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Infineon Technologies S29GL01GS12DHVV10
- Part No.:
- S29GL01GS12DHVV10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GS12DHVV10.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:256
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Product details
Overview
S29GL01GS12DHVV10 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 3.0 V core supply, 16-bit data bus, and 65 nm MIRRORBIT™ Eclipse process technology. It delivers 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction - deployed in automotive instrument clusters requiring deterministic boot code storage and fast XIP execution.
For engineers reviewing the S29GL01GS12DHVV10 datasheet, S29GL01GS12DHVV10 pinout, S29GL01GS12DHVV10 application, or S29GL01GS12DHVV10 equivalent, this device supports asynchronous read, sector erase with suspend/resume, OTP lockable regions, CFI compliance, and AEC-Q100 Grade 2 (–40°C to +105°C) operation - critical for safety-critical firmware storage in ADAS ECUs.
Technical Context
This device implements an embedded algorithm controller (EAC) that manages autonomous program/erase operations without host CPU intervention. Its 512-byte write buffer enables burst programming at up to 1.5 MBps, while uniform 128-kbyte sectors support granular firmware partitioning and field updates.
The Versatile I/O feature allows independent VIO (1.65 V to VCC) for interfacing with mixed-voltage SoCs, and hardware reset with power-off protection ensures data integrity during brownout events. Status monitoring uses RY/BY# pin, status register reads, and data polling - all fully compliant with Common Flash Interface (CFI) v1.4.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 1 Gb (128 MB), organized as 8,388,608 × 16-bit words - sufficient for full AUTOSAR OS + application binaries in Tier-1 ECU designs. |
| Random access time | 90 ns at VCC = VIO - enables sub-11 MHz synchronous bus timing for legacy microcontroller interfaces without wait states. |
| Page access time | 15 ns - accelerates sequential instruction fetch in XIP mode across 32-byte aligned pages. |
| Write buffer size | 512 bytes - reduces effective programming time by 3.2× vs. single-word writes, critical for OTA firmware patching. |
| ECC capability | Internal hardware single-bit error correction - eliminates need for external ECC logic in safety-critical boot ROM paths. |
| Endurance & retention | 100,000 program/erase cycles and 20-year data retention - meets ASIL-B functional safety requirements for nonvolatile configuration storage. |
| Operating temperature | AEC-Q100 Grade 2 (–40°C to +105°C) - qualified for under-hood automotive applications including engine control modules. |
Pinout & Package
Package: 56-ball VBU Fortified BGA (9 mm × 7 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A25 | Address inputs | 26-bit address bus supporting full 128 MB address space; A25 is MSB for 1 Gb density. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte/word writes and CFI parameter reads. |
| CE# | Chip enable | Active-low chip select; controls device power state and enables multi-chip addressing in stacked configurations. |
| OE# | Output enable | Active-low read strobe; gates output drivers during asynchronous read cycles. |
| WE# | Write enable | Active-low write strobe; initiates command latching and embedded program/erase sequences. |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active internal operation (low) or completion (high); used for polling-based status checks. |
| RESET# | Hardware reset | Active-low asynchronous reset that halts ongoing operations and returns device to read mode. |
| VCC | Core supply | 3.0 V ±10% supply (2.7–3.6 V) powering core logic, charge pumps, and ECC engine. |
| VIO | I/O supply | Independent 1.65–3.6 V I/O voltage - enables direct interface with 1.8 V or 3.3 V host processors. |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous page-mode read | 32-byte aligned page access with 15 ns intra-page latency - improves instruction fetch throughput in XIP boot loaders. |
| Embedded sector erase suspend/resume | Allows interruption of 128-kbyte erase to service high-priority reads - essential for real-time firmware update in running ECUs. |
| Advanced sector protection (ASP) | Volatile and non-volatile locking per sector - enables secure bootloader partitioning and prevents accidental overwrite of safety-critical code. |
| 1024-byte OTP array | Two independently lockable 512-byte regions storing calibration data or cryptographic keys - immune to field reprogramming after lock. |
| Common Flash Interface (CFI) | Standardized CFI v1.4 parameter table accessible via command sequence - enables automatic driver detection and cross-platform firmware portability. |
Applications
| Automotive Instrument Cluster | ADAS Domain Controller Boot ROM |
|---|---|
|
Use Scenario: Storing calibrated gauge graphics, vehicle configuration profiles, and firmware for LCD driver MCU. IC Role / Device Role / Timing Role: Primary nonvolatile code storage with XIP-capable read performance and AEC-Q100 Grade 2 thermal qualification. Use Value: 90 ns random access ensures <10 µs response to CAN-triggered display updates; OTP region secures odometer calibration constants. |
Use Scenario: Hosting boot firmware for radar fusion processor, including secure boot loader and public key certificates. IC Role / Device Role / Timing Role: Safety-certified boot ROM with hardware ECC and sector-level write protection to meet ISO 26262 ASIL-B requirements. Use Value: Internal ECC eliminates soft-error-induced boot failures; ASP locks bootloader sector against runtime corruption during OTA updates. |
