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Infineon Technologies S29GL01GS11TFIV13
- Part No.:
- S29GL01GS11TFIV13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL01GS11TFIV13.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:928
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Product details
Overview
S29GL01GS11TFIV13 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse technology, supporting single 3.0 V supply (2.7–3.6 V), 90 ns random access time, and 15 ns page access time for embedded boot code and firmware storage in industrial control systems.
For engineers reviewing the S29GL01GS11TFIV13 datasheet, S29GL01GS11TFIV13 pinout, S29GL01GS11TFIV13 application, or S29GL01GS11TFIV13 equivalent, key selection criteria include its 512-byte write buffer, internal hardware ECC for single-bit correction, uniform 128 kB sector erase, ASP protection, and AEC-Q100 Grade 2 qualification (–40°C to +105°C).
Technical Context
This device implements asynchronous parallel interface logic with dedicated CE#, OE#, and WE# control lines, enabling XIP-capable read operations and page-mode access where low-order address bits select within a 32-byte aligned page. It integrates an embedded algorithm controller (EAC) that executes program/erase sequences autonomously without host CPU intervention.
The flash uses a dual-plane architecture with sector-level granularity (128 kB per sector), supports suspend/resume during program or erase, and delivers status via status register, data polling, or RY/BY# pin - all compliant with Common Flash Interface (CFI) parameter tables for standardized software driver compatibility.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 1 Gb (128 MB); supports full firmware image storage for mid-tier microcontrollers and SoCs. |
| Interface | Parallel ×16 asynchronous; enables direct memory-mapped execution (XIP) without external buffering. |
| Access Time | 90 ns random / 15 ns page; ensures fast boot code fetch and real-time interrupt vector response. |
| Write Buffer | 512-byte (256-word); reduces effective programming time by batching writes instead of single-word cycles. |
| ECC | Internal hardware single-bit error correction; eliminates need for external ECC logic in safety-critical firmware storage. |
| Endurance | 100,000 program/erase cycles; suitable for field-upgradable firmware with frequent OTA updates. |
| Data Retention | 20 years at +85°C; guarantees long-term reliability in unattended industrial deployments. |
Pinout & Package
Package: 64-ball LAE Fortified BGA (9 mm × 9 mm, 0.8 mm pitch). Pinout validated per Infineon datasheet Rev. *U (2024-06-25), Section 12.2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A25 | Address inputs | 26-bit word-aligned address bus (AMAX = A25 for 1 Gb); supports full 128 MB address space. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates at VIO (1.65–VCC) for flexible voltage domain interfacing. |
| CE# | Chip enable | Active-low chip select; controls device participation in bus transactions; tCE ≤ 100 ns. |
| OE# | Output enable | Active-low read strobe; gates output drivers; tOE ≤ 35 ns under Versatile I/O conditions. |
| WE# | Write enable | Active-low write strobe; initiates internal program/erase algorithms when combined with command sequences. |
| RY/BY# | Ready/Busy indicator | Open-drain status signal; low during active program/erase; enables non-polling status monitoring. |
| WP# | Write protect | Hardware sector lock control; disables program/erase in protected sectors independent of software commands. |
| VCC | Core supply | 3.0 V ±0.3 V supply for core logic and memory array; powers read, program, and erase functions. |
| VIO | I/O supply | Independent 1.65–3.6 V I/O rail; decouples interface voltage from core, easing integration with mixed-voltage SoCs. |
Key Features
| Feature | Design Value |
|---|---|
| Page-mode read (32-byte alignment) | Enables 15 ns subsequent reads within same page, accelerating sequential instruction fetch in XIP applications. |
| Automatic ECC generation & correction | Single-bit error correction performed entirely in hardware during read; no firmware overhead or latency penalty. |
| Advanced Sector Protection (ASP) | Per-sector volatile/non-volatile lock bits allow dynamic or permanent firmware partitioning (e.g., bootloader vs. application). |
| 1024-byte OTP array with dual lock regions | Provides secure storage for keys, calibration data, or device-specific identifiers with irreversible locking capability. |
| Suspend/resume for program & erase | Allows high-priority read operations to interrupt background erase, improving system responsiveness in real-time OS environments. |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot firmware and configuration parameters in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: Non-volatile XIP-capable boot memory providing deterministic <90 ns instruction fetch latency during cold start and runtime updates. Use Value: 20-year data retention and 100K endurance ensure reliable operation over 15+ year equipment lifecycles without field replacement. | Use Scenario: Hosting boot code and safety-critical sensor fusion firmware in automotive camera ECU modules certified to AEC-Q100 Grade 2. IC Role / Device Role / Timing Role: AEC-Q100 qualified parallel NOR flash with internal ECC and sector protection for ASIL-B compliant boot integrity. Use Value: Hardware-based ASP and OTP prevent unauthorized firmware modification, meeting ISO 26262 functional safety requirements. |
