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Infineon Technologies S29GL01GS11TFB010
- Part No.:
- S29GL01GS11TFB010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL01GS11TFB010.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,044
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Product details
Overview
S29GL01GS11TFB010 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, 65 nm MIRRORBIT™ Eclipse technology, 3.0 V core supply (2.7–3.6 V), and industrial temperature grade (–40°C to +85°C). It delivers 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction - deployed in boot code storage for industrial HMIs requiring deterministic XIP execution.
For engineers reviewing the S29GL01GS11TFB010 datasheet, S29GL01GS11TFB010 pinout, S29GL01GS11TFB010 application, or S29GL01GS11TFB010 equivalent, key selection criteria include asynchronous 16-bit interface timing, sector-level erase granularity (128 kB), OTP array security, Versatile I/O voltage support (1.65–3.6 V), and AEC-Q100 grade 3 qualification for automotive control modules.
Technical Context
This device implements an embedded algorithm controller (EAC) that executes autonomous program/erase operations without host CPU intervention. Its architecture supports page-mode reads (32-byte aligned, 15 ns subsequent access) and buffer programming of up to 512 bytes per command, enabling 1.5 MBps effective write throughput.
The flash uses uniform 128-kbyte sectors with advanced sector protection (ASP), supporting both volatile and non-volatile lock states per sector. Internal hardware ECC operates transparently during read cycles, correcting single-bit errors and flagging uncorrectable multi-bit failures via status register bits.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 1 Gb (128 MB) - supports full firmware image storage for mid-tier microcontrollers |
| Interface | Asynchronous 16-bit parallel - enables direct XIP execution without external glue logic |
| Access Time | 90 ns random / 15 ns page - meets real-time boot latency requirements in PLCs |
| Erase Unit | Uniform 128-kbyte sectors - allows granular firmware update partitioning |
| Program Buffer | 512-byte write buffer - reduces host overhead by batching writes into single commands |
| ECC | On-the-fly single-bit correction - eliminates need for external error-handling firmware |
| Endurance | 100,000 program/erase cycles - qualifies for 10+ year field deployment in industrial gateways |
| Data Retention | 20 years at 85°C - ensures long-term reliability in sealed enclosures without active cooling |
Pinout & Package
Package: 64-ball LAE Fortified BGA (9 mm × 9 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A25 | Address inputs | 26-bit address bus supporting full 128 MB linear space (A25 = MSB) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports 1.65–3.6 V I/O voltage (VIO) |
| CE# | Chip enable | Active-low device select; controls power state entry/exit |
| OE# | Output enable | Active-low read strobe; gates output drivers during asynchronous reads |
| WE# | Write enable | Active-low control for write/program/erase command latching |
| RY/BY# | Ready/Busy indicator | Open-drain status signal; low during embedded operations |
| RESET# | Hardware reset | Active-low global reset; clears internal state and aborts ongoing operations |
| WP# | Write protect | Hardware sector lock override; disables program/erase when asserted |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | 1.65 V to VCC (max 3.6 V) - eliminates level shifters when interfacing with 1.8 V or 3.3 V SoCs |
| Embedded Algorithm Controller (EAC) | Autonomous sector erase and buffer programming - removes host CPU polling overhead |
| Secure Silicon Region (OTP) | 1024-byte one-time-programmable array with two lockable regions - stores cryptographic keys or calibration data |
| Common Flash Interface (CFI) | Standardized parameter table accessible via read commands - enables OS-agnostic flash drivers |
| Suspend/Resume capability | Pause ongoing program/erase to service high-priority reads - critical for real-time HMI responsiveness |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot loader and safety-critical firmware in programmable logic controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: Primary non-volatile boot memory with XIP capability and deterministic 90 ns read latency. Use Value: Enables sub-100 ms cold-start recovery and supports 100,000-cycle field updates without degradation. | Use Scenario: Holding certified boot code and configuration data for radar ECU in AEC-Q100 Grade 2 systems (–40°C to +105°C). IC Role / Device Role / Timing Role: Automotive-grade parallel NOR flash with AEC-Q100 qualification and hardware write protection. Use Value: Meets ISO 26262 ASIL-B requirements via OTP key storage and sector-level lock granularity. |
| Medical Imaging System BIOS | Telecom Base Station Configuration |