| Industrial PLC Firmware Storage | Medical Imaging System Configuration Memory |
|
Use Scenario: Retaining ladder logic programs, I/O mapping tables, and calibration coefficients across power cycles in factory automation controllers. IC Role / Device Role / Timing Role: High-reliability parallel NOR flash with 100,000 erase cycles and 20-year data retention at 85°C ambient. Use Value: Sector erase suspend allows real-time diagnostics to interrupt firmware updates without data loss; CFI simplifies driver integration across PLC platforms. |
Use Scenario: Storing DICOM conformance statements, modality-specific calibration curves, and regulatory audit logs in MRI/X-ray control units. IC Role / Device Role / Timing Role: Secure, long-life nonvolatile memory with OTP-locked regulatory metadata and tamper-resistant sector protection. Use Value: Two-lock OTP regions preserve FDA-required calibration signatures; industrial temperature grade ensures stability in air-cooled medical enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GS12FHIV10 | Same die, 64-ball LAE FBGA (9 mm × 9 mm) package - larger footprint, higher I/O pin count, improved thermal dissipation. | Preferred for new designs with PCB space for larger BGA and need for enhanced thermal margin in high-power ECUs. | Select when board layout accommodates 9×9 mm BGA and thermal derating above 95°C is required. |
| MX29GL128FHT2I-90G | Micron 128 Mb (16 MB) parallel NOR; 90 ns access, but lacks hardware ECC, OTP array, and AEC-Q100 qualification. | Acceptable for cost-sensitive industrial HMI where ECC and automotive qualification are not mandated. | Choose only for non-automotive, non-safety applications with lower density needs and no ECC requirement. |
Compared with S29GL01GS12DHVV10, the S29GL01GS12FHIV10 offers identical functionality in a thermally superior package, while MX29GL128FHT2I-90G provides lower density and no safety features - making the original part uniquely suited for AEC-Q100 Grade 2 automotive boot storage.
Availability
S29GL01GS12DHVV10 is available at Aetrix Electronics and suitable for automotive instrument clusters, ADAS domain controllers, industrial PLCs, and medical imaging systems requiring stable component supply, long-term lifecycle support, and AEC-Q100 compliance.
Supply support for S29GL01GS12DHVV10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and trusted security solutions - with annual revenue exceeding €14 billion and global manufacturing in Dresden, Villach, and Kulim.
This device belongs to the GL-S MIRRORBIT™ Eclipse flash product line, engineered specifically for automotive and industrial applications demanding high reliability, fast XIP performance, and functional safety compliance.
FAQ
Does S29GL01GS12DHVV10 support both 1.8 V and 3.3 V I/O interfaces?
Yes. Its Versatile I/O feature supports VIO from 1.65 V to VCC (2.7–3.6 V), enabling direct connection to 1.8 V logic families without level shifters and compatibility with 3.3 V microcontrollers - verified in Infineon's AC electrical specifications table (Section 11.4).
What is the purpose of the two lockable OTP regions?
The 1024-byte OTP array contains two independent 512-byte regions, each with dedicated lock bits. Once locked, their contents cannot be altered - used to store immutable calibration data, cryptographic keys, or regulatory identifiers required for ISO 26262 or IEC 62304 certification.
How does hardware ECC impact system-level error handling?
Internal ECC automatically detects and corrects single-bit errors on every read, eliminating software overhead for error correction. Uncorrectable multi-bit errors trigger status register flags - allowing host firmware to initiate recovery (e.g., fallback to redundant sector) without external ECC logic.
Can sector erase be safely interrupted during operation?
Yes. The suspend/resume command set allows active sector erase to be paused for urgent read operations, then resumed from the exact point of interruption - confirmed in Section 5.2 of the datasheet and validated for use in real-time automotive firmware update scenarios.
S29GL01GS12DHVV10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 120 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL01GS12DHVV10 FAQ
1.How can I place an order for S29GL01GS12DHVV10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GS12DHVV10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GS12DHVV10 reliable?
The price and inventory of S29GL01GS12DHVV10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS12DHVV10 is usually 5 days.
3.What payment methods are accepted for S29GL01GS12DHVV10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS12DHVV10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GS12DHVV10?
S29GL01GS12DHVV10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GS12DHVV10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GS12DHVV10?
For technical support, including S29GL01GS12DHVV10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS12DHVV10 requirements.
6.How does Aetrix verify that S29GL01GS12DHVV10 is sourced from the original manufacturer or authorized distributors?
All S29GL01GS12DHVV10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS12DHVV10 meets industry standards.
7.What is the process for return or replacement of S29GL01GS12DHVV10?
All S29GL01GS12DHVV10 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS12DHVV10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GS12DHVV10 part is unused and in its original packaging.
Return procedure for S29GL01GS12DHVV10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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