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Infineon Technologies S29GL01GS11FHV023
- Part No.:
- S29GL01GS11FHV023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GS11FHV023.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,367
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Product details
Overview
S29GL01GS11FHV023 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It operates across industrial temperature range (–40°C to +85°C) and supports sector erase of uniform 128-kbyte sectors in embedded boot code storage applications.
For engineers reviewing the S29GL01GS11FHV023 datasheet, S29GL01GS11FHV023 pinout, S29GL01GS11FHV023 application, or S29GL01GS11FHV023 equivalent, key selection factors include its 512-byte programming buffer, Versatile I/O (1.65–VCC VIO), CFI compliance, ASP sector protection, and OTP array - all critical for automotive and industrial firmware storage designs requiring AEC-Q100 Grade 3 qualification.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A25), supporting both standard and page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations autonomously, including suspend/resume capability and status monitoring via status register, data polling, or RY/BY# pin.
The MIRRORBIT™ Eclipse architecture on 65 nm process enables high-density non-volatile storage with 100,000 program/erase cycles and 20-year data retention. Internal hardware ECC corrects single-bit errors on-the-fly during read, while the separate 1024-byte OTP array provides two lockable regions for secure configuration or calibration data storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 1 Gb (128 MB); supports full boot image storage for mid-to-high-end microcontrollers |
| Interface | Parallel ×16 asynchronous; requires no clock signal, simplifies timing-critical boot path design |
| Access Time | 90 ns random / 15 ns page; enables fast XIP execution and rapid firmware load from reset vector |
| Programming Buffer | 512 bytes; reduces effective programming time by batching up to 256 words per command |
| ECC | Hardware single-bit correction; eliminates need for external error-handling logic in safety-critical systems |
| Endurance & Retention | 100,000 cycles / 20 years; meets long-life requirements for industrial control and automotive ECUs |
| Temperature Grade | Industrial (–40°C to +85°C); qualified per AEC-Q100 Grade 3 for under-hood automotive use |
Pinout & Package
Package: 56-pin TSOP (Type I, 14 mm × 20 mm, 0.55 mm pitch). Compatible with standard PCB assembly processes and legacy socketed boot memory layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A25 | Address inputs | 26-bit address bus; A25 enabled for 1 Gb density (AMAX = A25) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports word-wide transfers only |
| CE# | Chip enable | Active-low chip select; controls device power state and command decoding |
| OE# | Output enable | Active-low gate for data output; used during read operations |
| WE# | Write enable | Active-low strobe for write/program/erase command latching |
| RY/BY# | Ready/Busy indicator | Open-drain output; signals active programming/erasing (low) or ready (high) |
| RESET# | Hardware reset | Active-low asynchronous reset; forces device into reading state and clears internal state |
| VCC | Core supply | 3.0 V ±10% supply for core logic and memory array; powers all internal functions |
| VIO | I/O supply | 1.65 V to VCC; decouples I/O voltage from core, enabling mixed-voltage system interfacing |
Key Features
| Feature | Design Value |
|---|---|
| Page-mode read (32-byte aligned) | 15 ns access within same page; accelerates sequential instruction fetch in XIP applications |
| Advanced sector protection (ASP) | Volatile and non-volatile locking per 128-kB sector; prevents accidental firmware overwrite in field-deployed units |
| Secure OTP array (1024 B) | Two independently lockable regions; stores immutable calibration data or cryptographic keys without risk of reprogramming |
| Common Flash Interface (CFI) | Standardized parameter table at known address; enables automatic driver detection and configuration in bootloader software |
| Suspend/resume for program & erase | Allows interrupting long-duration operations to service higher-priority reads; essential for real-time OS environments |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated engine maps, diagnostic routines, and boot firmware in AEC-Q100 Grade 3 compliant ECU modules. IC Role / Device Role / Timing Role: Non-volatile boot memory with XIP capability and deterministic 90 ns read latency for immediate post-reset execution. Use Value: Hardware ECC ensures firmware integrity over 15+ year vehicle lifetime; ASP prevents unauthorized reflash during service operations. | Use Scenario: Holding firmware, configuration tables, and HMI assets in programmable logic controllers deployed in factory automation. IC Role / Device Role / Timing Role: Primary parallel flash for deterministic boot and runtime code execution in real-time control loops. Use Value: 512-byte programming buffer enables fast field updates; wide VIO range (1.65–3.6 V) simplifies integration with diverse 2.5 V/3.3 V I/O subsystems. |
| Medical Imaging System Boot ROM | Avionics Data Recorder Memory |
