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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL01GS11TFIV23

Name: S29GL01GS11TFIV23
Brand: Infineon Technologies
SKU: S29GL01GS11TFIV23
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL01GS11TFIV23

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 56-TFSOP (0.724", 18.40mm Width)

Datasheet:: S29GL01GS11TFIV23.pdf

Description:: IC FLASH 1GBIT PARALLEL 56TSOP

Quantity:: RFQ Add To RFQ list

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Product details

Overview

S29GL01GS11TFIV23 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with MIRRORBIT™ Eclipse 65 nm technology, 16-bit data bus, and single 2.7–3.6 V supply for read/program/erase. It delivers 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. Used in boot code storage for industrial microcontrollers requiring deterministic XIP execution.

For engineers reviewing the S29GL01GS11TFIV23 datasheet, S29GL01GS11TFIV23 pinout, S29GL01GS11TFIV23 application, or S29GL01GS11TFIV23 equivalent, key selection criteria include asynchronous 16-bit interface timing, sector-based erase granularity (128 kB), OTP array support, Versatile I/O voltage range (1.65 V to VCC), and AEC-Q100 Grade 2 qualification.

Technical Context

This device implements an embedded algorithm controller (EAC) that executes autonomous program and erase operations without external CPU intervention. Its architecture supports page-mode reads (32-byte aligned, 15 ns intra-page), buffer programming of up to 512 bytes per command, and suspend/resume for both program and erase cycles.

The flash integrates dual protection mechanisms: Advanced Sector Protection (ASP) with volatile/non-volatile lock bits per 128 kB sector, and a dedicated 1024-byte OTP array split into two lockable regions. Status reporting uses three concurrent methods: status register polling, data polling, and RY/BY# pin assertion.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	1 Gb (128 MB); supports full firmware image storage for mid-tier MCUs
Bus Width	×16 (16-bit word interface); eliminates need for byte-lane masking in 16-bit host systems
Random Access Time	90 ns at VCC = VIO; enables sub-11 MHz synchronous bus timing without wait states
Page Access Time	15 ns; allows burst reads within 32-byte pages for tight XIP loops
Erase Granularity	Uniform 128 kB sectors; balances update flexibility with wear leveling efficiency
Program Buffer Size	512 bytes; reduces host overhead by minimizing command overhead per write operation
Data Retention	20 years at +85°C; meets long-life requirements for sealed industrial controllers
Endurance	100,000 program/erase cycles per sector; supports field firmware updates over product lifetime

Pinout & Package

Package: 56-pin TSOP (Type I, 14 mm × 20 mm, 0.55 mm pitch). Pinout validated per Infineon datasheet Rev. *U (2024-06-25), Section 12.1.

Pin/Terminal	Circuit Role	Design Meaning
A0–A25	Address Inputs	26-bit address bus; A25 is MSB for 1 Gb density (2²⁶ × 16-bit words)
DQ0–DQ15	Data I/O	Bidirectional 16-bit data bus; supports byte/word writes via WE# and BYTE# control
CE#	Chip Enable	Active-low device select; controls power state entry and output driver enable
OE#	Output Enable	Active-low read strobe; gates output drivers without affecting internal state
WE#	Write Enable	Active-low write strobe; latches address/data on rising edge for command or data load
RY/BY#	Ready/Busy Output	Open-drain status indicator; low during embedded operations, high when ready
VCC	Core Supply	2.7–3.6 V core and I/O supply; single-rail simplifies power design
VIO	I/O Voltage	1.65–VCC; enables direct interfacing with 1.8 V or 3.3 V logic without level shifters

Key Features

Feature	Design Value
Hardware ECC Engine	On-die single-bit error correction with automatic detection; eliminates need for external ECC logic or software overhead
512-Byte Programming Buffer	Reduces effective programming time by >3× vs. single-word writes; critical for fast firmware patching
Suspend/Resume Capability	Allows interrupting erase or program to service higher-priority reads; preserves real-time responsiveness
1024-Byte OTP Array	Two independently lockable 512-byte regions; stores immutable keys, calibration data, or security credentials
Common Flash Interface (CFI)	Standardized parameter table accessible via read commands; enables OS/driver auto-configuration without hard-coded parameters

Applications

Industrial PLC Firmware Storage

Automotive ADAS Boot Memory

Use Scenario: Storing boot loader and safety-critical firmware in programmable logic controllers operating continuously in factory environments.

IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with deterministic 90 ns latency.

Use Value: 20-year data retention and 100K erase cycles ensure firmware integrity across 15+ year deployments without replacement.

Use Scenario: Holding boot code and configuration data for radar ECU in AEC-Q100 Grade 2 (–40°C to +105°C) automotive systems.

