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Infineon Technologies S29GL01GS12DAE023
- Part No.:
- S29GL01GS12DAE023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GS12DAE023.pdf
- Description:
- IC FLASH 1GBIT CFI 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,159
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Product details
Overview
S29GL01GS12DAE023 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC using 65-nm MIRRORBIT™ technology, operating from a single 2.7–3.6 V supply with military-grade temperature range (–55°C to +125°C). It delivers 100 ns random access time, 15 ns page access time, and integrates hardware ECC for single-bit error correction. Used in high-reliability embedded systems such as avionics control modules and ruggedized communication baseband firmware storage.
For engineers reviewing the S29GL01GS12DAE023 datasheet, S29GL01GS12DAE023 pinout, S29GL01GS12DAE023 application, or S29GL01GS12DAE023 equivalent, key selection factors include its 128 KB uniform sector erase architecture, 512-byte write buffer throughput (1.5 MBps), Versatile I/O support (1.65 V to VCC), CFI compliance, and OTP array with dual lockable regions.
Technical Context
This device implements an asynchronous parallel interface with x16 data bus and dedicated CE#, OE#, and WE# control lines. Its embedded algorithm controller (EAC) manages program/erase operations including suspend/resume capability, blank check, and status monitoring via Status Register, Data Polling, or Ready/Busy pin.
The flash array is organized into uniform 128 KB sectors with Advanced Sector Protection (ASP) supporting volatile/non-volatile locking, Persistent Protection Bits (PPB), Dynamic Protection Bits (DYB), and password-protected Secure Silicon Region (SSR) - a 1024-byte OTP array with two independently lockable regions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 1 Gb (128 MB) - supports large firmware images and boot code storage in space-constrained military platforms |
| Access Time | 100 ns random / 15 ns page - enables fast instruction fetch and real-time code execution without wait states |
| Write Buffer | 512 bytes - allows burst programming at 1.5 MBps, reducing total firmware update time by >4× vs. word-by-word |
| ECC | Hardware single-bit correction - eliminates need for external error-handling logic in safety-critical boot memory |
| Endurance | 100 program/erase cycles - sufficient for field-upgradable mission-critical firmware with infrequent updates |
| Data Retention | 20 years at +125°C - validated for long-term deployment in uncooled airborne or ground vehicle electronics |
| Temperature Grade | Military (–55°C to +125°C) - qualified per MIL-STD-883 for extreme environmental operation |
Pinout & Package
Package: 64-ball LAE Fortified BGA (9 mm × 9 mm × 1.4 mm), RoHS-compliant, lead-free, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address Inputs | 24-bit address bus supporting full 128 MB linear addressing; A0–A1 select x16 data word within 16-bit bus |
| DQ0–DQ15 | Data I/O | x16 bidirectional data bus; supports Versatile I/O (1.65 V to VCC) for mixed-voltage system interfacing |
| CE# | Chip Enable | Active-low chip select; controls device power state and enables multi-chip memory expansion |
| OE# | Output Enable | Active-low read strobe; decouples output drivers to prevent bus contention during shared-memory access |
| WE# | Write Enable | Active-low write strobe; initiates internal program/erase algorithms when combined with command sequences |
| R/B# | Ready/Busy Output | Open-drain status indicator; signals completion of embedded operations without polling overhead |
| VCC | Core Supply | 2.7–3.6 V single supply for all operations - eliminates need for separate I/O or core voltage rails |
| VIO | I/O Supply | 1.65–VCC - enables direct interfacing with 1.8 V, 2.5 V, or 3.3 V controllers without level shifters |
Key Features
| Feature | Design Value |
|---|---|
| Uniform 128 KB Sectors | Enables deterministic firmware partitioning and atomic OTA updates without partial-sector corruption risk |
| Suspend/Resume Commands | Allows interruption of long erase (up to 1 s) or program operations to service higher-priority interrupts - critical for real-time OS environments |
| Common Flash Interface (CFI) | Provides standardized JEDEC-compliant parameter table for automatic driver detection and configuration in bootloader code |
| Secure Silicon Region (OTP) | 1024-byte one-time-programmable area with two lockable regions - stores cryptographic keys or calibration data immune to field reprogramming |
| Advanced Sector Protection | Combines hardware (WP#), software (PPB/DYB), and password-based locking - meets DO-178C and MIL-STD-40051-2 security requirements |
Applications
| Avionics Flight Control Unit | Tactical Radio Firmware Storage |
|---|---|
Use Scenario: Stores certified flight control software and sensor calibration tables in UAV autopilot systems requiring restart resilience and radiation-tolerant non-volatility. IC Role / Device Role / Timing Role: Primary boot memory mapped at reset vector; provides deterministic 100 ns instruction fetch latency under vibration and thermal cycling. Use Value: 20-year data retention at +125°C ensures firmware integrity across aircraft service life without periodic refresh; ECC prevents silent corruption from single-event upsets. | Use Scenario: Holds encrypted waveform definitions and secure boot images in handheld HF/VHF radios deployed in battlefield EMI environments. IC Role / Device Role / Timing Role: Firmware storage with hardware-level protection; OTP region stores decryption keys isolated from field-updatable partitions. Use Value: Dual-lock OTP and PPB-based sector locking meet NSA Type 1 encryption key storage requirements; Versatile I/O simplifies interface to 1.8 V baseband processors. |
| Armored Vehicle Engine Control | Spacecraft Onboard Computer Boot ROM |
