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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL01GS11TFV010

Name: S29GL01GS11TFV010
Brand: Infineon Technologies
SKU: S29GL01GS11TFV010
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL01GS11TFV010

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 56-TFSOP (0.724", 18.40mm Width)

Datasheet:: S29GL01GS11TFV010.pdf

Description:: IC FLASH 1GBIT PARALLEL 56TSOP

Quantity:: RFQ Add To RFQ list

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Inventory:3,479

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Product details

Overview

S29GL01GS11TFV010 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), and 65 nm MIRRORBIT™ Eclipse process technology. It delivers 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. Used in boot code storage and firmware execution in industrial controllers requiring deterministic read latency and long-term data retention.

For engineers reviewing the S29GL01GS11TFV010 datasheet, S29GL01GS11TFV010 pinout, S29GL01GS11TFV010 application, or S29GL01GS11TFV010 equivalent, key selection criteria include uniform 128-kB sector erase granularity, 512-byte programming buffer throughput (1.5 MBps), Versatile I/O support (1.65–3.6 V), AEC-Q100 Grade 2 qualification, and CFI-compliant interface for BIOS/UEFI compatibility.

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A25), supporting both standard and page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations autonomously, including suspend/resume capability and status reporting via RY/BY# pin, status register, or data polling.

The internal architecture includes a 32-byte page-aligned read path, dedicated erase voltage generator, and dual-sector protection logic enabling volatile/non-volatile lock per 128-kB sector. The 1024-byte OTP array supports secure silicon region configuration with two independently lockable regions.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	1 Gb (128 MB) - supports full firmware images for mid-tier microcontrollers and FPGA configuration bitstreams
Random Access Time	90 ns at VCC = VIO - enables XIP execution without wait states in 50 MHz bus systems
Page Access Time	15 ns - accelerates sequential instruction fetch within same 32-byte aligned page
Programming Buffer	512 bytes - reduces effective programming time by batching writes, achieving 1.5 MBps throughput
Erase Granularity	Uniform 128 kB sectors - simplifies firmware update partitioning and wear leveling in bootloader designs
Data Retention	20 years - ensures reliable operation over full product lifecycle in industrial environments
Endurance	100,000 program/erase cycles - supports field-upgradable firmware with frequent patch deployment
I/O Voltage Range	VIO = 1.65–3.6 V - allows direct interfacing with 1.8 V, 2.5 V, or 3.3 V host processors without level shifters

Pinout & Package

Package: 64-ball LAE Fortified BGA (9 mm × 9 mm, 0.8 mm pitch). Pinout validated per Infineon datasheet 001-98285 Rev. *U, Section 12.2.

Pin/Terminal	Circuit Role	Design Meaning
A0–A25	Address Inputs	Word-aligned address bus; A25 enables full 1 Gb addressing (2²⁶ × 16-bit words)
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports high-speed page reads and buffer programming
CE#	Chip Enable	Active-low chip select; controls device power state and bus contention during multi-device configurations
OE#	Output Enable	Active-low read strobe; gates output drivers to prevent bus conflicts during shared-memory access
WE#	Write Enable	Active-low write strobe; initiates command latching and embedded program/erase sequences
RY/BY#	Ready/Busy Output	Open-drain status indicator; signals active programming/erasing or ready state for polling-free timing control
RESET#	Hardware Reset	Active-low asynchronous reset; forces device into known state and aborts ongoing operations
WP#	Write Protect	Hardware sector protection enable; disables program/erase commands when asserted

Key Features

Feature	Design Value
Hardware ECC	Single-bit error correction with automatic detection - eliminates need for external error-handling logic in safety-critical boot memory
Suspend/Resume	Interruptible program/erase operations - enables real-time response to host interrupts without data corruption
Advanced Sector Protection	Volatile and non-volatile lock per 128-kB sector - supports secure bootloader + application partitioning with independent update policies
CFI Compliance	Standardized parameter table accessible via read commands - enables auto-configuration in UEFI BIOS and Linux MTD drivers
OTP Array	1024-byte one-time-programmable region with two lockable sections - stores cryptographic keys or calibration data immune to field reprogramming

Applications

Industrial PLC Firmware Storage

Automotive ADAS Boot Memory

Use Scenario: Storing boot firmware and real-time control logic in programmable logic controllers operating continuously in factory environments.

IC Role / Device Role / Timing Role: Primary non-volatile boot memory executing XIP code with deterministic 90 ns read latency and 20-year data retention.

Use Value: Uniform 128-kB sector erase enables atomic firmware updates without runtime interruption; ECC ensures integrity of safety-critical ladder logic.

Use Scenario: Hosting boot code and sensor fusion algorithms in automotive camera ECUs certified to AEC-Q100 Grade 2 (–40°C to +105°C).

