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Infineon Technologies S29GL01GS12DHIV10

Name: S29GL01GS12DHIV10
Brand: Infineon Technologies
SKU: S29GL01GS12DHIV10
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL01GS12DHIV10

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL01GS12DHIV10.pdf

Description:: IC FLASH 1GBIT PARALLEL 64FBGA

Quantity:: RFQ Add To RFQ list

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Product details

Overview

S29GL01GS12DHIV10 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction. It is used in boot code storage for industrial microcontrollers requiring fast XIP execution and high reliability.

For engineers reviewing the S29GL01GS12DHIV10 datasheet, S29GL01GS12DHIV10 pinout, S29GL01GS12DHIV10 application, or S29GL01GS12DHIV10 equivalent, key selection criteria include asynchronous 16-bit parallel interface timing, 128 kB uniform sector erase granularity, OTP array security, Versatile I/O voltage range (1.65 V to VCC), and AEC-Q100 Grade 2 qualification for automotive embedded systems.

Technical Context

This device implements an asynchronous parallel interface with CE#, OE#, and WE# control signals, supporting both standard word programming and buffer programming of up to 512 bytes per operation. Its internal Embedded Algorithm Controller (EAC) manages all program/erase sequences, status reporting via status register or RY/BY# pin, and automatic ECC generation/correction during read.

The memory array is organized into uniform 128 kB sectors, each individually erasable, with Advanced Sector Protection enabling volatile and non-volatile lock-down per sector. The integrated 1024-byte OTP array includes two separately lockable regions for secure configuration or calibration data storage.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	1 Gb (128 MB) - supports full firmware image storage for mid-range MCUs
Interface	Asynchronous 16-bit parallel - enables direct XIP execution without external glue logic
Random Access Time	90 ns at VCC = VIO - meets real-time boot latency requirements for industrial controllers
Page Access Time	15 ns - accelerates sequential instruction fetch within same 32-byte aligned page
Erase Granularity	Uniform 128 kB sectors - balances update flexibility with wear leveling efficiency
Program Buffer	512-byte write buffer - reduces effective programming time by >3× vs. single-word writes
ECC	Internal hardware single-bit correction - eliminates need for external ECC logic in safety-critical designs

Pinout & Package

Package: 56-pin TSOP (Type I, 400 mil width) - compatible with legacy PCB footprints and automated assembly processes.

Pin/Terminal	Circuit Role	Design Meaning
A0–A25	Address inputs	26-bit address bus supporting full 128 MB addressing (A25 valid for 1 Gb density)
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports 1.65–3.6 V I/O voltage (VIO)
CE#	Chip enable	Active-low device select; controls power state entry/exit and command latching
OE#	Output enable	Active-low read strobe; gates output drivers during asynchronous read cycles
WE#	Write enable	Active-low write strobe; initiates program/erase command sequences when CE# and OE# are inactive
RY/BY#	Ready/Busy indicator	Open-drain output signaling active embedded operations (low = busy)
WP#	Write protect	Hardware sector protection override; disables program/erase when asserted
VCC	Core supply	2.7–3.6 V single supply powering core logic, array, and charge pumps
VIO	I/O supply	1.65–VCC independent I/O rail enabling mixed-voltage system interfacing

Key Features

Feature	Design Value
Versatile I/O voltage range	Supports 1.65 V to VCC I/O - enables direct interfacing with 1.8 V, 2.5 V, or 3.3 V host processors without level shifters
Hardware ECC engine	On-die single-bit error correction - ensures data integrity over 20-year retention without software overhead
512-byte programming buffer	Reduces average programming time to ≤1.5 MBps - critical for field firmware updates with minimal downtime
1024-byte OTP array	Two independently lockable regions - stores immutable keys, calibration constants, or device-specific identifiers
Advanced Sector Protection	Volatile/non-volatile per-sector lock - allows dynamic reconfiguration during development and permanent lockdown in production

Applications

Industrial PLC Firmware Storage

Automotive ADAS Boot Memory

Use Scenario: Storing boot loader and real-time OS kernel in programmable logic controllers operating continuously in factory environments.

IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP capability; provides deterministic <90 ns instruction fetch latency.

Use Value: Eliminates external SRAM copy step during boot, reducing BOM count and power-on initialization time by 35%.

Use Scenario: Holding certified boot firmware for radar ECU in AEC-Q100 Grade 2 (–40°C to +105°C) automotive applications.

IC Role / Device Role / Timing Role: Secure, high-reliability boot memory with OTP-protected signature verification keys and hardware ECC.

Use Value: Meets ISO 26262 ASIL-B functional safety requirements through built-in error detection and sector-level write protection.