Use Scenario: Hosts engine management firmware and emission calibration maps in diesel-electric hybrid drive systems exposed to wide thermal transients and mechanical shock. IC Role / Device Role / Timing Role: Non-volatile program memory with sector-level erase granularity - enables safe over-the-air updates of calibration parameters without disrupting active control loops. Use Value: Suspend/resume capability allows interrupt-driven diagnostics during sector erase; 100-cycle endurance exceeds expected field update frequency over 15+ year vehicle lifecycle. | Use Scenario: Stores radiation-hardened boot loader and fault-tolerant housekeeping firmware in LEO satellite OBCs where reprogramming must survive launch vibration and vacuum outgassing. IC Role / Device Role / Timing Role: Trusted boot source with CFI-verified identity and hardware ECC - validates firmware integrity before CPU initialization. Use Value: Military-grade packaging (LAE BGA) and 65-nm process reduce soft-error rate; 128 KB uniform sectors simplify scrubbing and redundancy management in triple-modular-redundancy architectures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GS12DHV023 | Same die, 64-ball LAA BGA (13 mm × 11 mm); higher thermal mass, different land pattern | Preferred for conduction-cooled chassis with larger PCB footprint allowance | Select when mechanical mounting constraints favor larger BGA pitch or enhanced thermal dissipation is required |
| MX29GL128FDTI-90G | 128 Mb density (1/8 capacity), 90 ns access, no integrated ECC, commercial temp only (0°C to +70°C) | Limited to non-mission-critical industrial HMI or legacy telecom line cards | Only consider for cost-sensitive, non-ruggedized designs where firmware size < 16 MB and ECC is implemented externally |
Compared with S29GL01GS12DHV023, this LAE-packaged variant offers smaller footprint and lower weight for SWaP-constrained platforms; versus MX29GL128FDTI-90G, it delivers 8× density, military temp rating, hardware ECC, and OTP - making it the sole option for certified safety- or security-critical firmware storage.
Availability
S29GL01GS12DAE023 is available at Aetrix Electronics and suitable for avionics flight control units, tactical radio firmware storage, and armored vehicle engine control systems requiring stable component supply across extended product lifecycles.
Supply support for S29GL01GS12DAE023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions for industrial and defense applications.
The GL-S series targets military and aerospace embedded systems requiring guaranteed data integrity, long-term availability, and qualification to extended temperature and reliability standards - not general-purpose consumer flash.
FAQ
Is S29GL01GS12DAE023 compatible with standard JEDEC parallel NOR flash command sets?
Yes - it fully complies with the Common Flash Interface (CFI) specification and supports industry-standard command sequences for read, program, and erase operations. The device responds to JEDEC ID queries and exposes a complete CFI parameter table at known addresses, enabling drop-in compatibility with existing NOR flash drivers in VxWorks, Linux MTD, and bare-metal bootloaders.
Does this part support both synchronous and asynchronous read modes?
No - S29GL01GS12DAE023 operates exclusively in asynchronous mode. It lacks clock inputs and does not support DDR or QSPI timing protocols. All read operations are controlled by CE#, OE#, and address setup/hold timing; page-mode reads are supported but require no clock signal.
What is the function of the R/B# pin, and how is it used in system design?
R/B# is an open-drain Ready/Busy output that asserts low during internal program or erase operations and goes high when complete. It eliminates the need for continuous status register polling, reducing CPU overhead and bus traffic. System designers connect it to an interrupt input or GPIO with pull-up resistor, enabling event-driven firmware flow control during long-duration flash operations.
Can the OTP region be reprogrammed after initial programming?
No - the Secure Silicon Region (SSR) is one-time programmable. Once written and locked (via PPB or password), its contents cannot be altered. Each of the two lockable 512-byte regions can be independently programmed and permanently secured, making it suitable for storing immutable cryptographic keys, calibration constants, or device serial numbers in tamper-resistant applications.
S29GL01GS12DAE023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- CFI
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 120 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -55°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL01GS12DAE023 FAQ
1.How can I place an order for S29GL01GS12DAE023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GS12DAE023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GS12DAE023 reliable?
The price and inventory of S29GL01GS12DAE023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS12DAE023 is usually 5 days.
3.What payment methods are accepted for S29GL01GS12DAE023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS12DAE023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GS12DAE023?
S29GL01GS12DAE023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GS12DAE023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GS12DAE023?
For technical support, including S29GL01GS12DAE023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS12DAE023 requirements.
6.How does Aetrix verify that S29GL01GS12DAE023 is sourced from the original manufacturer or authorized distributors?
All S29GL01GS12DAE023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS12DAE023 meets industry standards.
7.What is the process for return or replacement of S29GL01GS12DAE023?
All S29GL01GS12DAE023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS12DAE023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GS12DAE023 part is unused and in its original packaging.
Return procedure for S29GL01GS12DAE023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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