Infineon Technologies S29GL01GS11TFV020
- Part No.:
- S29GL01GS11TFV020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL01GS11TFV020.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 56TSOP
- Quantity:
- Payment:

- Shipping:

Inventory:110
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL01GS11TFV020 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 90 ns random access time, and 15 ns page access time. It integrates hardware ECC for single-bit error correction, 128 kB uniform sector erase, and a 512-byte write buffer-enabling fast embedded code storage and XIP execution in automotive instrument clusters and industrial PLCs.
For engineers reviewing the S29GL01GS11TFV020 datasheet, S29GL01GS11TFV020 pinout, S29GL01GS11TFV020 application, or S29GL01GS11TFV020 equivalent, key selection criteria include its Versatile I/O (1.65–3.6 V), AEC-Q100 Grade 2 qualification (–40°C to +105°C), 100,000 program/erase cycles, and support for suspend/resume during programming and erase operations.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A25), supports both full-VCC and Versatile I/O voltage modes, and uses MIRRORBIT™ Eclipse 65 nm technology to enable high-density non-volatile storage without external ECC logic. Its embedded algorithm controller handles all program/erase sequences autonomously.
The architecture includes dedicated status register, data polling, and RY/BY# pin for real-time operation monitoring; it also features a 1024-byte OTP array with dual lockable regions and Common Flash Interface (CFI) compliance for host software compatibility.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 1 Gb (128 MB) - supports full firmware images for mid-tier automotive ECUs |
| Random Access Time | 90 ns at VCC = VIO - enables direct XIP execution with minimal CPU stall cycles |
| Page Access Time | 15 ns - allows rapid sequential reads within 32-byte aligned pages |
| Write Buffer Size | 512 bytes - reduces effective programming time by batching up to 256 words per command |
| ECC Support | Internal hardware single-bit correction - eliminates need for external ECC logic or software overhead |
| Endurance & Retention | 100,000 program/erase cycles / 20 years data retention - meets long-life requirements for industrial control firmware |
| Operating Temperature | –40°C to +105°C (AEC-Q100 Grade 2) - qualified for under-hood automotive applications |
Pinout & Package
Package: 64-ball LAE Fortified BGA (9 mm × 9 mm, 0.8 mm pitch). Pinout validated per Infineon datasheet 001-98285 Rev. *U, Section 12.2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A25 | Address Inputs | Word-aligned address bus (A25 active for 1 Gb density); no byte-level addressing |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports Versatile I/O (1.65–3.6 V) |
| CE# | Chip Enable | Active-low chip select; controls device power state and command latching |
| OE# | Output Enable | Active-low read strobe; gates output drivers during read operations |
| WE# | Write Enable | Active-low write strobe; initiates internal program/erase algorithms when combined with address/data |
| RY/BY# | Ready/Busy Output | Open-drain status indicator; low during embedded operations, high when ready |
| WP# | Write Protect | Hardware sector protection enable; active-low, tied high for normal operation |
| VCC | Core Supply | 3.0 V core power (2.7–3.6 V); powers logic, array, and embedded controllers |
| VIO | I/O Supply | Independent I/O voltage (1.65–3.6 V); decouples interface timing from core voltage |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous Page Read | 32-byte aligned page access with 15 ns intra-page timing - accelerates boot code fetch and firmware patching |
| Embedded Algorithm Controller (EAC) | Fully autonomous program/erase sequencing - removes host CPU overhead and guarantees timing compliance |
| Advanced Sector Protection (ASP) | Volatile and non-volatile locking per 128 kB sector - prevents accidental overwrite of bootloader or calibration data |
| Secure Silicon Region (OTP) | 1024-byte one-time-programmable array with two independent lockable regions - stores cryptographic keys or device-specific identifiers |
| Common Flash Interface (CFI) | Standardized parameter table accessible via read commands - enables OS-agnostic flash management in Linux/uClinux and RTOS environments |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated gauge graphics, driver alert logic, and over-the-air update partitions in digital dashboards. IC Role / Device Role / Timing Role: Primary XIP-capable code storage with deterministic 90 ns read latency and AEC-Q100 Grade 2 thermal reliability. Use Value: Eliminates external SRAM buffering; supports secure field updates via OTP-protected boot loader region. | Use Scenario: Holding ladder logic firmware, I/O configuration tables, and safety-critical runtime parameters in modular automation controllers. IC Role / Device Role / Timing Role: Non-volatile firmware repository with sector-level write protection and suspend/resume during power brownouts. Use Value: Ensures deterministic restart after interruption; 100,000-cycle endurance exceeds 15-year industrial service life. |
| Medical Imaging Boot Memory | Avionics Display System |
