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Infineon Technologies S29GL01GS11TFI013

Part No.:
S29GL01GS11TFI013
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
56-TFSOP (0.724", 18.40mm Width)
Datasheet:
AetrixS29GL01GS11TFI013.pdf
Description:
IC FLASH 1GBIT PARALLEL 56TSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,000

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Product details

Overview

S29GL01GS11TFI013 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It operates across industrial temperature range (–40°C to +85°C) and supports asynchronous read, buffered programming (512-byte write buffer), and uniform 128-kB sector erase - deployed in boot code storage for industrial HMIs and network edge controllers.

For engineers reviewing the S29GL01GS11TFI013 datasheet, S29GL01GS11TFI013 pinout, S29GL01GS11TFI013 application, or S29GL01GS11TFI013 equivalent, this device delivers deterministic XIP-capable timing, Versatile I/O (1.65–VCC), CFI-compliant interface, and AEC-Q100 grade 3 qualification - critical for firmware-resident systems requiring guaranteed read latency and field-programmable reliability.

Technical Context

This device implements MIRRORBIT™ Eclipse architecture on 65 nm process, enabling dual-bit-per-cell storage without compromising read/write determinism. Its embedded algorithm controller (EAC) manages autonomous program/erase with suspend/resume, status register polling, and RY/BY# signaling - all compliant with Common Flash Interface (CFI) parameter tables for host abstraction.

The 32-byte page-aligned read mode reduces effective latency for sequential instruction fetch; the 512-byte write buffer enables burst programming at up to 1.5 MBps; and the 1024-byte OTP array with dual lockable regions supports secure boot key storage and configuration binding.

Key Specifications

Parameter Value and Actual Design Meaning
Memory density 1 Gb (128 MB), organized as 8,388,608 × 16-bit words - sufficient for full firmware images including bootloader, RTOS, and application binaries.
Random access time 90 ns at VCC = VIO - ensures sub-100 ns instruction fetch latency for real-time XIP execution in microcontroller-based systems.
Page access time 15 ns - enables rapid sequential reads within 32-byte aligned pages, optimizing cache-line-like access patterns.
Write buffer size 512 bytes - allows single-command programming of up to 256 words, reducing host CPU overhead vs. byte/word-by-word writes.
ECC capability Internal hardware single-bit error correction - maintains data integrity without software intervention during long-term storage or repeated read cycles.
Endurance & retention 100,000 program/erase cycles and 20-year data retention - validated for industrial control firmware updates over product lifetime.
Operating temperature –40°C to +85°C (Industrial grade) - qualified for deployment in uncontrolled ambient environments like factory-floor HMIs and outdoor gateways.

Pinout & Package

Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-142AB footprint with gull-wing leads. Compatible with reflow and wave soldering per J-STD-020D.3.

Pin/Terminal Circuit Role Design Meaning
A0–A25 Address inputs 26-bit address bus supporting full 128 MB addressing; A25 is MSB for 1 Gb density.
DQ0–DQ15 Data I/O bus 16-bit bidirectional data path; supports word-wide transfers only - no byte-lane control.
CE# Chip enable Active-low device select; controls power state entry and command latching timing (tCE ≤ 90 ns).
OE# Output enable Active-low read strobe; gates output drivers during asynchronous read (tOE ≤ 25 ns).
WE# Write enable Active-low control for write/program/erase command initiation and data capture timing.
RY/BY# Ready/Busy indicator Open-drain output signaling internal operation progress; low = busy, high = ready for next command.
VCC Core supply 3.0 V ±0.3 V main supply powering logic, array, and charge pumps - supports single-supply system design.
VIO I/O supply 1.65 V to VCC - enables interfacing with mixed-voltage hosts (e.g., 1.8 V or 3.3 V SoCs) without level shifters.

Key Features

Feature Design Value
Versatile I/O voltage range VIO supports 1.65 V to VCC - eliminates external level translation when interfacing with 1.8 V FPGA I/O banks or 3.3 V MCU buses.
Asynchronous 32-byte page read First access loads full 32-byte aligned block; subsequent intra-page reads complete in 15 ns - ideal for instruction cache line fills.
Hardware ECC engine On-die single-bit correction with no CPU overhead - preserves firmware integrity across 20-year storage without software ECC layer.
Uniform 128-kB sector architecture 64 identical sectors simplify BOM management and firmware partitioning; enables atomic update of bootloader or application sections.
Secure OTP array 1024-byte one-time-programmable region with two independent lock bits - used for cryptographic keys or hardware-locked configuration flags.

Applications

Industrial HMI Boot Storage Network Edge Router Firmware

Use Scenario: Storing boot loader, Linux kernel, and root filesystem in fanless, sealed panel PCs operating continuously in factory environments.

IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP support - directly executed by ARM Cortex-A series processor via parallel bus.

Use Value: 90 ns random access ensures deterministic boot timing; 128-kB uniform sectors allow safe dual-bank firmware updates without runtime corruption risk.

Use Scenario: Holding firmware images and configuration tables in carrier-grade Ethernet switches deployed in telecom cabinets.

IC Role / Device Role / Timing Role: Firmware repository accessed during cold start and remote OTA updates - requires guaranteed 20-year data retention and AEC-Q100 grade 3 reliability.

Use Value: Hardware ECC prevents silent corruption of critical routing tables; Versatile I/O enables direct connection to 1.8 V switch fabric ASICs.

