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Infineon Technologies S29GL01GS12DAE020
- Part No.:
- S29GL01GS12DAE020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GS12DAE020.pdf
- Description:
- IC FLASH 1GBIT CFI 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,679
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Product details
Overview
S29GL01GS12DAE020 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC using 65-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It integrates hardware ECC for single-bit error correction, 128 KB uniform sector erase, and a 512-byte write buffer. Used in military-grade embedded systems requiring long-term data retention and high-reliability nonvolatile storage.
For engineers reviewing the S29GL01GS12DAE020 datasheet, S29GL01GS12DAE020 pinout, S29GL01GS12DAE020 application, or S29GL01GS12DAE020 equivalent, key selection criteria include military temperature range (–55°C to +125°C), asynchronous x16 interface timing, sector protection granularity, OTP array size, and ECC implementation method.
Technical Context
This device implements an asynchronous parallel interface with CE#, OE#, and WE# control signals, supporting word programming, write buffer programming (up to 512 bytes), and suspend/resume for both program and erase operations. Its internal architecture includes a dedicated Embedded Algorithm Controller (EAC) that manages command execution without external microcontroller intervention.
The flash array is organized into uniform 128 KB sectors, each independently erasable, and features dual protection modes: volatile (lock register) and non-volatile (Persistent Protection Bits). The integrated ECC engine operates transparently during read cycles and supports automatic correction of single-bit errors per 512-byte sector.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 1 Gb (128 MB) - supports large firmware images and boot code storage in space-constrained military platforms |
| Access Time | 100 ns random / 15 ns page - enables fast instruction fetch and real-time data access in deterministic systems |
| Supply Voltage | 2.7 V to 3.6 V - compatible with 3.3 V logic rails while tolerating brown-out conditions down to 2.7 V |
| ECC Capability | Hardware single-bit correction per 512-byte sector - eliminates need for external error-handling firmware overhead |
| Temperature Range | –55°C to +125°C - qualified for extended operation in avionics, missile guidance, and ground vehicle electronics |
| Endurance | 100,000 program/erase cycles - ensures longevity in field-updatable mission-critical firmware |
| Data Retention | 20 years at +125°C - guarantees integrity of stored configuration and calibration data over full system lifecycle |
Pinout & Package
Package: 64-ball LAE Fortified BGA (9 mm × 9 mm × 1.4 mm), RoHS-compliant, military-grade thermal and mechanical robustness.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address Inputs | 24-bit address bus supporting full 1 Gb addressing (128 MB × 8 bits) |
| DQ0–DQ15 | Data I/O (x16) | 16-bit bidirectional data path; supports byte-wide or word-wide transfers |
| CE# | Chip Enable | Active-low chip select; controls device power state and command recognition |
| OE# | Output Enable | Active-low signal enabling data output drivers during read operations |
| WE# | Write Enable | Active-low signal initiating program or erase commands when combined with address/data sequences |
| RY/BY# | Ready/Busy Output | Open-drain status indicator showing device busy during embedded operations |
| VCC | Core Supply | Single 2.7–3.6 V supply powers core logic, memory array, and ECC engine |
| VIO | I/O Supply | Independent 1.65–VCC voltage rail for flexible interfacing with mixed-voltage host systems |
Key Features
| Feature | Design Value |
|---|---|
| Write Buffer Programming | Up to 512 bytes per operation - reduces average programming time by >60% vs. single-word writes |
| Advanced Sector Protection | Per-sector lock via PPB and DYB - enables secure firmware partitioning and field update isolation |
| OTP Array | 1024-byte one-time-programmable region with two lockable sections - stores cryptographic keys or calibration constants permanently |
| CFI Compliance | Standard Common Flash Interface table - enables automatic driver detection and configuration in bootloader environments |
| Suspend/Resume | Interruptible program/erase - allows high-priority reads during background flash operations without data loss |
Applications
| Avionics Flight Control Systems | Tactical Radio Firmware Storage |
|---|---|
Use Scenario: Storing certified flight control software and sensor calibration tables in airborne computers subject to extreme thermal cycling and radiation exposure. IC Role / Device Role / Timing Role: Nonvolatile boot memory and runtime configuration store with deterministic 100 ns read latency for real-time interrupt response. Use Value: 20-year data retention at +125°C and ECC-protected reads ensure firmware integrity across aircraft service life without periodic refresh. | Use Scenario: Holding encrypted radio stack firmware and channel-specific parameter sets in handheld and vehicular tactical radios deployed in desert and arctic environments. IC Role / Device Role / Timing Role: Secure, field-updatable firmware repository with OTP-protected crypto keys and sector-level write protection. Use Value: Dual PPB/DYB protection prevents unauthorized firmware modification; 128 KB sector granularity enables selective OTA updates without full reflash. |
| Missile Guidance Onboard Memory | Ground Vehicle Mission Computer Storage |