Use Scenario: Hosting BIOS and FPGA configuration bitstreams in portable ultrasound devices requiring 20-year data retention. IC Role / Device Role / Timing Role: High-reliability boot memory with on-die ECC and 20-year retention at 85°C. Use Value: Eliminates external error-correction logic and extends product lifecycle beyond regulatory certification windows. | Use Scenario: Storing FPGA configuration, calibration tables, and protocol stacks in carrier-grade 5G baseband units. IC Role / Device Role / Timing Role: High-density parallel flash with 128 kB sector erase for modular firmware updates. Use Value: Allows field-upgradable subsystems without full reflash, reducing downtime during network maintenance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GP11TFB010 | Same density and package, but with extended temperature range (–40°C to +105°C) and AEC-Q100 Grade 2 qualification | Required for under-hood automotive applications exceeding 85°C ambient | Select when thermal environment exceeds industrial grade limits |
| MX29GL128FPTI-90G | 128 Mb density, 90 ns access, no integrated ECC, different CFI layout and command set | Lacks hardware ECC and OTP region; requires external error handling and custom driver adaptation | Consider only if cost sensitivity outweighs reliability and firmware development overhead |
Compared with S29GL01GP11TFB010, this part trades extended temperature rating for lower cost in industrial settings; versus MX29GL128FPTI-90G, it adds ECC, OTP, and standardized CFI at higher density - reducing system-level validation effort and improving field longevity.
Availability
S29GL01GS11TFB010 is available at Aetrix Electronics and suitable for industrial HMIs, automotive ECUs, and telecom infrastructure requiring stable component supply, long-life obsolescence management, and traceable sourcing.
Supply support for S29GL01GS11TFB010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global R&D and manufacturing infrastructure.
The GL-S family targets embedded systems needing reliable, high-density parallel NOR flash with XIP capability, ECC, and automotive qualification - bridging performance gaps between legacy parallel flash and newer serial alternatives.
FAQ
What is the minimum VIO voltage supported for reliable operation?
The S29GL01GS11TFB010 supports VIO from 1.65 V to VCC (max 3.6 V). Operation below 1.65 V is not guaranteed and may cause data corruption or command failure. The device automatically adapts I/O drive strength and timing margins within this range without external configuration.
Does this device require external hardware for ECC handling?
No. The device includes fully autonomous on-die ECC circuitry that detects and corrects single-bit errors during every read operation. No external logic or software intervention is needed - correction occurs transparently, and uncorrectable errors are flagged via status register bit SR7.
Can the OTP region be reprogrammed after initial programming?
No. The 1024-byte Secure Silicon Region is one-time-programmable. Once a byte is written, it cannot be altered. Each of the two lockable regions can be permanently secured using dedicated lock bits, preventing further writes even after power cycles.
How does suspend/resume affect active erase operations?
Suspend halts an ongoing sector erase and places the device in a ready state within 30 µs, allowing immediate high-priority reads. Resume restarts the exact same erase operation from the suspended point. Up to 256 suspend/resume cycles are supported per erase command without endurance penalty.
S29GL01GS11TFB010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL01GS11TFB010 FAQ
1.How can I place an order for S29GL01GS11TFB010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GS11TFB010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GS11TFB010 reliable?
The price and inventory of S29GL01GS11TFB010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS11TFB010 is usually 5 days.
3.What payment methods are accepted for S29GL01GS11TFB010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS11TFB010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GS11TFB010?
S29GL01GS11TFB010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GS11TFB010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GS11TFB010?
For technical support, including S29GL01GS11TFB010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS11TFB010 requirements.
6.How does Aetrix verify that S29GL01GS11TFB010 is sourced from the original manufacturer or authorized distributors?
All S29GL01GS11TFB010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS11TFB010 meets industry standards.
7.What is the process for return or replacement of S29GL01GS11TFB010?
All S29GL01GS11TFB010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS11TFB010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GS11TFB010 part is unused and in its original packaging.
Return procedure for S29GL01GS11TFB010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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