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Infineon Technologies S29GL01GS11TFIV10
- Part No.:
- S29GL01GS11TFIV10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL01GS11TFIV10.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:999
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Product details
Overview
S29GL01GS11TFIV10 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access and 15 ns page access, and integrates hardware ECC for single-bit error correction-used in boot code storage and firmware update storage for industrial microcontroller-based systems.
For engineers reviewing the S29GL01GS11TFIV10 datasheet, S29GL01GS11TFIV10 pinout, S29GL01GS11TFIV10 application, or S29GL01GS11TFIV10 equivalent, key selection criteria include its 128-kbyte uniform sector erase granularity, 512-byte write buffer, Versatile I/O (1.65–VCC), OTP array, and AEC-Q100 Grade 2 qualification for automotive embedded control units.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A25), supports both full-VCC and VersatileIO voltage modes, and uses command-set-driven embedded algorithms for program/erase operations. Its internal state machine handles suspend/resume, status polling, and automatic ECC during read/write cycles.
The architecture includes a dedicated 1024-byte one-time-programmable (OTP) array with dual lockable regions, CFI-compliant parameter tables for host auto-configuration, and advanced sector protection with volatile/non-volatile locking per 128-kbyte sector-enabling secure firmware partitioning in safety-critical applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB), organized as 8,388,608 × 16-bit words-supports full firmware image storage for mid-tier MCUs. |
| Access time (random) | 90 ns at VCC = VIO - enables direct XIP execution from flash without external cache in real-time control loops. |
| Page access time | 15 ns - allows burst reads of 32-byte aligned pages, accelerating sequential instruction fetch or configuration table lookup. |
| Write buffer size | 512 bytes (256 words) - reduces effective programming time by >3× vs. single-word writes in firmware field updates. |
| ECC capability | Internal hardware single-bit error correction - eliminates need for external ECC logic in mission-critical boot ROM paths. |
| Endurance & retention | 100,000 program/erase cycles; 20-year data retention - meets long-lifecycle requirements for industrial PLCs and automotive ECUs. |
| Operating temperature | –40°C to +105°C (AEC-Q100 Grade 2) - qualified for under-hood automotive applications without derating. |
Pinout & Package
Package: 64-ball LAE Fortified BGA (9 mm × 9 mm, 0.8 mm pitch). Pinout validated per Infineon datasheet Rev. *U (2024-06-25), Section 12.2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A25 | Address inputs | 26-bit word-aligned address bus; A25 is MSB for 1 Gb density (8,388,608 words). |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports 1.65–VCC versatile I/O voltage range independent of VCC. |
| CE# | Chip enable | Active-low chip select; controls device power state and enables multi-chip address decoding. |
| OE# | Output enable | Active-low read strobe; gates output drivers during asynchronous read cycles. |
| WE# | Write enable | Active-low write strobe; initiates command latching or data programming when CE# and OE# are inactive. |
| RY/BY# | Ready/Busy indicator | Open-drain active-low signal indicating internal operation progress; used for hardware polling. |
| RESET# | Hardware reset | Active-low asynchronous reset that aborts ongoing program/erase and returns device to read mode. |
| WP# | Write protect | Active-low hardware sector protection enable; overrides software-based sector locks during power-up. |
Key Features
| Feature | Design Value |
|---|---|
| 65 nm MIRRORBIT™ Eclipse technology | Enables 1 Gb density with low leakage and stable threshold voltage over temperature and lifetime. |
| Asynchronous 32-byte page read | Reduces average instruction fetch latency by enabling fast intra-page reads after initial 90 ns access. |
| 512-byte programming buffer | Allows full-page firmware patch writes in one command, minimizing bus arbitration overhead in OTA update sequences. |
| Hardware ECC (single-bit correction) | Eliminates soft-error-induced boot failures without software intervention or external ECC controller. |
| Uniform 128-kbyte sectors | Supports deterministic firmware partitioning (e.g., bootloader, app, config, OTA staging) with atomic erase boundaries. |
| Separate 1024-byte OTP array | Stores immutable keys, calibration data, or serial numbers; dual lockable regions prevent accidental overwrite. |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated engine maps, diagnostic routines, and boot firmware in AEC-Q100 Grade 2 ECU modules. IC Role / Device Role / Timing Role: Primary non-volatile boot ROM and runtime firmware store with XIP support and hardware ECC. Use Value: Guaranteed 20-year data retention and 100K-cycle endurance ensure field reliability across 15+ year vehicle lifetimes. |
Use Scenario: Holding ladder logic programs, I/O configuration, and safety firmware in DIN-rail mounted programmable logic controllers. IC Role / Device Role / Timing Role: High-reliability firmware archive with sector-level protection against unauthorized modification. Use Value: Uniform 128-kbyte sectors allow isolated firmware rollback and secure OTA patching without full reflash. |
