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Infineon Technologies S29GL01GS11TFI010
- Part No.:
- S29GL01GS11TFI010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL01GS11TFI010.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:1,673
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Product details
Overview
S29GL01GS11TFI010 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It operates across industrial temperature range (–40°C to +85°C) and supports sector erase of uniform 128-kbyte sectors in embedded boot code storage applications.
For engineers reviewing the S29GL01GS11TFI010 datasheet, S29GL01GS11TFI010 pinout, S29GL01GS11TFI010 application, or S29GL01GS11TFI010 equivalent, this device delivers deterministic XIP-capable read latency, 512-byte buffer programming, versatile I/O (1.65–VCC), and AEC-Q100 grade 3 qualification - critical for automotive infotainment boot loaders and industrial PLC firmware storage.
Technical Context
The S29GL01GS11TFI010 implements asynchronous parallel interface with word-aligned addressing (A0–A25), 32-byte page reads, and embedded algorithm controller (EAC) managing program/erase sequences. Its MIRRORBIT™ Eclipse 65-nm technology enables dual-bit-per-cell storage without compromising endurance or retention.
It supports three status monitoring methods: status register polling, data polling, and RY/BY# pin assertion. Sector protection includes volatile (lock bits) and non-volatile (ASP) modes, plus a dedicated 1024-byte OTP array with two lockable regions for secure configuration storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 1 Gb (128 MB), organized as 8,388,608 × 16-bit words - sufficient for full boot image + firmware partitioning in resource-constrained controllers. |
| Access Time | 90 ns random access (VCC = VIO); 15 ns page access - enables real-time XIP execution without cache stalls in MCU-based systems. |
| Programming Buffer | 512-byte (256-word) write buffer - reduces effective programming time by >3× vs. single-word writes in firmware update routines. |
| ECC Support | On-die hardware single-bit error correction - eliminates need for external ECC logic in safety-critical boot memory paths. |
| Endurance & Retention | 100,000 program/erase cycles; 20-year data retention - meets long-life requirements for industrial control and automotive ECUs. |
| Operating Voltage | VCC = 2.7–3.6 V; VIO = 1.65–VCC - allows direct interfacing with 1.8 V, 2.5 V, or 3.3 V I/O domains without level shifters. |
| Temperature Grade | Industrial (–40°C to +85°C) - validated for use in motor drives, HMI panels, and gateway modules without derating. |
Pinout & Package
Package: 56-pin TSOP (Type I, 400 mil width), JEDEC standard footprint compatible with legacy flash socket designs and automated PCB assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A25 | Address Inputs | 26-bit address bus supporting full 1 Gb address space; A0 is LSB, aligned to word boundaries only. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports both read and write transfers in word mode; VIO-referenced I/O buffers. |
| CE# | Chip Enable | Active-low chip select; controls device power state - deassertion places device in low-power standby (100 µA). |
| OE# | Output Enable | Active-low read strobe; gates output drivers during read operations; independent of CE# for flexible timing control. |
| WE# | Write Enable | Active-low write strobe; initiates internal program/erase algorithms when combined with valid command sequences. |
| RY/BY# | Ready/Busy Output | Open-drain status indicator - low during active program/erase; used for hardware flow control without polling overhead. |
| RESET# | Hardware Reset | Active-low asynchronous reset; forces device into known state and aborts ongoing operations - essential for safe recovery after brownout. |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous Page Read | 32-byte aligned page access with 15 ns intra-page cycle time - accelerates sequential instruction fetch in XIP mode. |
| Uniform Sector Architecture | 512 × 128-kbyte sectors - simplifies firmware partitioning and OTA update management with predictable erase granularity. |
| Advanced Sector Protection (ASP) | Volatile and non-volatile locking per sector - enables runtime-protectable boot sectors and factory-locked configuration regions. |
| Common Flash Interface (CFI) | Standardized parameter table at fixed address - enables OS-agnostic flash drivers and bootloader auto-detection without hard-coded timing. |
| Secure Silicon Region (OTP) | 1024-byte one-time-programmable array with two independently lockable regions - stores cryptographic keys or calibration data permanently. |
Applications
| Automotive Infotainment Boot Memory | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot loader and kernel image for head unit MCU requiring instant startup and fail-safe recovery. IC Role / Device Role / Timing Role: Primary non-volatile boot memory with XIP capability and hardware ECC for integrity-critical first-stage code. Use Value: 90 ns random access ensures sub-100 ms cold boot; AEC-Q100 grade 3 qualification guarantees operation across vehicle cabin thermal profiles. |
Use Scenario: Holding firmware and configuration data for programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Field-upgradable firmware repository with sector-level erase isolation to prevent corruption during partial updates. Use Value: 100,000 erase cycles support >10 years of scheduled firmware revisions; 20-year retention avoids data loss during extended maintenance intervals. |