IC Role / Device Role / Timing Role: Qualified flash memory enabling cold-start execution under extended temperature stress with hardware ECC for ASIL-B compliance.

Use Value: Integrated ECC and sector protection meet ISO 26262 functional safety requirements for boot path integrity.

Medical Imaging System BIOS

Telecom Base Station Configuration

Use Scenario: Hosting BIOS and FPGA configuration bitstreams in diagnostic imaging equipment requiring regulatory traceability and long-term stability.

IC Role / Device Role / Timing Role: Secure, tamper-resistant storage with OTP region for cryptographic keys and calibration constants.

Use Value: Dual-lock OTP array prevents unauthorized modification of calibration data while supporting field recalibration workflows.

Use Scenario: Storing FPGA configuration, DSP firmware, and network protocol stacks in carrier-grade base station radios.

IC Role / Device Role / Timing Role: High-reliability parallel flash supporting hot-swap firmware updates via buffer programming and suspend/resume.

Use Value: 512-byte buffer and suspend capability allow seamless in-service updates without radio downtime.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL01GT11TFIV20	Same density and package, but automotive Grade 3 (–40°C to +85°C); no OTP array	Lacks OTP region; unsuitable for key storage or secure calibration	Select only if Grade 3 temp range suffices and OTP is unnecessary
MX29GL128FPTI-90G	128 Mb density (1/8 capacity), 90 ns access, no hardware ECC, no suspend/resume	Lower endurance (100K vs. same), no OTP, no CFI support	Acceptable only for cost-sensitive, low-update-frequency applications with smaller firmware footprints

Compared with S29GL01GT11TFIV20 and MX29GL128FPTI-90G, the S29GL01GS11TFIV23 uniquely combines 1 Gb density, hardware ECC, OTP security, and suspend/resume-making it the only choice for safety-critical, field-upgradable, long-lifecycle embedded systems.

Availability

S29GL01GS11TFIV23 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS ECUs, medical imaging BIOS, and telecom base station configuration requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for S29GL01GS11TFIV23 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for industrial, automotive, and IoT applications.

The GL-S family targets high-reliability embedded systems needing deterministic XIP performance, robust data integrity, and long-term firmware update capability-especially where AEC-Q100 qualification and hardware ECC are mandatory.

FAQ

What is the purpose of the Versatile I/O (VIO) feature?

The Versatile I/O feature allows independent voltage supply (1.65 V to VCC) for the DQ pins, enabling direct interface with mixed-voltage systems-such as connecting a 1.8 V FPGA to a 3.3 V core supply-without external level shifters. This reduces BOM count and signal integrity risk while maintaining full timing compliance.

How does the 512-byte programming buffer improve system performance?

The 512-byte buffer allows loading an entire block before initiating programming, reducing command overhead and bus arbitration delays. Measured performance shows 1.5 MBps effective write speed-over 3× faster than single-word programming-critical for minimizing firmware update windows in field-deployed devices.

Is the OTP array truly one-time programmable?

Yes-the 1024-byte OTP array consists of two 512-byte regions, each with independent lock bits. Once locked, the region becomes permanently read-only; no command or voltage sequence can unlock or reprogram it. This ensures cryptographic keys or calibration data remain immutable after factory programming.

Can this device replace older S29GL series parts in existing designs?

Yes, S29GL01GS11TFIV23 maintains pin-to-pin compatibility with prior S29GL01Gxxx TSOP variants and shares identical command sets and timing models. However, verify VIO voltage tolerance and OTP access behavior in legacy firmware, as newer revisions may expose additional CFI descriptors or status bits.

S29GL01GS11TFIV23 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 56-TFSOP (0.724", 18.40mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 1Gbit

Memory Organization:: 64M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 110 ns

Voltage - Supply:: 1.65V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 56-TSOP

S29GL01GS11TFIV23 FAQ

1.How can I place an order for S29GL01GS11TFIV23 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL01GS11TFIV23 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL01GS11TFIV23 reliable?

The price and inventory of S29GL01GS11TFIV23 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS11TFIV23 is usually 5 days.

3.What payment methods are accepted for S29GL01GS11TFIV23?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS11TFIV23 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL01GS11TFIV23?

S29GL01GS11TFIV23 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL01GS11TFIV23 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL01GS11TFIV23?

For technical support, including S29GL01GS11TFIV23 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS11TFIV23 requirements.

6.How does Aetrix verify that S29GL01GS11TFIV23 is sourced from the original manufacturer or authorized distributors?

All S29GL01GS11TFIV23 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS11TFIV23 meets industry standards.

7.What is the process for return or replacement of S29GL01GS11TFIV23?

All S29GL01GS11TFIV23 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS11TFIV23, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL01GS11TFIV23 part is unused and in its original packaging.

Return procedure for S29GL01GS11TFIV23:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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