suitable for safety-critical or long-life firmware storage; requires external ECC or software mitigation. | Choose only for legacy designs with strict pin compatibility to older MX29GL family and no ECC requirement. |
Compared with S29GL01GS11FHB020, the TSOP variant trades automotive qualification and compact BGA for lower assembly cost, while the MX29GL128F offers smaller capacity and no hardware ECC - making the S29GL01GS11FHB020 uniquely suited for AEC-Q100-compliant, high-density, ECC-dependent boot memory.
Availability
S29GL01GS11FHB020 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware storage, and telecom base station boot ROM applications requiring stable component supply, long-term lifecycle support, and AEC-Q100 Grade 2 qualification.
Supply support for S29GL01GS11FHB020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.
The GL-S family targets high-reliability embedded systems requiring fast XIP execution, robust firmware update capability, and extended temperature operation - specifically engineered for automotive, industrial, and telecom infrastructure applications.
FAQ
Does S29GL01GS11FHB020 support both 1.8 V and 3.3 V I/O interfaces?
Yes. Its Versatile I/O feature supports VIO from 1.65 V to VCC, allowing direct connection to 1.8 V or 3.3 V host processors without level shifters. When VCC is 3.0 V, VIO may be independently set to 1.8 V or 3.0 V, and all input thresholds and output drive strengths adapt accordingly per datasheet Section 8.3.
What is the function of the RY/BY# pin during programming?
RY/BY# is an open-drain ready/busy indicator that goes low during embedded program or erase operations and returns high when the operation completes or is suspended. It provides hardware handshaking for timing-critical hosts and can be polled alongside the status register for precise operation status without continuous command polling.
Can the 1024-byte OTP array be reprogrammed after initial programming?
No. The OTP array is physically one-time programmable: each bit can be written from '1' to '0' only once. Two independent lock bits permanently disable further writes to each 512-byte region. Once locked, no command or voltage sequence can unlock or rewrite the region - ensuring cryptographic key or calibration data immutability.
How does hardware ECC interact with the status register during read operations?
During every read, internal ECC logic checks the retrieved 16-bit word plus associated parity bits. If a single-bit error is detected, it is corrected on-the-fly and the corrected data is output; the status register's ECC bit (bit 6) is set to '1' to indicate correction occurred. No interrupt is generated - correction is transparent and does not stall the read cycle.
S29GL01GS11FHB020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL01GS11FHB020 FAQ
1.How can I place an order for S29GL01GS11FHB020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GS11FHB020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GS11FHB020 reliable?
The price and inventory of S29GL01GS11FHB020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS11FHB020 is usually 5 days.
3.What payment methods are accepted for S29GL01GS11FHB020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS11FHB020 transactions.
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4.How is shipping managed for S29GL01GS11FHB020?
S29GL01GS11FHB020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GS11FHB020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GS11FHB020?
For technical support, including S29GL01GS11FHB020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS11FHB020 requirements.
6.How does Aetrix verify that S29GL01GS11FHB020 is sourced from the original manufacturer or authorized distributors?
All S29GL01GS11FHB020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS11FHB020 meets industry standards.
7.What is the process for return or replacement of S29GL01GS11FHB020?
All S29GL01GS11FHB020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS11FHB020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GS11FHB020 part is unused and in its original packaging.
Return procedure for S29GL01GS11FHB020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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