Use Scenario: Hosting boot loader and safety-critical initialization code in FDA-regulated imaging devices requiring traceable firmware integrity. IC Role / Device Role / Timing Role: Certified non-volatile memory with 20-year data retention and hardware ECC for fault-tolerant startup sequence. Use Value: OTP array securely stores device-specific calibration constants; CFI support enables automated firmware validation during pre-flight diagnostics. | Use Scenario: Recording flight-critical telemetry and storing certified avionics software in DO-178C-compliant black box systems. IC Role / Device Role / Timing Role: High-reliability parallel flash with AEC-Q100 Grade 2 option (–40°C to +105°C) for extended thermal operation. Use Value: Sector erase granularity (128 kB) allows selective firmware patching without full reflash; suspend/resume avoids data loss during power interruption. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GP11FHVS13 | Same density and timing, but uses 64-ball LAE Fortified BGA (9 mm × 9 mm); no TSOP option | Targeted at space-constrained PCBs where footprint reduction outweighs TSOP compatibility needs | Select when board layout prioritizes miniaturization over legacy socket compatibility |
| MX29GL128FHT2I-90G | 128 Mb (not 1 Gb); 90 ns access; lacks hardware ECC and OTP array; different command set | Suitable for cost-sensitive, lower-density boot storage where ECC and security features are optional | Choose only if firmware size ≤16 MB and error resilience is handled externally |
Compared with S29GL01GP11FHVS13, the TSOP package of S29GL01GS11FHV023 enables easier prototyping and repair; versus MX29GL128FHT2I-90G, it delivers 8× density, built-in ECC, and OTP security - making it suitable for safety-certified, long-lifecycle deployments where firmware integrity is non-negotiable.
Availability
S29GL01GS11FHV023 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware upgrades, and medical imaging system manufacturing requiring stable component supply across multi-year production cycles.
Supply support for S29GL01GS11FHV023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and high-reliability memory solutions for mission-critical systems.
The GL-S family targets embedded boot code and firmware storage in automotive, industrial, and medical applications where deterministic timing, long-term data integrity, and AEC-Q100 compliance are mandatory design requirements.
FAQ
Does S29GL01GS11FHV023 support execute-in-place (XIP) operation?
Yes, it supports true XIP operation due to its fast 90 ns random access time and asynchronous parallel interface. The device allows direct CPU instruction fetch from flash without copying to RAM, reducing boot latency and SRAM usage in resource-constrained embedded systems.
What is the function of the Versatile I/O (VIO) supply pin?
VIO sets the voltage level for all input/output buffers independently of VCC, ranging from 1.65 V to VCC. This enables seamless interfacing with mixed-voltage SoCs or FPGAs operating at 1.8 V, 2.5 V, or 3.3 V I/O levels while maintaining 3.0 V core operation for optimal memory performance and reliability.
How does the 512-byte programming buffer improve system-level performance?
The buffer allows up to 512 bytes (256 words) to be loaded before initiating a single program operation, reducing bus arbitration overhead and total programming time by up to 4× compared to single-word programming. This accelerates firmware updates and field reconfiguration in production and service environments.
Is the OTP array truly one-time programmable, and can it be locked permanently?
Yes, the 1024-byte OTP array consists of two independently lockable regions. Once locked via dedicated commands, each region becomes permanently read-only - even after power cycles or resets - ensuring calibration data, serial numbers, or cryptographic keys remain tamper-proof throughout the product's operational life.
S29GL01GS11FHV023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL01GS11FHV023 FAQ
1.How can I place an order for S29GL01GS11FHV023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GS11FHV023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GS11FHV023 reliable?
The price and inventory of S29GL01GS11FHV023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS11FHV023 is usually 5 days.
3.What payment methods are accepted for S29GL01GS11FHV023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS11FHV023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GS11FHV023?
S29GL01GS11FHV023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GS11FHV023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GS11FHV023?
For technical support, including S29GL01GS11FHV023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS11FHV023 requirements.
6.How does Aetrix verify that S29GL01GS11FHV023 is sourced from the original manufacturer or authorized distributors?
All S29GL01GS11FHV023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS11FHV023 meets industry standards.
7.What is the process for return or replacement of S29GL01GS11FHV023?
All S29GL01GS11FHV023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS11FHV023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GS11FHV023 part is unused and in its original packaging.
Return procedure for S29GL01GS11FHV023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GS11FHV023 Tags
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M24C02-WMN6TP
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