Use Scenario: Hosting mission-critical guidance algorithms and inertial navigation coefficients in guided munitions exposed to high-G launch and wide ambient temperature swings. IC Role / Device Role / Timing Role: Radiation-tolerant, high-endurance flash for storing immutable guidance logic and dynamic trajectory parameters. Use Value: 100,000 P/E cycles and –55°C to +125°C operation support repeated pre-launch verification and in-field reprogramming under harsh conditions. | Use Scenario: Storing vehicle health monitoring firmware, CAN protocol stacks, and diagnostic logs in armored vehicle mission computers operating in vibration-intensive battlefield environments. IC Role / Device Role / Timing Role: High-reliability parallel flash interfaced directly to PowerPC or ARM-based mission processors via x16 bus. Use Value: Asynchronous page read mode delivers 15 ns access for rapid log retrieval; CFI compliance simplifies driver integration across multiple vehicle platforms. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GS12DHAE020 | Same die, 64-ball LAA BGA (13 mm × 11 mm) - larger footprint, higher thermal mass | Better thermal dissipation in conduction-cooled chassis; less suitable for ultra-dense PCB layouts | Select when board layout allows larger package and thermal management prioritizes steady-state power dissipation over size |
| MX29GL128FPTI-90G | 128 Mb density, 90 ns access, no integrated ECC, different command set, 48-pin TSOP | Limited to smaller firmware images; requires external ECC logic or software mitigation | Choose only if legacy design constraints mandate TSOP packaging and lower density suffices |
Compared with S29GL01GS12DHAE020, the LAE package offers superior board-area efficiency and faster thermal response; versus MX29GL128F, the S29GL01GS provides 8× density, hardware ECC, and military temperature compliance-critical for next-generation secure embedded systems.
Availability
S29GL01GS12DAE020 is available at Aetrix Electronics and suitable for avionics, tactical communications, missile guidance, and ground vehicle mission computing requiring stable component supply across extended product lifecycles.
Supply support for S29GL01GS12DAE020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, industrial, and security solutions, with leadership in flash memory for mission-critical applications.
The GL-S series targets high-reliability embedded systems demanding military-grade temperature operation, long data retention, and hardware-assisted data integrity-designed specifically for defense, aerospace, and industrial control markets.
FAQ
Does S29GL01GS12DAE020 support JEDEC-standard command sets?
No. It uses Infineon's proprietary command set aligned with CFI v1.3, including unlock-bypass, write-buffer, and suspend/resume sequences. While CFI query capability is present for auto-configuration, direct JEDEC JESD21-C compatibility is not implemented.
What is the function of the RY/BY# pin during write buffer programming?
RY/BY# transitions low at the start of write buffer programming and remains low until all 512 bytes are verified. It does not pulse between buffer loads; it asserts continuously for the full buffer operation duration, enabling simple polling without status register reads.
Can the OTP array be reprogrammed after initial programming?
No. The 1024-byte OTP array is permanently programmable once. Each of its two lockable regions can be individually locked via PPB bits, preventing further writes. Unlocking is impossible after lock activation-ensuring cryptographic key immutability.
How does the device handle power loss during sector erase?
It employs an internal power-loss detection circuit that halts erase progression and preserves sector integrity. Upon power restoration, the device reports "erase suspended" status via Status Register bit 6, allowing host firmware to safely resume or abort the operation without corruption.
S29GL01GS12DAE020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- CFI
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 120 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -55°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL01GS12DAE020 FAQ
1.How can I place an order for S29GL01GS12DAE020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GS12DAE020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GS12DAE020 reliable?
The price and inventory of S29GL01GS12DAE020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS12DAE020 is usually 5 days.
3.What payment methods are accepted for S29GL01GS12DAE020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS12DAE020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GS12DAE020?
S29GL01GS12DAE020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GS12DAE020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GS12DAE020?
For technical support, including S29GL01GS12DAE020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS12DAE020 requirements.
6.How does Aetrix verify that S29GL01GS12DAE020 is sourced from the original manufacturer or authorized distributors?
All S29GL01GS12DAE020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS12DAE020 meets industry standards.
7.What is the process for return or replacement of S29GL01GS12DAE020?
All S29GL01GS12DAE020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS12DAE020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GS12DAE020 part is unused and in its original packaging.
Return procedure for S29GL01GS12DAE020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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