| Medical Imaging System BIOS | Network Edge Router Boot Image |
Use Scenario: Hosting BIOS and diagnostic microcode in portable ultrasound devices where data integrity is regulated under IEC 62304. IC Role / Device Role / Timing Role: Secure, ECC-protected boot ROM with OTP region for storing device-specific calibration signatures. Use Value: On-die ECC eliminates external error-handling logic; OTP lock prevents unauthorized modification of regulatory-critical parameters. |
Use Scenario: Storing boot image and packet processing firmware in carrier-grade edge routers requiring zero-downtime field upgrades. IC Role / Device Role / Timing Role: Dual-bank capable flash (via sector mapping) enabling atomic firmware swaps without service interruption. Use Value: 512-byte programming buffer cuts firmware write time by 75% vs. byte-wise writes; CFI support enables vendor-neutral bootloader compatibility. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GS10TFI010 | Same density and package, but rated for –40°C to +105°C (industrial plus grade) and lacks AEC-Q100 qualification. | Preferred for extended-temperature industrial gateways where automotive certification is unnecessary. | Select when ambient operating temperature exceeds +85°C and automotive compliance is not required. |
| MX29GL128FPTI-90G | 128 Mb (not 1 Gb), 90 ns access, no on-die ECC, no OTP array, different command set and CFI layout. | Suitable only for legacy designs with lower density needs and no ECC or secure storage requirements. | Choose only if board space, cost, or legacy driver compatibility outweigh density and reliability features. |
Compared with S29GL01GS11TFI010, the S29GL01GS10TFI010 offers higher temperature margin but no automotive qualification, while MX29GL128FPTI-90G sacrifices density, ECC, and security for lower cost and simpler integration in non-safety-critical systems.
Availability
S29GL01GS11TFI010 is available at Aetrix Electronics and suitable for automotive infotainment systems, industrial PLCs, and medical imaging equipment requiring stable component supply, long-term lifecycle support, and AEC-Q100-compliant flash memory.
Supply support for S29GL01GS11TFI010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions, with global manufacturing and quality certifications including ISO/TS 16949 and IATF 16949.
The GL-S family targets embedded systems needing deterministic XIP performance, robust data retention, and automotive-grade reliability - designed specifically for boot code storage where failure modes must be mitigated at the silicon level.
FAQ
Does S29GL01GS11TFI010 support execute-in-place (XIP) operation?
Yes. The device supports true XIP via asynchronous 16-bit parallel interface with 90 ns random access and 15 ns page-mode reads. Its architecture allows direct instruction fetch from flash without copying to RAM, verified by Infineon's application note AN220042 and supported by standard CFI-compliant bootloaders.
What is the function of the RY/BY# pin during programming?
RY/BY# is an open-drain ready/busy indicator that asserts low during active program or erase operations and returns high upon completion. It provides hardware flow control, eliminating the need for continuous status register polling and reducing CPU overhead during firmware updates.
Can the OTP region be reprogrammed after initial programming?
No. The 1024-byte OTP array is physically one-time programmable. Once a bit is set to '0', it cannot be changed back to '1'. Two independent lock bits permanently disable further writes to each 512-byte region, ensuring irreversible storage of keys or calibration data.
Is VIO voltage required to match VCC for reliable operation?
No. VIO may range from 1.65 V to VCC, enabling interoperability with mixed-voltage SoCs. For example, VCC = 3.3 V and VIO = 1.8 V is valid and tested per datasheet Section 10.4 - allowing direct connection to 1.8 V I/O banks without external level shifters.
S29GL01GS11TFI010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL01GS11TFI010 FAQ
1.How can I place an order for S29GL01GS11TFI010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GS11TFI010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GS11TFI010 reliable?
The price and inventory of S29GL01GS11TFI010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS11TFI010 is usually 5 days.
3.What payment methods are accepted for S29GL01GS11TFI010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS11TFI010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GS11TFI010?
S29GL01GS11TFI010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GS11TFI010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GS11TFI010?
For technical support, including S29GL01GS11TFI010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS11TFI010 requirements.
6.How does Aetrix verify that S29GL01GS11TFI010 is sourced from the original manufacturer or authorized distributors?
All S29GL01GS11TFI010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS11TFI010 meets industry standards.
7.What is the process for return or replacement of S29GL01GS11TFI010?
All S29GL01GS11TFI010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS11TFI010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GS11TFI010 part is unused and in its original packaging.
Return procedure for S29GL01GS11TFI010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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