| Medical Imaging System Boot Memory | Avionics Data Logger Storage |
Use Scenario: Hosting boot loader and FPGA configuration bitstreams in FDA-cleared imaging equipment requiring traceable firmware integrity. IC Role / Device Role / Timing Role: Secure, ECC-protected boot source with OTP-stored cryptographic keys for chain-of-trust validation. Use Value: Internal hardware ECC and dual-lock OTP eliminate need for external integrity verification circuitry. |
Use Scenario: Recording flight-critical sensor logs and system health telemetry in DO-178C-certified avionics recorders. IC Role / Device Role / Timing Role: High-endurance non-volatile storage with suspend/resume capability for uninterrupted logging during power transients. Use Value: Program/erase suspend ensures no log loss during voltage dips, meeting RTCA/DO-160 Section 21 surge immunity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GS10TFIV10 | Same die, but rated for –40°C to +85°C (Industrial grade); lacks AEC-Q100 qualification. | Not suitable for under-hood automotive use; acceptable for indoor industrial control panels. | Select when cost sensitivity outweighs extended temperature or automotive qualification needs. |
| MX29GL128FDTI-90G | 128 Mb density (1/8 capacity), 90 ns access, no integrated ECC, no OTP array. | Limited to smaller firmware images; requires external ECC logic for safety-critical boot paths. | Choose only for legacy designs where footprint compatibility and lower density suffice. |
Compared with S29GL01GS11TFIV10, the S29GL01GS10TFIV10 trades automotive qualification for lower cost, while MX29GL128FDTI-90G sacrifices density, ECC, and OTP to meet legacy pinout constraints-neither offers drop-in replacement capability without firmware or PCB revision.
Availability
S29GL01GS11TFIV10 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware upgrades, and medical imaging system boot memory requiring stable component supply across long production lifecycles.
Supply support for S29GL01GS11TFIV10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global R&D and manufacturing infrastructure.
This part belongs to the GL-S family of high-reliability parallel NOR flash memories, designed specifically for automotive and industrial applications demanding AEC-Q100 qualification, long data retention, and robust in-field firmware update capabilities.
FAQ
Is S29GL01GS11TFIV10 pin-compatible with earlier S29GLxxxS devices?
Yes-it shares identical 64-ball LAE BGA pinout and command set with other GL-S family members (e.g., S29GL512S, S29GL256S), enabling density-scaling within the same PCB footprint and firmware stack. Address bus width scales with density (A25 for 1 Gb), but pin functions and timing remain consistent.
Does this device support execute-in-place (XIP) operation?
Yes-its 90 ns random access time and asynchronous interface allow direct CPU instruction fetch from flash without copying to RAM. The 32-byte page read mode further accelerates sequential XIP execution, making it suitable for real-time automotive and industrial control applications.
What is the purpose of the Versatile I/O (VIO) feature?
Versatile I/O allows independent VIO supply (1.65 V to VCC) for the DQ pins, enabling seamless interfacing with 1.8 V, 2.5 V, or 3.3 V logic families without level shifters. This simplifies mixed-voltage system design and reduces BOM count in heterogeneous MCU platforms.
How is the 1024-byte OTP array structured and protected?
The OTP array contains two independently lockable 512-byte regions. Once locked via dedicated commands, each region becomes permanently read-only. It is commonly used for storing cryptographic keys, device-specific calibration data, or unique identifiers-protected against accidental or malicious overwrite even during full-chip erase.
S29GL01GS11TFIV10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL01GS11TFIV10 FAQ
1.How can I place an order for S29GL01GS11TFIV10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GS11TFIV10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GS11TFIV10 reliable?
The price and inventory of S29GL01GS11TFIV10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS11TFIV10 is usually 5 days.
3.What payment methods are accepted for S29GL01GS11TFIV10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS11TFIV10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GS11TFIV10?
S29GL01GS11TFIV10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GS11TFIV10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GS11TFIV10?
For technical support, including S29GL01GS11TFIV10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS11TFIV10 requirements.
6.How does Aetrix verify that S29GL01GS11TFIV10 is sourced from the original manufacturer or authorized distributors?
All S29GL01GS11TFIV10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS11TFIV10 meets industry standards.
7.What is the process for return or replacement of S29GL01GS11TFIV10?
All S29GL01GS11TFIV10 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS11TFIV10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GS11TFIV10 part is unused and in its original packaging.
Return procedure for S29GL01GS11TFIV10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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