IC Role / Device Role / Timing Role: AEC-Q100 qualified NOR flash providing secure, fast-access boot image with hardware reset recovery and OTP key storage.

Use Value: Versatile I/O (1.65–3.6 V) interfaces directly with 1.8 V SoC peripherals; OTP region stores asymmetric keys for secure boot verification.

Medical Imaging System Configuration

Telecom Base Station FPGA Bitstream

Use Scenario: Storing FPGA configuration bitstreams and calibration profiles in portable ultrasound devices requiring regulatory compliance and field updates.

IC Role / Device Role / Timing Role: High-reliability configuration memory with 100,000 erase cycles supporting frequent firmware patches during clinical validation.

Use Value: Page-mode read (15 ns) accelerates FPGA reconfiguration; suspend/resume allows priority interrupt handling during bitstream loading.

Use Scenario: Holding FPGA configuration and protocol stack binaries in 5G remote radio units exposed to wide temperature swings and vibration.

IC Role / Device Role / Timing Role: Industrial-grade (–40°C to +85°C) parallel NOR flash delivering deterministic boot timing and robustness against power cycling.

Use Value: CFI interface enables automated bitstream validation in carrier-grade provisioning tools; 128-kB sector erase isolates corrupted partitions without full reload.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL01GS10TFV010	Same density and package, but rated for Industrial (–40°C to +85°C) only - lacks AEC-Q100 qualification	Not suitable for automotive ADAS or infotainment where Grade 2 thermal range is mandated	Select when cost sensitivity outweighs automotive qualification requirements
MX29GL128FPTI-90G	128 Mb (16 MB), 90 ns access, 48-pin TSOP - lower density, different package, no built-in ECC	Requires external error correction logic; insufficient capacity for full FPGA bitstreams or complex bootloaders	Choose only for legacy designs with space-constrained PCBs and minimal firmware footprint

Compared with S29GL01GS10TFV010, this part adds AEC-Q100 Grade 2 qualification and extended temperature operation; versus MX29GL128FPTI-90G, it provides 8× higher density, integrated ECC, and faster programming throughput - critical for modern embedded boot and configuration use cases.

Availability

S29GL01GS11TFV010 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system configuration requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for S29GL01GS11TFV010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, with global R&D and manufacturing infrastructure.

This device belongs to the GL-S MIRRORBIT™ Eclipse flash family, designed specifically for high-reliability embedded systems requiring execute-in-place capability, deterministic timing, and long-term data integrity in harsh environments.

FAQ

What is the maximum operating temperature range for S29GL01GS11TFV010?

The S29GL01GS11TFV010 is qualified for AEC-Q100 Grade 2 operation, supporting continuous operation from –40°C to +105°C. This rating is verified per Infineon's qualification test plan and applies to all electrical specifications in the datasheet under specified voltage and timing conditions.

Does this device support hardware reset recovery during active programming?

Yes. Assertion of the RESET# pin during embedded program or erase operations immediately halts the algorithm, clears internal state, and returns the device to reading mode. All pending operations are aborted, and the status register reflects the reset condition - enabling safe recovery in power-fail or watchdog timeout scenarios.

How does the Versatile I/O feature simplify system design?

Versatile I/O allows independent VIO supply from 1.65 V to 3.6 V while maintaining full functionality, eliminating level shifters when interfacing with 1.8 V or 2.5 V host processors. This reduces BOM count, PCB area, and signal integrity risk - especially beneficial in space-constrained telecom and medical modules.

Can the OTP array be used for secure key storage in cryptographic applications?

Yes. The 1024-byte OTP array contains two independently lockable regions. Once locked, contents cannot be modified or read back, making it suitable for storing private keys, device identifiers, or calibration constants. Locking is irreversible and performed via specific command sequences defined in the datasheet.

S29GL01GS11TFV010 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 56-TFSOP (0.724", 18.40mm Width)

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 1Gbit

Memory Organization:: 64M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 110 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 56-TSOP

S29GL01GS11TFV010 FAQ

1.How can I place an order for S29GL01GS11TFV010 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL01GS11TFV010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL01GS11TFV010 reliable?

The price and inventory of S29GL01GS11TFV010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS11TFV010 is usually 5 days.

3.What payment methods are accepted for S29GL01GS11TFV010?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS11TFV010 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL01GS11TFV010?

S29GL01GS11TFV010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL01GS11TFV010 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL01GS11TFV010?

For technical support, including S29GL01GS11TFV010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS11TFV010 requirements.

6.How does Aetrix verify that S29GL01GS11TFV010 is sourced from the original manufacturer or authorized distributors?

All S29GL01GS11TFV010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS11TFV010 meets industry standards.

7.What is the process for return or replacement of S29GL01GS11TFV010?

All S29GL01GS11TFV010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS11TFV010, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL01GS11TFV010 part is unused and in its original packaging.

Return procedure for S29GL01GS11TFV010:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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