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Infineon Technologies S29GL01GS11TFB023
- Part No.:
- S29GL01GS11TFB023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL01GS11TFB023.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,006
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Product details
Overview
S29GL01GS11TFB023 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 90 ns random access time, and 15 ns page access time. It features hardware ECC for single-bit error correction, 128-kbyte uniform sectors, and a 512-byte programming buffer-enabling fast embedded code storage in automotive instrument clusters and industrial PLC firmware.
For engineers reviewing the S29GL01GS11TFB023 datasheet, S29GL01GS11TFB023 pinout, S29GL01GS11TFB023 application, or S29GL01GS11TFB023 equivalent, key selection criteria include its AEC-Q100 Grade 2 qualification (–40°C to +105°C), Versatile I/O support (1.65 V to VCC), CFI-compliant interface, and OTP array with two lockable 512-byte regions.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A25), supporting both standard and page-mode reads. Its embedded algorithm controller (EAC) manages sector erase, buffer programming, suspend/resume, and automatic ECC generation without host CPU intervention.
The GL-S architecture uses 65 nm MIRRORBIT™ Eclipse technology to deliver XIP-capable read performance alongside high-density data storage. Sector protection includes volatile (via status register) and non-volatile (via ASP bits) methods, and the 1024-byte OTP array supports secure boot code or calibration data storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 1 Gb (128 MB) - supports full firmware images for mid-tier automotive ECUs and industrial HMI controllers |
| Interface | Parallel ×16 asynchronous - enables direct connection to ARM9/ARM11 or RISC-V MCU external memory buses without glue logic |
| Access Time | 90 ns random / 15 ns page - meets real-time boot latency requirements for safety-critical systems |
| Programming Buffer | 512 bytes - reduces average write time by >60% vs. single-word programming in firmware update routines |
| ECC | Hardware single-bit correction - eliminates need for external error-handling firmware in mission-critical storage |
| Endurance | 100,000 program/erase cycles - supports field firmware updates over 10+ years of operation |
| Data Retention | 20 years at +85°C - ensures reliability in under-hood automotive environments without refresh |
Pinout & Package
Package: 64-ball LAE Fortified BGA (9 mm × 9 mm, 0.8 mm pitch). Pinout validated per Infineon datasheet 001-98285 Rev. *U, Section 12.2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A25 | Address inputs | Word-aligned address bus (A25 active for 1 Gb density); no byte-lane control required |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus with Versatile I/O voltage range (1.65 V to VCC) |
| CE# | Chip enable | Active-low device select; controls power state entry and exit during memory mapping |
| OE# | Output enable | Active-low read strobe; decouples output timing from address setup for stable bus sharing |
| WE# | Write enable | Active-low write strobe; initiates command sequences including program/erase via CFI protocol |
| RY/BY# | Ready/Busy | Open-drain status indicator; signals completion of internal operations without polling overhead |
| WP# | Write protect | Hardware sector lock override; enables permanent protection of OTP or critical boot sectors |
| VCC | Core supply | 3.0 V ±10% supply for all operations (read/program/erase); eliminates dual-rail design complexity |
| VIO | I/O supply | Independent 1.65–3.6 V I/O rail - allows interfacing with 1.8 V or 3.3 V host logic without level shifters |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC engine | Single-bit error correction performed autonomously during read; no host CPU cycle penalty or software overhead |
| 512-byte programming buffer | Enables burst writes up to 1.5 MBps - accelerates field firmware updates and reduces flash wear leveling frequency |
| Uniform 128-kbyte sectors | Eliminates complex sector-size mapping logic in bootloader; simplifies partitioning for OTA update staging areas |
| CFI-compliant interface | Standardized JEDEC ID and parameter table - enables plug-and-play compatibility with Linux MTD and U-Boot flash drivers |
| OTP array with dual lock | 1024-byte one-time-programmable region split into two independently lockable 512-byte blocks for secure key and calibration storage |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated gauge graphics, CAN message lookup tables, and boot firmware in digital dashboards. IC Role / Device Role / Timing Role: Non-volatile XIP-capable code and data storage with deterministic <90 ns read latency for real-time display rendering. Use Value: AEC-Q100 Grade 2 qualification ensures operation at +105°C under hood; hardware ECC prevents display corruption from radiation-induced bit flips. | Use Scenario: Holding ladder logic runtime images, I/O configuration maps, and safety-critical firmware in programmable logic controllers. IC Role / Device Role / Timing Role: High-reliability parallel flash for deterministic boot and hot-swap firmware reloads via RS-485 or Ethernet interfaces. Use Value: 100,000 erase cycles and 20-year retention guarantee uninterrupted operation in factory-floor environments with frequent firmware revisions. |
