Infineon Technologies S29GL01GS11FHIV23
- Part No.:
- S29GL01GS11FHIV23
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GS11FHIV23.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,750
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Product details
Overview
S29GL01GS11FHIV23 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 3.0 V core supply, ×16 data bus, and MIRRORBIT™ Eclipse 65 nm process technology. It delivers 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. Designed for embedded boot code storage in industrial and automotive systems, it supports uniform 128-kbyte sector erase and 512-byte buffer programming.
For engineers reviewing the S29GL01GS11FHIV23 datasheet, S29GL01GS11FHIV23 pinout, S29GL01GS11FHIV23 application, or S29GL01GS11FHIV23 equivalent, key selection criteria include its 1 Gb density, Versatile I/O (1.65 V–VCC), AEC-Q100 Grade 2 qualification (–40°C to +105°C), 100,000 program/erase cycles, and support for suspend/resume during erase and program operations.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A25), 32-byte page read capability, and hardware-managed ECC that corrects single-bit errors on-the-fly during read. Its Embedded Algorithm Controller (EAC) executes internal program and erase sequences without host intervention.
The GL-S architecture separates command execution from data transfer via dedicated control pins (CE#, OE#, WE#), supports status monitoring via RY/BY# pin or status register polling, and enables sector-level protection using volatile/non-volatile ASP methods plus a 1024-byte OTP array with dual lockable regions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 1 Gb (128 MB); provides sufficient space for full firmware images and configuration data in resource-constrained embedded hosts. |
| Random Access Time | 90 ns at VCC = VIO; enables fast XIP execution of boot code directly from flash without RAM copy. |
| Page Access Time | 15 ns; allows rapid sequential reads within 32-byte aligned pages, improving throughput for linear code fetch. |
| Programming Buffer | 512 bytes; reduces effective programming time by batching writes, critical for field firmware updates. |
| ECC Support | Hardware single-bit error correction; ensures data integrity over 20-year retention without software overhead. |
| Endurance | 100,000 program/erase cycles per sector; supports frequent OTA update scenarios in industrial gateways. |
| Operating Temp | –40°C to +105°C (AEC-Q100 Grade 2); qualified for under-hood automotive ECUs and high-ambient industrial controllers. |
| Versatile I/O Range | 1.65 V to VCC; simplifies interface to mixed-voltage SoCs without level shifters. |
Pinout & Package
Package: 64-ball LAE Fortified BGA (9 mm × 9 mm, 0.8 mm pitch). Pinout validated per Infineon datasheet 001-98285 Rev. *U, Section 12.2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A25 | Address Inputs | 26-bit word address bus; A25 is MSB for 1 Gb density (226 × 16 bits = 1 Gb). |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte/word writes and reads with no external data width conversion. |
| CE# | Chip Enable | Active-low enable for device selection; controls power state and command latching timing. |
| OE# | Output Enable | Active-low control for output drivers; used to gate read data onto DQ bus without affecting internal state. |
| WE# | Write Enable | Active-low strobe for write cycles; initiates command loading or data programming based on address sequence. |
| RY/BY# | Ready/Busy Output | Open-drain status indicator; low during embedded operations (program/erase), high when ready for next command. |
| RESET# | Hardware Reset | Active-low asynchronous reset; forces device into known state and aborts ongoing operations. |
| VCC | Core Supply | 3.0 V ±10% supply (2.7–3.6 V); powers core logic and internal voltage generators for program/erase. |
| VIO | I/O Supply | Independent 1.65–3.6 V supply; decouples I/O signaling from core voltage for mixed-voltage system integration. |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC | On-die single-bit error correction with automatic detection and correction during read, eliminating need for host-side ECC logic. |
| Buffer Programming | 512-byte write buffer enables up to 256-word programming in one command, reducing host CPU overhead and flash wear. |
| Suspend/Resume | Allows interrupting erase or program operations to service higher-priority reads, essential for real-time boot loaders. |
| Advanced Sector Protection | Volatile and non-volatile locking per 128-kbyte sector, plus OTP region with two independently lockable 512-byte blocks. |
| Common Flash Interface | Standardized CFI parameter table enables automatic driver detection and configuration in generic flash abstraction layers. |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot firmware and calibration maps in engine management systems requiring AEC-Q100 compliance. IC Role / Device Role / Timing Role: Non-volatile boot memory with XIP capability and deterministic 90 ns read latency for real-time startup. Use Value: AEC-Q100 Grade 2 rating ensures operation at +105°C ambient; 100,000-cycle endurance supports recalibration updates over vehicle lifetime. |
Use Scenario: Holding firmware and configuration data in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Primary code storage with sector protection to prevent accidental overwrite of critical runtime parameters. Use Value: Hardware ECC guarantees data integrity across 20-year product lifecycle; Versatile I/O simplifies interface to 1.8 V/3.3 V FPGA-based control logic. |
| Telecom Base Station Boot Memory | Medical Imaging System Configuration Store |