Automotive ADAS Camera Module Medical Diagnostic Imaging Controller

Use Scenario: Storing calibration data, sensor fusion algorithms, and fail-safe boot code in rear-view camera ECUs certified to AEC-Q100 Grade 2 (–40°C to +105°C).

IC Role / Device Role / Timing Role: Safety-critical firmware storage with lockable OTP for ASIL-B compliant boot authentication keys.

Use Value: Dual-lock OTP regions prevent accidental overwrite of cryptographic keys; 100,000 erase cycles support field recalibration over vehicle lifetime.

Use Scenario: Hosting DICOM protocol stack and image processing firmware in portable ultrasound units requiring FDA Class II compliance and long-term auditability.

IC Role / Device Role / Timing Role: Secure, tamper-resistant firmware vault - leverages sector protection and CFI interface for traceable firmware versioning.

Use Value: Advanced sector protection (ASP) allows selective locking of diagnostic modules; CFI table enables automated host-side compatibility verification.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part Technical Difference Application Difference Selection Advice
S29GL01GP11TFI010 Same density and pinout, but uses 64-ball LAE FBGA (9 mm × 9 mm); lacks OTP array and ASP granularity. Preferred for space-constrained PCBs where TSOP height is prohibitive; unsuitable for secure boot key storage. Select when board area is constrained and OTP/security features are not required.
MX29GL128FPTI-90G 128 Mb (not 1 Gb), 90 ns access, same TSOP-56 package; no hardware ECC or Versatile I/O - fixed 3.3 V I/O only. Used in legacy designs with smaller firmware footprints; cannot scale to full Linux-based imaging stacks. Select only for cost-sensitive, low-density legacy replacements with no ECC or mixed-voltage needs.

Compared with S29GL01GP11TFI010, this TSOP variant offers OTP security and finer sector protection; versus MX29GL128FPTI-90G, it delivers 8× density, ECC, and voltage-flexible I/O - making it the sole choice for modern XIP-capable, safety-aware embedded firmware storage.

Availability

S29GL01GS11TFI013 is available at Aetrix Electronics and suitable for industrial HMI boot storage, network edge router firmware, and automotive ADAS camera module applications requiring stable component supply, long-life availability, and AEC-Q100-compliant sourcing.

Supply support for S29GL01GS11TFI013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and high-reliability memory solutions - with global manufacturing and automotive qualification expertise.

The GL-S family targets embedded systems needing deterministic XIP performance and robust firmware storage - designed specifically for industrial control, networking infrastructure, and automotive ECU applications demanding AEC-Q100 compliance and 20-year data retention.

FAQ

Does S29GL01GS11TFI013 support execute-in-place (XIP) operation?

Yes, it supports true XIP operation due to its 90 ns random access time and asynchronous parallel interface. The device delivers deterministic instruction fetch latency without requiring data copying to RAM, enabling direct execution of boot code and real-time firmware from flash - verified in Infineon's GL-S reference designs for ARM Cortex-A and RISC-V SoCs.

What is the function of the Versatile I/O (VIO) supply pin?

VIO sets the input/output voltage level independently from VCC, ranging from 1.65 V to VCC. This allows direct interfacing with mixed-voltage host processors - for example, connecting to a 1.8 V FPGA I/O bank while maintaining 3.0 V core operation - eliminating external level shifters and reducing BOM count and signal integrity risk.

How is the 1024-byte OTP array structured and secured?

The OTP array consists of 64 rows × 16 bytes, split into two independently lockable 512-byte regions. Each region has a dedicated lock bit; once set, the lock is irreversible and prevents further writes. This structure is used for storing immutable cryptographic keys, calibration constants, or hardware-unique identifiers - enforced by on-die fuse logic, not software.

Can sector protection be configured dynamically during runtime?

Yes, Advanced Sector Protection (ASP) supports both volatile (SRAM-based) and non-volatile (flash-based) lock bits per 128-kB sector. Volatile locks reset on power cycle and are useful for temporary firmware update windows; non-volatile locks persist through resets and are set via specific unlock-and-write sequences - enabling flexible, layered security policies without hardware modification.

S29GL01GS11TFI013 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
GL-S
Package/Case:
56-TFSOP (0.724", 18.40mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
1Gbit
Memory Organization:
64M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
60ns
Access Time:
110 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
56-TSOP

S29GL01GS11TFI013 FAQ

1.How can I place an order for S29GL01GS11TFI013 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL01GS11TFI013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL01GS11TFI013 reliable?

The price and inventory of S29GL01GS11TFI013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS11TFI013 is usually 5 days.

3.What payment methods are accepted for S29GL01GS11TFI013?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS11TFI013 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL01GS11TFI013?

S29GL01GS11TFI013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL01GS11TFI013 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL01GS11TFI013?

For technical support, including S29GL01GS11TFI013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS11TFI013 requirements.

6.How does Aetrix verify that S29GL01GS11TFI013 is sourced from the original manufacturer or authorized distributors?

All S29GL01GS11TFI013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS11TFI013 meets industry standards.

7.What is the process for return or replacement of S29GL01GS11TFI013?

All S29GL01GS11TFI013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS11TFI013, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL01GS11TFI013 part is unused and in its original packaging.

Return procedure for S29GL01GS11TFI013:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

S29GL01GS11TFI013 Tags

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