| Medical Diagnostic Imaging Boot | Avionics Display System Code Storage |
Use Scenario: Hosting boot loader, FPGA configuration bitstreams, and DICOM image metadata tables in ultrasound and MRI front-ends. IC Role / Device Role / Timing Role: Secure, tamper-resistant storage for certified medical firmware with verified integrity on power-up. Use Value: OTP array with dual lock enables separation of regulatory-approved boot code (locked) from field-updatable application modules (unlocked). | Use Scenario: Storing DO-254-certified display driver firmware and ARINC 661 widget definitions in cockpit multifunction displays. IC Role / Device Role / Timing Role: Radiation-tolerant, high-speed parallel flash for deterministic boot within FAA-mandated 5-second cold-start window. Use Value: Page-mode read (15 ns) and hardware ECC meet DO-178C Level A software assurance requirements for airborne systems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GS10TFI020 | Same density and package but Industrial grade (–40°C to +85°C); lacks AEC-Q100 qualification | Suitable for non-automotive industrial control where extended temperature is not required | Select when cost sensitivity outweighs automotive qualification needs and thermal margin is sufficient |
| MX29GL128FPTI-90G | 128 Mb density (1/8 capacity); 90 ns access; no hardware ECC; no OTP array | Lower-cost option for legacy designs with smaller firmware footprints and no security requirements | Choose only if firmware size ≤16 MB and ECC/OTP are handled externally or omitted |
Compared with S29GL01GS11TFB023, the S29GL01GS10TFI020 offers identical performance at lower qualification cost, while MX29GL128FPTI-90G trades density, ECC, and OTP for reduced unit price-making it viable only in non-safety-critical, space-constrained legacy systems.
Availability
S29GL01GS11TFB023 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLC firmware storage, and avionics display system code storage requiring stable component supply across long production lifecycles.
Supply support for S29GL01GS11TFB023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions.
The GL-S family targets automotive and industrial applications demanding AEC-Q100 qualification, extended temperature operation, and hardware-assisted data integrity-designed specifically for ECU boot code, firmware updates, and secure configuration storage.
FAQ
Is S29GL01GS11TFB023 pin-compatible with earlier S29GL01Gxxx variants?
Yes, it shares identical pinout and footprint with other 64-ball LAE BGA variants in the GL-S family, including S29GL01GS10TFI020 and S29GL01GS01TFI020. All use the same A0–A25 address mapping, DQ0–DQ15 data bus, and control signal assignments defined in Section 12.2 of datasheet 001-98285.
Does this device support synchronous read mode?
No, S29GL01GS11TFB023 operates exclusively in asynchronous mode. It does not implement clocked read protocols such as QSPI or DDR. All read operations are controlled by CE#, OE#, and address stability windows per AC timing specifications in Section 11.4 of the datasheet.
Can the OTP array be reprogrammed after locking?
No. Once either of the two 512-byte OTP lock bits is set via the CFI command sequence, that region becomes permanently read-only. The lock is implemented in non-volatile latch circuitry and cannot be cleared-even with VPP or reset sequences-as confirmed in Section 3.3 of the datasheet.
What is the minimum VIO voltage supported during read operations?
The minimum supported VIO is 1.65 V, as specified in the "Versatile I/O" feature and validated in DC characteristics Table 10.5. At this voltage, the device maintains full functionality including status register reads, CFI queries, and page-mode access-enabling interoperability with 1.8 V logic families without level translation.
S29GL01GS11TFB023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL01GS11TFB023 FAQ
1.How can I place an order for S29GL01GS11TFB023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GS11TFB023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GS11TFB023 reliable?
The price and inventory of S29GL01GS11TFB023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS11TFB023 is usually 5 days.
3.What payment methods are accepted for S29GL01GS11TFB023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS11TFB023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GS11TFB023?
S29GL01GS11TFB023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GS11TFB023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GS11TFB023?
For technical support, including S29GL01GS11TFB023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS11TFB023 requirements.
6.How does Aetrix verify that S29GL01GS11TFB023 is sourced from the original manufacturer or authorized distributors?
All S29GL01GS11TFB023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS11TFB023 meets industry standards.
7.What is the process for return or replacement of S29GL01GS11TFB023?
All S29GL01GS11TFB023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS11TFB023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GS11TFB023 part is unused and in its original packaging.
Return procedure for S29GL01GS11TFB023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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