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Infineon Technologies S29GL01GS11TFB020
- Part No.:
- S29GL01GS11TFB020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL01GS11TFB020.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,540
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Product details
Overview
S29GL01GS11TFB020 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It operates across industrial temperature range (–40°C to +85°C) and supports sector erase of uniform 128-kbyte sectors in embedded boot code storage applications.
For engineers reviewing the S29GL01GS11TFB020 datasheet, S29GL01GS11TFB020 pinout, S29GL01GS11TFB020 application, or S29GL01GS11TFB020 equivalent, key selection criteria include asynchronous 16-bit parallel interface timing, Versatile I/O (1.65–VCC VIO), 512-byte programming buffer throughput (1.5 MBps), OTP array security, and AEC-Q100 grade 3 qualification for automotive control modules.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A25), supporting both random and page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations autonomously, including suspend/resume capability and status reporting via status register, data polling, or RY/BY# pin.
The MIRRORBIT™ Eclipse architecture on 65 nm process enables high-density non-volatile storage with 100,000 program/erase cycles and 20-year data retention. Internal hardware ECC operates transparently during read, correcting single-bit errors without software intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 Gb (128 MB), organized as 8,388,608 × 16-bit words - defines maximum boot image or firmware partition size |
| Random Access Time | 90 ns at VCC = VIO - determines worst-case latency for XIP execution from arbitrary addresses |
| Page Access Time | 15 ns - enables fast sequential reads within 32-byte aligned pages for cached instruction fetch |
| Programming Buffer | 512 bytes - reduces effective programming time by batching writes, achieving 1.5 MBps throughput |
| ECC Support | Internal hardware single-bit error correction - ensures data integrity without host CPU overhead or external logic |
| Operating Voltage | VCC: 2.7–3.6 V; VIO: 1.65–VCC - allows flexible I/O rail selection independent of core supply |
| Temperature Grade | Industrial (–40°C to +85°C) - validated for use in industrial HMIs, PLCs, and gateway controllers |
Pinout & Package
Package: 64-ball LAE Fortified BGA (9 mm × 9 mm, 0.8 mm pitch). Pinout conforms to standard parallel NOR flash interface with dedicated CE#, OE#, WE#, RESET#, RY/BY#, and 16-bit bidirectional DQ bus.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CE# | Chip Enable | Active-low enable for device selection; must be asserted before OE#/WE# to initiate read/write |
| OE# | Output Enable | Controls output drivers during read; deassertion places DQ pins in high-impedance state |
| WE# | Write Enable | Controls write latching and command execution; used with address/data to issue program/erase commands |
| RY/BY# | Ready/Busy Output | Open-drain status indicator: low = operation in progress, high = ready for next command |
| RESET# | Hardware Reset | Asynchronous active-low reset that aborts ongoing operations and returns device to read mode |
| DQ0–DQ15 | Data Bus | 16-bit bidirectional interface for address, command, and data transfer; supports word-aligned access only |
| A0–A25 | Address Inputs | 26-bit address bus; A0–A1 select byte within word, A2–A25 define 128-kbyte sector boundaries |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous Page Read | 32-byte aligned page access with 15 ns cycle time - accelerates burst instruction fetch in XIP systems |
| 512-Byte Programming Buffer | Reduces average programming time by >60% vs. single-word writes - critical for field firmware updates |
| Hardware ECC Engine | Single-bit correction with no software intervention - eliminates need for external error-handling logic |
| Advanced Sector Protection | Volatile and non-volatile lock bits per 128-kbyte sector - enables secure bootloader and parameter partitioning |
| OTP Array | 1024-byte one-time-programmable region with two lockable sections - stores cryptographic keys or calibration data |
Applications
| Automotive ECU Boot Memory | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot code and safety-critical firmware in engine control units requiring AEC-Q100 compliance. IC Role / Device Role / Timing Role: Primary non-volatile boot memory with XIP capability and deterministic 90 ns read latency. Use Value: Enables direct execution from flash while meeting automotive reliability targets (100K cycles, 20-year retention). | Use Scenario: Holding firmware images and configuration data in programmable logic controllers deployed in factory automation. IC Role / Device Role / Timing Role: Asynchronous parallel flash for reliable firmware storage with sector-level protection against accidental overwrite. Use Value: Supports field updates via 512-byte buffer programming and prevents corruption using non-volatile sector locks. |
| Medical Imaging System BIOS | Network Router Bootloader |