Use Scenario: Hosting certified boot firmware and diagnostic self-test modules in portable ultrasound and MRI console systems. IC Role / Device Role / Timing Role: Secure, radiation-tolerant (industrial grade) boot source with hardware ECC and CFI-based validation. Use Value: Meets IEC 62304 Class C software requirements via built-in data integrity assurance. | Use Scenario: Storing display rendering microcode, font assets, and flight parameter overlays in certified cockpit displays. IC Role / Device Role / Timing Role: High-reliability parallel flash with –40°C to +105°C operation and 20-year data retention for DO-254 compliance. Use Value: Reduces BOM count by integrating OTP key storage and sector-lockable update zones. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GS11TFI020 | Same die, Industrial grade (–40°C to +85°C), TSOP-56 package | Lacks AEC-Q100 qualification; limited to non-automotive embedded systems | Select for cost-sensitive industrial HMI where extended temperature is not required |
| MX29GL128FPTI-90G | 128 Mb density, 90 ns access, no integrated ECC, 48-pin TSOP | Lower density and no hardware ECC; requires external error handling | Choose only if legacy board layout constrains footprint and ECC is managed in software |
Compared with S29GL01GS11TFV020, the S29GL01GS11TFI020 trades automotive qualification for lower cost and different packaging, while MX29GL128FPTI-90G offers reduced density and no ECC-making both unsuitable as drop-in replacements where AEC-Q100 compliance or hardware error correction is mandatory.
Availability
S29GL01GS11TFV020 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLC firmware storage, and avionics display systems requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S29GL01GS11TFV020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.
The GL-S family targets high-reliability embedded systems needing XIP-capable, high-density parallel NOR flash with automotive-grade qualification and integrated data integrity features.
FAQ
What is the purpose of the Versatile I/O (VIO) feature in S29GL01GS11TFV020?
The Versatile I/O feature allows independent voltage supply (1.65 V to VCC) for the DQ0–DQ15 data bus, enabling seamless interfacing with mixed-voltage SoCs or FPGAs without level shifters. It supports both full-VCC and reduced-I/O voltage modes, maintaining signal integrity and timing margins across diverse host platforms while reducing system-level BOM cost.
Does S29GL01GS11TFV020 support true byte-level writes?
No. S29GL01GS11TFV020 operates exclusively on 16-bit word boundaries (DQ0–DQ15), with no native byte-write capability. All program operations target full words; partial-word updates require read-modify-write sequences handled by host firmware. The device does not support byte-select signals or individual byte masking in hardware.
How is sector protection implemented, and can it be changed in-system?
Sector protection is implemented via Advanced Sector Protection (ASP), supporting both volatile (power-on reset clears) and non-volatile (permanent until unlocked) locking per 128 kB sector. Unlocking requires specific command sequences and WP# pin state verification. Once set non-volatile, protection persists through power cycles and cannot be altered without explicit unlock commands and correct timing.
What role does the Ready/Busy# (RY/BY#) pin play during embedded operations?
RY/BY# is an open-drain status output that goes low during any embedded operation (program, erase, or buffer write) and returns high upon completion. It provides hardware-synchronized readiness detection, eliminating the need for continuous status register polling and enabling precise timing control in interrupt-driven or DMA-based firmware architectures.
S29GL01GS11TFV020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL01GS11TFV020 FAQ
1.How can I place an order for S29GL01GS11TFV020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GS11TFV020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GS11TFV020 reliable?
The price and inventory of S29GL01GS11TFV020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS11TFV020 is usually 5 days.
3.What payment methods are accepted for S29GL01GS11TFV020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS11TFV020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GS11TFV020?
S29GL01GS11TFV020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GS11TFV020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GS11TFV020?
For technical support, including S29GL01GS11TFV020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS11TFV020 requirements.
6.How does Aetrix verify that S29GL01GS11TFV020 is sourced from the original manufacturer or authorized distributors?
All S29GL01GS11TFV020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS11TFV020 meets industry standards.
7.What is the process for return or replacement of S29GL01GS11TFV020?
All S29GL01GS11TFV020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS11TFV020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GS11TFV020 part is unused and in its original packaging.
Return procedure for S29GL01GS11TFV020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GS11TFV020 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