| Medical Imaging System BIOS | Telecom Base Station Configuration |
Use Scenario: Storing diagnostic BIOS and calibration tables in portable ultrasound devices requiring zero-failure firmware integrity. IC Role / Device Role / Timing Role: High-reliability firmware storage with automatic single-bit ECC correction and 128 kB uniform sector erase for safe field updates. Use Value: Eliminates need for external error-checking logic while maintaining strict FDA-regulated data integrity standards. | Use Scenario: Holding FPGA configuration bitstreams and protocol stack parameters in 5G remote radio units exposed to wide temperature swings. IC Role / Device Role / Timing Role: Industrial-grade (–40°C to +105°C) parallel flash with Versatile I/O supporting 1.8 V/3.3 V host interface compatibility. Use Value: Dual-voltage I/O simplifies interface design across multi-generation baseband processors without level-shifter components. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GP11TFIV13 | Same density and package, but uses standard (non-Fortified) BGA; lacks enhanced mechanical robustness and thermal cycling performance. | Not qualified for automotive Grade 2; limited to industrial grade (–40°C to +85°C) only. | Select only for cost-sensitive non-automotive designs where board-level shock/vibration is minimal. |
| MX29GL128FPTI-90G | 128 Mb density (1/8 capacity); 90 ns access; no integrated ECC; requires external error management. | Lacks OTP, ASP, and suspend/resume features; unsuitable for safety-critical or field-upgradeable systems. | Consider only for legacy designs with fixed firmware and no OTA update requirement. |
Compared with S29GL01GP11TFIV13 and MX29GL128FPTI-90G, the S29GL01GS11TFIV13 uniquely combines AEC-Q100 Grade 2 qualification, hardware ECC, and Fortified BGA packaging-enabling use in automotive ADAS and industrial edge controllers where reliability, security, and longevity are non-negotiable.
Availability
S29GL01GS11TFIV13 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS ECUs, medical imaging BIOS, and telecom base station configuration requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S29GL01GS11TFIV13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions for industrial and automotive markets.
The GL-S family targets embedded systems needing XIP-capable, high-endurance, ECC-equipped parallel NOR flash for boot code and firmware storage in harsh environments.
FAQ
What is the maximum operating temperature range for S29GL01GS11TFIV13?
This part is qualified to AEC-Q100 Grade 2, supporting continuous operation from –40°C to +105°C. Its thermal design includes enhanced package robustness and process-level reliability validation for automotive under-hood and industrial high-temperature environments.
Does S29GL01GS11TFIV13 require external ECC circuitry?
No. It integrates hardware-based single-bit error correction that operates automatically during every read cycle. No external logic, software routines, or additional memory bandwidth is needed to maintain data integrity.
Can S29GL01GS11TFIV13 be used in place of older S29GL01GP variants?
Yes, but only if the Fortified BGA mechanical enhancements and Grade 2 temperature rating are not required. The pinout and command set are identical; however, the 'S' suffix indicates reinforced packaging and extended qualification - critical for automotive and high-reliability applications.
How does the 512-byte write buffer improve programming efficiency?
It allows up to 512 bytes to be loaded into an internal buffer before initiating a single program operation, reducing bus arbitration overhead and achieving 1.5 MBps effective programming rate - over 3× faster than sequential single-word programming.
S29GL01GS11TFIV13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL01GS11TFIV13 FAQ
1.How can I place an order for S29GL01GS11TFIV13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GS11TFIV13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GS11TFIV13 reliable?
The price and inventory of S29GL01GS11TFIV13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS11TFIV13 is usually 5 days.
3.What payment methods are accepted for S29GL01GS11TFIV13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS11TFIV13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GS11TFIV13?
S29GL01GS11TFIV13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GS11TFIV13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GS11TFIV13?
For technical support, including S29GL01GS11TFIV13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS11TFIV13 requirements.
6.How does Aetrix verify that S29GL01GS11TFIV13 is sourced from the original manufacturer or authorized distributors?
All S29GL01GS11TFIV13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS11TFIV13 meets industry standards.
7.What is the process for return or replacement of S29GL01GS11TFIV13?
All S29GL01GS11TFIV13 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS11TFIV13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GS11TFIV13 part is unused and in its original packaging.
Return procedure for S29GL01GS11TFIV13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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