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Infineon Technologies S29GL01GS11FHIV13
- Part No.:
- S29GL01GS11FHIV13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GS11FHIV13.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,600
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Product details
Overview
S29GL01GS11FHIV13 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It operates across industrial temperature range (–40°C to +85°C) and supports sector erase of uniform 128-kbyte sectors in embedded boot code storage applications.
For engineers reviewing the S29GL01GS11FHIV13 datasheet, S29GL01GS11FHIV13 pinout, S29GL01GS11FHIV13 application, or S29GL01GS11FHIV13 equivalent, key selection criteria include asynchronous read timing, Versatile I/O voltage support (1.65 V to VCC), 512-byte programming buffer throughput, OTP array configuration, and AEC-Q100 grade compatibility for automotive control modules.
Technical Context
This device implements MIRRORBIT™ Eclipse architecture on 65 nm process, enabling simultaneous storage of two bits per cell while maintaining NOR-like random access. Its embedded algorithm controller (EAC) manages autonomous program/erase operations, status monitoring via RY/BY# pin or status register, and suspend/resume capability during active operations.
The flash supports three I/O voltage modes: Full VCC = VIO, VersatileIO with independent VIO (1.65–VCC), and hardware reset-driven power-off protection. Page mode read accesses 32-byte aligned blocks with 15 ns cycle time after initial address setup, and CFI parameter table enables host software auto-configuration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 1 Gb (128 MB) organized as 8,388,608 × 16-bit words |
| Random Access Time | 90 ns at VCC = VIO - determines worst-case instruction fetch latency in XIP systems |
| Page Access Time | 15 ns - enables fast sequential reads within 32-byte aligned pages |
| Programming Buffer | 512 bytes - allows single-command write of up to 256 words, reducing host CPU overhead |
| ECC Support | On-die hardware single-bit error correction - eliminates need for external ECC logic in safety-critical firmware storage |
| Endurance & Retention | 100,000 program/erase cycles; 20-year data retention - validated for long-life industrial firmware updates |
| Operating Temperature | –40°C to +85°C (Industrial grade) - qualified for use in motor control, PLC, and gateway MCU boot memory |
Pinout & Package
Package: 56-pin TSOP (Type I, 14 mm × 20 mm, 0.55 mm pitch). Pinout conforms to standard parallel NOR flash interface with dedicated CE#, OE#, WE#, RESET#, RY/BY#, and 26 address lines (A0–A25) plus 16 bidirectional data lines (DQ0–DQ15).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A25 | Address inputs | Word-aligned addressing; A25 enables full 1 Gb address space (8M × 16) |
| DQ0–DQ15 | Bidirectional data bus | 16-bit parallel interface; supports byte/word writes per JEDEC command set |
| CE# | Chip enable | Active-low device select; controls power state entry and command latching |
| OE# | Output enable | Active-low read strobe; gates output drivers without affecting internal state |
| WE# | Write enable | Active-low write strobe; initiates command loading or data programming |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active program/erase; used for polling or interrupt-driven flow control |
| RESET# | Hardware reset | Asynchronous active-low reset that halts ongoing operations and returns to read mode |
| VCC | Core supply | 3.0 V nominal (2.7–3.6 V); powers core logic, charge pumps, and EAC |
| VIO | I/O supply | Independent 1.65–VCC range; decouples interface voltage from core for mixed-voltage SoC interfacing |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous Page Read | 32-byte aligned page access with 15 ns cycle time - accelerates firmware image streaming in boot ROM contexts |
| Embedded Algorithm Controller (EAC) | Autonomous execution of program/erase/suspend/resume - offloads timing-critical sequences from host processor |
| Advanced Sector Protection (ASP) | Volatile and non-volatile lock bits per 128-kB sector - enables secure bootloader partitioning and field-upgrade isolation |
| One-Time Programmable (OTP) Array | 1024-byte region with two lockable sections - stores cryptographic keys or calibration data irreversibly |
| Common Flash Interface (CFI) | Standardized parameter table accessible via read commands - enables OS/driver auto-detection without hard-coded timing tables |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated engine maps, diagnostic routines, and bootloader code in AEC-Q100 Grade 3 compliant ECUs. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with ≤90 ns latency under transient voltage conditions. Use Value: Hardware ECC ensures firmware integrity after 100K+ reprogramming cycles across 15-year vehicle lifetime. | Use Scenario: Holding firmware images and configuration data for programmable logic controllers operating in factory automation environments. IC Role / Device Role / Timing Role: Parallel NOR flash serving as primary boot device for ARM Cortex-M7-based controllers requiring deterministic startup timing. Use Value: 128-kB uniform sectors allow atomic firmware updates without runtime interruption using suspend/resume commands. |
| Network Gateway Boot Memory | Medical Imaging System Configuration |