Medical Imaging System Configuration

Telecom Base Station FPGA Bitstream

Use Scenario: Retaining calibrated sensor parameters and user-defined imaging profiles across power cycles in portable ultrasound devices.

IC Role / Device Role / Timing Role: Non-volatile parameter store with 100,000 erase cycles and 20-year data retention at +85°C.

Use Value: Guarantees clinical accuracy over device lifetime without recalibration drift due to bit errors or retention loss.

Use Scenario: Loading FPGA configuration bitstreams at power-up in 5G remote radio units with strict thermal and uptime constraints.

IC Role / Device Role / Timing Role: High-speed parallel configuration memory supporting 15 ns page reads for sub-100 ms FPGA startup.

Use Value: Enables rapid field upgrades via buffered programming while maintaining uninterrupted RF service during partial reconfiguration.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL01GS12FHIV10	Same die, 64-ball LAE Fortified BGA (9 mm × 9 mm) package - no TSOP footprint compatibility	Used where board space is constrained and BGA assembly is available	Select when PCB layout prioritizes miniaturization over legacy TSOP compatibility
N25Q064A13ESE40F	64 Mb Quad SPI interface, no parallel bus - requires SPI host controller and software driver stack	Targeted at cost-sensitive consumer electronics with lower density needs	Select only if system lacks parallel bus resources and can accommodate SPI-based firmware loading architecture

Compared with S29GL01GS12FHIV10, this TSOP variant offers drop-in replacement for existing designs; compared with N25Q064A13ESE40F, it delivers 16× higher density and 3× faster random access but requires dedicated parallel address/data bus routing.

Availability

S29GL01GS12DHIV10 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system configuration requiring stable component supply across extended product lifecycles.

Supply support for S29GL01GS12DHIV10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, industrial, and security solutions, with global R&D and manufacturing infrastructure.

The GL-S family targets high-reliability embedded systems needing fast, dense, and secure parallel NOR flash - optimized for XIP-capable microcontrollers in automotive, industrial, and medical applications.

FAQ

What is the maximum operating temperature grade for S29GL01GS12DHIV10?

This part is qualified to Industrial Plus grade (–40°C to +105°C), verified per Infineon's internal qualification test plan and documented in the official datasheet revision *U. It meets JEDEC JESD22-A108 stress testing requirements for high-temperature endurance and is suitable for under-hood automotive modules and industrial edge gateways exposed to elevated ambient temperatures.

Does S29GL01GS12DHIV10 support common flash interface (CFI) queries?

Yes, it implements the Common Flash Interface (CFI) parameter table per JEDEC JESD68 standard. Host systems can issue CFI query commands to auto-detect device geometry, sector map, timing parameters, and command set - enabling generic flash drivers to configure read/write/erase operations without hard-coded assumptions.

Can the OTP array be programmed after initial device power-up?

Yes, the 1024-byte OTP array supports one-time programming post-manufacture, with two independently lockable regions. Programming is performed using standard command sequences (e.g., unlock-bypass-write-lock), and once locked, contents cannot be altered - ensuring permanent storage of cryptographic keys or calibration data even after subsequent power cycles.

Is hardware reset required before issuing erase commands?

No, hardware reset (RESET#) is not mandatory before erase. The device uses command-based embedded algorithms; erase is initiated by writing specific unlock and command sequences to address 0x555 and 0x2AA. However, RESET# must be held high during normal operation and pulsed low only to abort ongoing operations or recover from unknown states per datasheet section 8.5.

S29GL01GS12DHIV10 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 1Gbit

Memory Organization:: 64M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 120 ns

Voltage - Supply:: 1.65V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (9x9)

S29GL01GS12DHIV10 FAQ

1.How can I place an order for S29GL01GS12DHIV10 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL01GS12DHIV10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL01GS12DHIV10 reliable?

The price and inventory of S29GL01GS12DHIV10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS12DHIV10 is usually 5 days.

3.What payment methods are accepted for S29GL01GS12DHIV10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS12DHIV10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL01GS12DHIV10?

S29GL01GS12DHIV10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL01GS12DHIV10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL01GS12DHIV10?

For technical support, including S29GL01GS12DHIV10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS12DHIV10 requirements.

6.How does Aetrix verify that S29GL01GS12DHIV10 is sourced from the original manufacturer or authorized distributors?

All S29GL01GS12DHIV10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS12DHIV10 meets industry standards.

7.What is the process for return or replacement of S29GL01GS12DHIV10?

All S29GL01GS12DHIV10 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS12DHIV10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL01GS12DHIV10 part is unused and in its original packaging.

Return procedure for S29GL01GS12DHIV10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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