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Infineon Technologies S29GL01GS11TFV013
- Part No.:
- S29GL01GS11TFV013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL01GS11TFV013.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:1,866
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Product details
Overview
S29GL01GS11TFV013 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It operates across industrial temperature range (–40°C to +85°C) and supports sector erase of uniform 128-kbyte sectors in embedded boot code storage applications.
For engineers reviewing the S29GL01GS11TFV013 datasheet, S29GL01GS11TFV013 pinout, S29GL01GS11TFV013 application, or S29GL01GS11TFV013 equivalent, key selection criteria include asynchronous 16-bit parallel interface timing, Versatile I/O voltage support (1.65 V to VCC), 512-byte programming buffer throughput (1.5 MBps), and AEC-Q100 grade 3 qualification for automotive control modules.
Technical Context
This device implements MIRRORBIT™ Eclipse architecture on 65 nm process, enabling simultaneous storage of two bits per cell via charge-trap technology. Its embedded algorithm controller (EAC) manages autonomous program/erase operations with suspend/resume capability and status reporting via status register, data polling, or RY/BY# pin.
The flash supports CFI-compliant identification and sector protection via volatile/non-volatile ASP methods. The 1024-byte OTP array includes two lockable regions for secure silicon configuration, and all read operations are asynchronous with 32-byte page-aligned access.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 1 Gb (128 MB) - supports full boot image storage for mid-tier microcontrollers |
| Interface | Parallel ×16 asynchronous - enables direct XIP execution without external buffering |
| Random Access Time | 90 ns at VCC = VIO - meets real-time interrupt latency requirements in industrial PLCs |
| Page Access Time | 15 ns - accelerates sequential instruction fetch within same 32-byte page |
| Programming Buffer | 512 bytes - reduces effective programming time by batching writes, achieving 1.5 MBps throughput |
| ECC | Hardware single-bit correction - ensures data integrity without host CPU overhead during long-term storage |
| Endurance | 100,000 program/erase cycles - suitable for firmware update partitions in field-deployed gateways |
| Data Retention | 20 years - guarantees reliability over product lifecycle in automotive ECUs |
Pinout & Package
Package: 56-pin TSOP (Type I, standard thickness), JEDEC MO-142AC compliant, body size 18.4 mm × 10.16 mm × 1.0 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A25 | Address inputs | 26-bit address bus supporting full 128 MB linear addressing (A25 valid for 1 Gb density) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports 1.65–3.6 V I/O voltage via Versatile I/O feature |
| CE# | Chip enable | Active-low device select; tCE = 90 ns max determines minimum chip selection interval |
| OE# | Output enable | Active-low read strobe; tOE = 25 ns max governs output hold timing in shared bus systems |
| WE# | Write enable | Active-low control for write/program commands; required for command sequence latching |
| RY/BY# | Ready/Busy indicator | Open-drain active-low signal indicating internal operation progress; eliminates need for polling loops |
| RESET# | Hardware reset | Active-low asynchronous reset that halts ongoing program/erase and returns to read mode |
| WP# | Write protect | Hardware sector protection override; disables program/erase when asserted low |
Key Features
| Feature | Design Value |
|---|---|
| 65 nm MIRRORBIT™ Eclipse technology | Enables 1 Gb density in compact TSOP package while maintaining 90 ns random access performance |
| Asynchronous 32-byte page read | Reduces average instruction fetch latency by >6× vs. full random access when executing contiguous code |
| Automatic hardware ECC | Corrects single-bit errors transparently during read, eliminating software ECC overhead and memory bandwidth penalty |
| Advanced Sector Protection (ASP) | Allows independent locking/unlocking of 128-kB sectors via volatile (power-on default) or non-volatile (permanent) methods |
| Secure OTP array | 1024-byte one-time-programmable region with dual lockable sections for bootloader keys or calibration data |
Applications
| Automotive Engine Control Unit (ECU) | Industrial Programmable Logic Controller (PLC) |
|---|---|
Use Scenario: Storing calibrated engine maps and diagnostic firmware in AEC-Q100 grade 3 environment. IC Role / Device Role / Timing Role: Boot code and parameter storage flash with XIP-capable parallel interface. Use Value: 90 ns random access and 20-year data retention ensure deterministic boot timing and lifetime calibration integrity. | Use Scenario: Holding ladder logic firmware and I/O configuration tables in factory automation controllers. IC Role / Device Role / Timing Role: Non-volatile program memory supporting hot-swappable module updates. Use Value: Sector erase granularity (128 kB) enables safe partial reprogramming without disrupting runtime logic execution. |
| Medical Imaging System Boot Memory | Telecom Base Station Firmware Storage |