Use Scenario: Hosting bootloader and FPGA bitstreams in 5G radio units where fast cold-start recovery is required. IC Role / Device Role / Timing Role: High-speed parallel NOR flash enabling sub-100 ms firmware load before RF initialization. Use Value: 15 ns page access time accelerates sequential instruction fetch; 512-byte buffer speeds field-upgrade programming. |
Use Scenario: Securing calibration profiles and safety-critical configuration settings in diagnostic imaging equipment. IC Role / Device Role / Timing Role: Tamper-resistant storage with OTP lockable regions for regulatory-compliant parameter archiving. Use Value: Dual-lock OTP array prevents unauthorized modification of FDA/IEC 62304-mandated settings; sector protection isolates user-accessible fields. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GP11FHIV23 | Same density and package, but uses standard (non-Fortified) BGA; lacks reinforced solder joint reliability for automotive thermal cycling. | Not AEC-Q100 qualified; suitable only for commercial/industrial use below +85°C ambient. | Select only if cost sensitivity outweighs automotive qualification and long-term thermal reliability requirements. |
| MX29GL128FHT2I-90G | 128 Mb density (1/8 capacity), 90 ns access, same 3.0 V supply and ×16 bus; no integrated ECC or Versatile I/O. | Lacks hardware ECC and OTP security features; requires external error handling and level shifting for mixed-voltage designs. | Consider only for legacy designs with lower density needs and where ECC is implemented in software or external logic. |
Compared with S29GL01GP11FHIV23 and MX29GL128FHT2I-90G, the S29GL01GS11FHIV23 uniquely combines AEC-Q100 Grade 2 qualification, hardware ECC, Versatile I/O, and 1 Gb density in a Fortified BGA-making it the only option meeting full automotive ECU and high-reliability industrial firmware storage requirements.
Availability
S29GL01GS11FHIV23 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware deployment, and telecom base station boot memory applications requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S29GL01GS11FHIV23 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and non-volatile memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.
The GL-S family targets high-reliability embedded systems needing fast XIP-capable flash with automotive-grade robustness, integrating MIRRORBIT™ Eclipse technology to balance density, speed, and endurance in a single 3.0 V supply device.
FAQ
What is the maximum operating temperature range for S29GL01GS11FHIV23?
The S29GL01GS11FHIV23 is rated for –40°C to +105°C and qualified to AEC-Q100 Grade 2. This specification is confirmed in the "Temperature range / grade" section of the official Infineon datasheet 001-98285 Rev. *U, page 1. It supports under-hood automotive applications and high-ambient industrial environments without derating.
Does this device require separate VCC and VIO supplies?
Yes - S29GL01GS11FHIV23 mandates independent VCC (2.7–3.6 V for core logic) and VIO (1.65–VCC for I/O buffers). This Versatile I/O architecture is documented in Section 1.1 ("General description") and Table 10.5 ("DC characteristics") of the datasheet, enabling direct interfacing with 1.8 V or 3.3 V host processors without external level shifters.
How does the 512-byte programming buffer improve write performance?
The buffer allows up to 256 words (512 bytes) to be loaded before initiating internal programming, reducing host overhead and total programming time. Per datasheet Section 1.1 and Table 5.7, effective buffer programming rate reaches 1.5 MBps - significantly faster than single-word programming, especially for firmware patching and field updates.
Is hardware ECC enabled by default, and can it be disabled?
Hardware ECC is always active during read operations and cannot be disabled; it operates transparently in the data path. As stated in Section 1.1 ("Distinctive characteristics") and Section 5.3 ("Automatic ECC"), single-bit correction is performed automatically on every read, with uncorrectable multi-bit errors flagged via status register bit SR7. No configuration register controls this feature.
S29GL01GS11FHIV23 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL01GS11FHIV23 FAQ
1.How can I place an order for S29GL01GS11FHIV23 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GS11FHIV23 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GS11FHIV23 reliable?
The price and inventory of S29GL01GS11FHIV23 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS11FHIV23 is usually 5 days.
3.What payment methods are accepted for S29GL01GS11FHIV23?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS11FHIV23 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GS11FHIV23?
S29GL01GS11FHIV23 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GS11FHIV23 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GS11FHIV23?
For technical support, including S29GL01GS11FHIV23 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS11FHIV23 requirements.
6.How does Aetrix verify that S29GL01GS11FHIV23 is sourced from the original manufacturer or authorized distributors?
All S29GL01GS11FHIV23 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS11FHIV23 meets industry standards.
7.What is the process for return or replacement of S29GL01GS11FHIV23?
All S29GL01GS11FHIV23 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS11FHIV23, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GS11FHIV23 part is unused and in its original packaging.
Return procedure for S29GL01GS11FHIV23:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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