Use Scenario: Hosting BIOS and diagnostic firmware in FDA-regulated imaging equipment requiring long-term data integrity. IC Role / Device Role / Timing Role: Secure, ECC-protected boot memory with OTP region for device-specific calibration constants. Use Value: Hardware ECC ensures bit-error resilience over 20 years; OTP prevents tampering with calibration parameters. | Use Scenario: Storing bootloader and OS kernel images in enterprise-grade routers where fast boot and update reliability are essential. IC Role / Device Role / Timing Role: High-speed parallel NOR flash enabling sub-100 ms boot times via XIP and page-mode reads. Use Value: 15 ns page access and suspend/resume functionality allow concurrent diagnostics and firmware patching. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GS10TFI010 | Same density and architecture but TSOP-56 package (vs. LAE BGA); no AEC-Q100 qualification | Targeted at cost-sensitive industrial boards with through-hole or surface-mount PCB constraints | Select when board layout requires leaded package or automotive qualification is not required |
| MX29GL128FPTI-90G | 128 Mb density (1/8 capacity), 90 ns access, no integrated ECC, different command set | Suitable for legacy designs with lower firmware footprint and no ECC dependency | Choose only if firmware size fits 128 Mb and system-level ECC is implemented externally |
Compared with S29GL01GS11TFB020, the TSOP variant trades automotive qualification and compact BGA for easier prototyping, while the Macronix part offers lower cost and footprint at the expense of density, ECC, and AEC-Q100 support - making it unsuitable for new automotive or safety-critical designs.
Availability
S29GL01GS11TFB020 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware storage, and medical imaging system BIOS applications requiring stable component supply and long lifecycle support.
Supply support for S29GL01GS11TFB020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and non-volatile memory solutions.
The GL-S family was designed specifically for high-reliability embedded boot code storage, combining XIP performance with data storage density and automotive-grade robustness.
FAQ
What is the purpose of the Versatile I/O (VIO) feature?
The Versatile I/O feature allows the device's input/output voltage (VIO) to operate independently from the core supply (VCC), supporting VIO from 1.65 V up to VCC. This enables direct interfacing with 1.8 V, 2.5 V, or 3.3 V logic families without level shifters, simplifying system integration in mixed-voltage designs.
Does S29GL01GS11TFB020 support execute-in-place (XIP) operation?
Yes - the device supports true XIP operation due to its fast random access time (90 ns) and asynchronous parallel interface. Code can be executed directly from flash without copying to RAM, reducing boot time and SRAM usage in resource-constrained embedded systems.
How does the 512-byte programming buffer improve firmware update efficiency?
The 512-byte buffer allows up to 256 words to be loaded and programmed in a single embedded operation, achieving 1.5 MBps effective write speed. This cuts typical firmware update time by more than half compared to single-word programming, minimizing system downtime during field upgrades.
Is the OTP array truly one-time programmable?
Yes - the 1024-byte OTP array consists of fuse-based cells that permanently store data after programming. Once written, individual bits cannot be erased or rewritten. Two lockable regions provide hardware-enforced write protection, ensuring keys or calibration data remain immutable after initial programming.
S29GL01GS11TFB020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL01GS11TFB020 FAQ
1.How can I place an order for S29GL01GS11TFB020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GS11TFB020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GS11TFB020 reliable?
The price and inventory of S29GL01GS11TFB020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS11TFB020 is usually 5 days.
3.What payment methods are accepted for S29GL01GS11TFB020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS11TFB020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GS11TFB020?
S29GL01GS11TFB020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GS11TFB020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GS11TFB020?
For technical support, including S29GL01GS11TFB020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS11TFB020 requirements.
6.How does Aetrix verify that S29GL01GS11TFB020 is sourced from the original manufacturer or authorized distributors?
All S29GL01GS11TFB020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS11TFB020 meets industry standards.
7.What is the process for return or replacement of S29GL01GS11TFB020?
All S29GL01GS11TFB020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS11TFB020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GS11TFB020 part is unused and in its original packaging.
Return procedure for S29GL01GS11TFB020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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