Use Scenario: Hosting boot loader and safety-critical initialization routines in Class II medical devices. IC Role / Device Role / Timing Role: Secure, ECC-protected primary boot memory with OTP-locked security keys. Use Value: Hardware ECC and 1024-byte OTP with dual lock regions prevent unauthorized firmware modification and silent data corruption. | Use Scenario: Storing FPGA configuration bitstreams and protocol stack binaries in outdoor base station radios. IC Role / Device Role / Timing Role: High-reliability firmware archive with extended temperature operation (–40°C to +85°C). Use Value: 100,000 erase cycles and industrial-grade thermal margin support frequent field upgrades over 10+ year deployments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GS10TFV010 | Same 1 Gb density and TSOP package, but rated for industrial plus (–40°C to +105°C) and lacks AEC-Q100 qualification | Targeted at high-temperature industrial controls, not automotive ECUs | Select when extended temperature range is required and automotive qualification is unnecessary |
| MX29GL128FPTI-90G | 128 Mb density, 90 ns access, 48-pin TSOP, no built-in ECC or OTP array | Lower-cost option for simpler boot loaders where ECC and security features are handled externally | Select when system-level ECC is already implemented and 128 MB capacity suffices |
Compared with S29GL01GS11TFV013, the S29GL01GS10TFV010 offers higher temperature tolerance but omits automotive qualification, while the MX29GL128FPTI-90G provides cost savings at the expense of density, ECC, and security features-making it suitable only for less demanding firmware storage roles.
Availability
S29GL01GS11TFV013 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware updates, and medical imaging system boot memory requiring stable component supply and long-term lifecycle assurance.
Supply support for S29GL01GS11TFV013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and non-volatile memory solutions for mission-critical applications.
The GL-S family targets high-reliability embedded systems requiring fast XIP-capable flash with integrated data integrity and security features-designed specifically for automotive, industrial, and medical firmware storage where endurance, retention, and qualification matter.
FAQ
Does S29GL01GS11TFV013 support both 3.3 V and 1.8 V I/O interfaces?
Yes-it implements Infineon's Versatile I/O feature, allowing VIO to operate from 1.65 V to VCC (2.7–3.6 V). This enables direct interfacing with 1.8 V or 3.3 V host processors without level shifters, provided VIO is externally supplied within spec and matched to the host's I/O voltage.
Can the 1024-byte OTP array be reprogrammed after initial programming?
No-the OTP array is physically one-time programmable. Once a bit is set to '0', it cannot be changed back to '1'. Each of the two lockable regions can be permanently locked via dedicated lock bits, preventing further writes to that region even if the device is re-powered or reset.
What is the role of the RY/BY# pin during sector erase operations?
The RY/BY# pin goes low at the start of any embedded erase operation and remains low until completion. It provides hardware-based status signaling, allowing the host to avoid polling the status register and instead use interrupt-driven or wait-state logic-reducing CPU overhead and improving system responsiveness during long-duration erases.
How does the 512-byte programming buffer improve effective write speed?
The buffer allows up to 512 bytes to be loaded into an internal latch before initiating a single embedded program operation. This eliminates per-word command overhead, achieving 1.5 MBps effective throughput-over 3× faster than single-word programming-especially beneficial when writing contiguous firmware blocks or configuration data.
S29GL01GS11TFV013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL01GS11TFV013 FAQ
1.How can I place an order for S29GL01GS11TFV013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GS11TFV013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GS11TFV013 reliable?
The price and inventory of S29GL01GS11TFV013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS11TFV013 is usually 5 days.
3.What payment methods are accepted for S29GL01GS11TFV013?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS11TFV013 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GS11TFV013?
S29GL01GS11TFV013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GS11TFV013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GS11TFV013?
For technical support, including S29GL01GS11TFV013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS11TFV013 requirements.
6.How does Aetrix verify that S29GL01GS11TFV013 is sourced from the original manufacturer or authorized distributors?
All S29GL01GS11TFV013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS11TFV013 meets industry standards.
7.What is the process for return or replacement of S29GL01GS11TFV013?
All S29GL01GS11TFV013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS11TFV013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GS11TFV013 part is unused and in its original packaging.
Return procedure for S29GL01GS11TFV013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GS11TFV013 Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
Microchip Technology
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AT24C02C-SSHM-T
Microchip Technology
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics
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AT24CS02-SSHM-T
Microchip Technology
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93LC46BT-I/OT
Microchip Technology
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AT24C04C-SSHM-T
Microchip Technology
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24LC01BT-I/SN
Microchip Technology
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24AA02UIDT-I/OT
Microchip Technology
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AT24C08C-STUM-T
Microchip Technology
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