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Infineon Technologies S29GL01GS12DHE023
- Part No.:
- S29GL01GS12DHE023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GS12DHE023.pdf
- Description:
- IC FLASH 1GBIT CFI 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,685
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Product details
Overview
S29GL01GS12DHE023 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC using 65-nm MIRRORBIT™ technology, operating from a single 2.7–3.6 V supply with military-grade temperature range (–55°C to +125°C), 100 ns random access time, and 15 ns page access time. It integrates hardware ECC, 512-byte write buffer, uniform 128 KB sectors, and ASP for secure embedded storage in avionics control modules.
For engineers reviewing the S29GL01GS12DHE023 datasheet, S29GL01GS12DHE023 pinout, S29GL01GS12DHE023 application, or S29GL01GS12DHE023 equivalent, key selection criteria include military-qualified 128 KB sector erase, Versatile I/O support (1.65 V to VCC), CFI compliance, OTP array with dual lockable regions, and suspend/resume capability for real-time firmware updates.
Technical Context
This device implements asynchronous parallel interface with x16 data bus and dedicated CE#, OE#, and WE# control signals. Its embedded algorithm controller (EAC) manages program/erase operations including word programming, write buffer programming (up to 512 bytes), chip/sector erase, and blank check - all with status reporting via Status Register, Data Polling, or Ready/Busy pin.
The internal hardware ECC corrects single-bit errors per 512-byte sector and reports uncorrectable multi-bit errors. Sector protection uses persistent (PPB) and dynamic (DYB) bits, plus password-protected lock register and Secure Silicon Region (1024-byte OTP with two lockable zones).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 1 Gb (128 MB) organized as 8,388,608 × 16-bit words |
| Supply Voltage | Single 2.7–3.6 V VCC for read/program/erase; VIO supports 1.65 V to VCC |
| Access Time | 100 ns random access (tACC); 15 ns page access (tPACC) |
| Programming Buffer | 512-byte write buffer enabling up to 1.5 MBps effective programming rate |
| Erase Block Size | Uniform 128 KB sectors (1024 sectors total) |
| Data Retention | 20 years at +125°C; rated for 100 program/erase cycles |
| ECC | On-die hardware single-bit error correction per 512-byte sector |
Pinout & Package
Package: 64-ball LAE Fortified BGA (9 mm × 9 mm × 1.4 mm), RoHS-compliant, military-qualified.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address Inputs | 23-bit address bus supporting full 128 MB addressing (A0–A22) |
| DQ0–DQ15 | Data I/O | x16 bidirectional data bus; supports Versatile I/O voltage (1.65 V to VCC) |
| CE# | Chip Enable | Active-low enable controlling device selection; tCE = 100–130 ns |
| OE# | Output Enable | Active-low control for data output; tOE = 25–35 ns |
| WE# | Write Enable | Active-low signal initiating write/erase commands and data latching |
| RY/BY# | Ready/Busy Output | Open-drain status indicator: low = busy, high = ready/completed |
| VCC | Core Supply | 2.7–3.6 V power for logic and memory array; no separate VPP required |
| VIO | I/O Supply | Independent I/O voltage rail (1.65 V to VCC) enabling mixed-voltage system interfacing |
Key Features
| Feature | Design Value |
|---|---|
| 65-nm MIRRORBIT™ architecture | Enables higher density and lower power vs. older floating-gate NOR, with improved endurance and retention |
| Hardware ECC engine | Corrects single-bit errors on-the-fly during read; eliminates need for external error-handling logic |
| 512-byte write buffer | Reduces average programming time by batching up to 512 bytes per command, improving firmware update throughput |
| Advanced Sector Protection (ASP) | Combines volatile/non-volatile PPB, DYB, and password-locked OTP for layered, field-updatable security |
| 1024-byte OTP array | Two independently lockable 512-byte regions for secure boot keys, calibration data, or device identity storage |
Applications
| Avionics Flight Control Unit | Tactical Radio Firmware Storage |
|---|---|
Use Scenario: Storing certified flight software and configuration tables in DO-254-compliant airborne systems requiring guaranteed data integrity over 20-year service life. IC Role / Device Role / Timing Role: Non-volatile code storage with hardware ECC, sector-level write protection, and -55°C to +125°C operation. Use Value: Eliminates external error-correction logic and enables secure, field-upgradable firmware without compromising safety certification. | Use Scenario: Holding encrypted waveform images and cryptographic keys in manpack radios deployed in extreme desert and arctic environments. IC Role / Device Role / Timing Role: Military-grade parallel NOR flash with OTP-based key storage and dynamic sector locking during OTA updates. Use Value: Dual-lock OTP prevents unauthorized key extraction; ASP allows selective sector lockdown during mission-critical reprogramming. |
| Subsea Oilfield Sensor Node | Armored Vehicle Mission Computer |