Use Scenario: Hosting secure boot firmware and TLS certificate store in industrial Ethernet gateways with dual-redundant flash layout. IC Role / Device Role / Timing Role: Primary boot device with CFI support enabling Linux MTD driver auto-configuration during kernel initialization. Use Value: Versatile I/O (1.65–3.6 V) interfaces directly to 1.8 V or 3.3 V SoC buses without level shifters. | Use Scenario: Storing FPGA configuration bitstreams and calibration profiles in FDA-cleared imaging equipment requiring data retention validation. IC Role / Device Role / Timing Role: High-reliability non-volatile storage for mission-critical configuration data with 20-year retention guarantee. Use Value: OTP array secures device-specific calibration constants against accidental overwrite during service updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GP11FHIV13 | Same density and timing, but uses 64-ball LAE BGA (9 mm × 9 mm) instead of 56-pin TSOP | Preferred for space-constrained PCBs where board area is critical and thermal profile permits BGA reflow | Select when footprint reduction outweighs manual assembly constraints |
| MX29GL128FHT2I-90G | 128 Mb (not 1 Gb); 90 ns access; no integrated ECC; different command set and CFI structure | Limited to smaller firmware images; requires external ECC implementation for functional safety compliance | Consider only for legacy designs with fixed 128 Mb capacity and no ECC requirement |
Compared with S29GL01GP11FHIV13, this TSOP variant offers easier prototyping and rework, while MX29GL128FHT2I-90G lacks both density and on-die ECC-making it unsuitable for new automotive or industrial designs requiring >512 MB firmware or ISO 26262 alignment.
Availability
S29GL01GS11FHIV13 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware upgrades, and medical imaging system configuration storage requiring stable component supply across extended product lifecycles.
Supply support for S29GL01GS11FHIV13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and IoT markets.
The GL-S family targets high-reliability embedded systems requiring XIP-capable NOR flash with robust data integrity, extended temperature operation, and automotive qualification - specifically designed for boot code and firmware storage where deterministic timing and long-term retention are mandatory.
FAQ
What is the maximum supported VIO voltage for S29GL01GS11FHIV13?
The device supports VIO from 1.65 V up to VCC, with VCC rated 2.7–3.6 V. Therefore, maximum VIO is 3.6 V when VCC is at its upper limit. This Versatile I/O feature allows direct interfacing with 1.8 V, 2.5 V, or 3.3 V host processors without external level shifters, provided VIO remains within the specified range relative to VCC.
Does S29GL01GS11FHIV13 support true random access or only page-mode reads?
S29GL01GS11FHIV13 supports both true random access (90 ns tACC) and page-mode reads (15 ns tPACC within 32-byte pages). Initial access to any word address initiates a full row decode and delivers 32 bytes; subsequent accesses to addresses within the same page require only column decoding, achieving faster cycle times without host-side buffering.
How is the 1024-byte OTP array structured and protected?
The OTP array consists of one 1024-byte block divided into two independently lockable 512-byte regions. Once locked via dedicated CFI commands, each region becomes permanently read-only. Locking is irreversible and persists through power cycles, making it suitable for storing immutable keys or calibration data that must survive field updates and security audits.
Can S29GL01GS11FHIV13 be used in AEC-Q100 Grade 2 automotive applications?
No - S29GL01GS11FHIV13 is specified for Industrial (–40°C to +85°C) and Automotive Grade 3 (–40°C to +85°C) operation. AEC-Q100 Grade 2 requires –40°C to +105°C operation, which is supported by other variants in the GL-S family (e.g., S29GL01GS12FHIV13), but not this specific part number as indicated in the ordering information table.
S29GL01GS11FHIV13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL01GS11FHIV13 FAQ
1.How can I place an order for S29GL01GS11FHIV13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GS11FHIV13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GS11FHIV13 reliable?
The price and inventory of S29GL01GS11FHIV13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS11FHIV13 is usually 5 days.
3.What payment methods are accepted for S29GL01GS11FHIV13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS11FHIV13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GS11FHIV13?
S29GL01GS11FHIV13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GS11FHIV13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GS11FHIV13?
For technical support, including S29GL01GS11FHIV13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS11FHIV13 requirements.
6.How does Aetrix verify that S29GL01GS11FHIV13 is sourced from the original manufacturer or authorized distributors?
All S29GL01GS11FHIV13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS11FHIV13 meets industry standards.
7.What is the process for return or replacement of S29GL01GS11FHIV13?
All S29GL01GS11FHIV13 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS11FHIV13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GS11FHIV13 part is unused and in its original packaging.
Return procedure for S29GL01GS11FHIV13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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