Use Scenario: Logging sensor calibration coefficients and fault history in deep-sea pressure housings where replacement is prohibitively costly. IC Role / Device Role / Timing Role: High-reliability, long-retention flash with 128 KB uniform sectors and standby current <200 µA. Use Value: 20-year data retention at +125°C ensures calibration validity across full equipment lifecycle without maintenance intervention. | Use Scenario: Hosting boot firmware and real-time OS kernel in armored vehicle computing platforms subject to shock, vibration, and EMI. IC Role / Device Role / Timing Role: Parallel interface flash with suspend/resume for program/erase during interrupt-driven operation. Use Value: Erase/program suspend allows deterministic response to critical interrupts without corruption or timeout failure. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GS12DHV023 | Same die, but packaged in 64-ball LAA BGA (13 mm × 11 mm); higher thermal mass, different board layout footprint | Preferred for conduction-cooled chassis with larger PCB area; less suitable for space-constrained avionics modules | Select when thermal dissipation > mechanical size constraints; verify pad layout compatibility |
| MX29GL128FPTI-90G | 128 Mb density (1/8 capacity); 90 ns access; no integrated ECC; supports only 1.8 V I/O | Limited to non-military industrial use; lacks OTP, ASP, and ECC-requires external error handling | Only viable for cost-sensitive, non-safety-critical legacy designs with lower density and simpler protection needs |
Compared with S29GL01GS12DHE023, the LAA variant offers better thermal performance but larger footprint, while the Macronix part sacrifices density, ECC, military temp range, and security features-making it unsuitable for new high-integrity designs.
Availability
S29GL01GS12DHE023 is available at Aetrix Electronics and suitable for avionics flight control units, tactical radio firmware storage, and subsea sensor node logging requiring stable component supply under extended temperature and long-life reliability requirements.
Supply support for S29GL01GS12DHE023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions for industrial and defense applications.
The GL-S series targets mission-critical embedded systems needing military-qualified, high-density parallel NOR flash with integrated ECC, robust sector protection, and extended temperature operation.
FAQ
Does S29GL01GS12DHE023 support JEDEC-standard command sets?
Yes - it implements the Common Flash Interface (CFI) parameter table and complies with JEDEC JESD21-C Annex A for standard command definitions, including word programming, write buffer programming, sector erase, and status polling. All commands are executed via the x16 parallel interface using CE#, OE#, and WE# timing.
What is the purpose of the Secure Silicon Region (SSR) and how is it accessed?
The SSR is a 1024-byte one-time-programmable (OTP) array divided into two lockable 512-byte regions. It is accessed via the CFI-compatible Address Space Offset (ASO) mechanism using specific unlock sequences and password commands. Once locked, regions cannot be rewritten or read without proper authentication.
Can S29GL01GS12DHE023 operate with VIO = 1.8 V while VCC = 3.3 V?
Yes - its Versatile I/O feature explicitly supports VIO from 1.65 V to VCC. With VCC = 3.3 V, VIO may be set to 1.8 V to interface directly with 1.8 V logic families, eliminating level shifters. All timing parameters (e.g., tOE, tCE) remain valid across this I/O voltage range per datasheet Table 2.
How does the suspend/resume functionality behave during sector erase?
Sector erase can be suspended after initiation using the Erase Suspend command, halting the erase process and returning the device to read mode within 60 µs. Resume restores the suspended erase. This allows servicing high-priority interrupts without data corruption or timeout - critical in real-time avionics and vehicle control systems.
S29GL01GS12DHE023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- CFI
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 120 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -55°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL01GS12DHE023 FAQ
1.How can I place an order for S29GL01GS12DHE023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GS12DHE023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GS12DHE023 reliable?
The price and inventory of S29GL01GS12DHE023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS12DHE023 is usually 5 days.
3.What payment methods are accepted for S29GL01GS12DHE023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS12DHE023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GS12DHE023?
S29GL01GS12DHE023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GS12DHE023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GS12DHE023?
For technical support, including S29GL01GS12DHE023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS12DHE023 requirements.
6.How does Aetrix verify that S29GL01GS12DHE023 is sourced from the original manufacturer or authorized distributors?
All S29GL01GS12DHE023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS12DHE023 meets industry standards.
7.What is the process for return or replacement of S29GL01GS12DHE023?
All S29GL01GS12DHE023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS12DHE023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GS12DHE023 part is unused and in its original packaging.
Return procedure for S29GL01GS12DHE023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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