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Infineon Technologies S29GL01GS12DHVV13
- Part No.:
- S29GL01GS12DHVV13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL01GS12DHVV13.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,508
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Product details
Overview
S29GL01GS12DHVV13 from Infineon is a 1 Gb (128 MB) parallel NOR flash memory IC with 3.0 V core supply, ×16 data bus, and MIRRORBIT™ Eclipse 65 nm technology. It delivers 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. Designed for embedded boot code storage in industrial control systems requiring high reliability and fast XIP execution.
For engineers reviewing the S29GL01GS12DHVV13 datasheet, S29GL01GS12DHVV13 pinout, S29GL01GS12DHVV13 application, or S29GL01GS12DHVV13 equivalent, key selection criteria include 128-kbyte uniform sector erase granularity, 100,000 program/erase cycles, Versatile I/O support (1.65 V–VCC), OTP array with dual lockable regions, and AEC-Q100 Grade 2 qualification (–40°C to +105°C).
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A25), supporting both standard read and 32-byte page-mode reads. Its embedded algorithm controller (EAC) manages all program/erase operations-including suspend/resume-and enforces command-set locking via CFI-compliant protocols.
The internal architecture integrates dedicated voltage generators for programming (VPP) and erase (VEH), a status register with polling-ready capability, and hardware-based ECC that corrects single-bit errors on-the-fly during read. Sector protection uses volatile/non-volatile ASP with per-sector lock bits and separate 1024-byte OTP array with two independently lockable regions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 1 Gb (128 MB) organized as 8,388,608 × 16-bit words - supports full firmware image storage for mid-tier microcontrollers. |
| Access Time | 90 ns random access (VCC = VIO); enables real-time XIP execution without wait states in Cortex-M7/M33 systems. |
| Page Read | 32-byte aligned asynchronous page mode with 15 ns cycle - reduces average read latency for sequential instruction fetch. |
| Programming Buffer | 512-byte write buffer - allows single-command programming of up to 256 words, cutting effective write time by ~4× vs. byte-by-byte. |
| Erase Granularity | Uniform 128-kbyte sectors - simplifies firmware update partitioning and wear leveling in bootloader-resident applications. |
| Data Retention | 20 years at 85°C - meets long-life requirements for industrial gateways and automotive ECUs with infrequent field updates. |
| Endurance | 100,000 program/erase cycles per sector - supports over-the-air (OTA) update frequency up to once daily for 27 years. |
| I/O Voltage Range | VIO = 1.65 V to VCC - enables direct interfacing with 1.8 V, 2.5 V, or 3.3 V logic without level shifters. |
Pinout & Package
Package: 56-pin TSOP (Type I, 400 mil width), JEDEC MO-141AC compliant. Pin pitch: 0.5 mm. Body dimensions: 18.4 mm × 10.16 mm × 1.2 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A25 | Address inputs | Word-aligned address bus; A25 is MSB for 1 Gb density (226 × 16 = 1 Gb). |
| DQ0–DQ15 | Data I/O | Bi-directional ×16 data bus; supports high-speed burst reads and buffered writes without external latches. |
| CE# | Chip enable | Active-low device select; controls power-down entry when deasserted during standby. |
| OE# | Output enable | Active-low read strobe; gates output drivers to prevent bus contention during multi-device configurations. |
| WE# | Write enable | Active-low write strobe; initiates command sequences and data latching for program/erase operations. |
| RY/BY# | Ready/busy indicator | Open-drain output signaling active embedded operation; used for hardware polling instead of software status register reads. |
| RESET# | Hardware reset | Active-low asynchronous reset; forces device into reading state and clears internal state machines after power-up or fault recovery. |
| WP# | Write protect | Active-low hardware sector lock override; disables program/erase commands to protected sectors regardless of software settings. |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC engine | On-die single-bit error correction with automatic detection-eliminates need for external ECC logic in safety-critical boot memory paths. |
| Versatile I/O (VIO) | Independent VIO supply (1.65 V–VCC) decouples I/O voltage from core-enables mixed-voltage system integration without level translators. |
| OTP array | 1024-byte one-time-programmable region split into two lockable blocks-ideal for storing cryptographic keys or calibration data with irreversible write protection. |
| Suspend/resume | Interruptible program and erase operations-allows high-priority read access during background flash updates, critical for real-time OS environments. |
| CFI compliance | Standardized Common Flash Interface parameter table-enables auto-detection and configuration by generic flash drivers in Linux/U-Boot/RTOS bootloaders. |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot firmware and configuration tables in programmable logic controllers deployed in factory automation lines. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with ≤90 ns latency to ARM Cortex-R5F cores. Use Value: 20-year data retention and 100K-cycle endurance ensure unattended operation across 15+ year equipment lifecycles without field reprogramming. | Use Scenario: Holding boot code and sensor calibration data for front-camera modules in Level 2+ ADAS systems. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified boot flash with hardware ECC, enabling safe startup under extended temperature range (–40°C to +105°C). Use Value: Integrated OTP array secures camera calibration parameters against tampering; suspend/resume allows concurrent diagnostics during firmware update. |
| Medical Imaging System BIOS | Telecom Base Station Configuration |
Use Scenario: Hosting BIOS and FPGA configuration bitstreams in portable ultrasound and MRI subsystems requiring FDA-grade reliability. IC Role / Device Role / Timing Role: Secure, radiation-tolerant boot memory with lockable OTP regions for storing device-specific calibration coefficients. Use Value: Hardware ECC and sector-level ASP prevent corruption from ESD events during clinical use; 128-kbyte erase blocks align with medical firmware update packages. | Use Scenario: Storing baseband processor configuration, RF tuning tables, and fail-safe recovery images in 5G small cell radios. IC Role / Device Role / Timing Role: High-density parallel flash interfaced to TI C66xx DSPs via EMIF, delivering low-latency read for real-time signal processing initialization. Use Value: 512-byte programming buffer accelerates field-upgrade deployment; Versatile I/O supports direct connection to 1.8 V DSP I/O banks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL01GP12DHVV13 | Same density and package, but uses legacy 90 nm process; 110 ns random access; no hardware ECC. | Lacks on-die ECC and OTP array; requires external error handling and key management. | Select only if cost sensitivity outweighs functional safety requirements and legacy design reuse is mandatory. |
| MX29GL128FPTI-90G | 128 Mb (16 MB) density, 90 ns access, no OTP or hardware ECC; supports 1.8 V I/O only. | Lower density limits use to smaller boot images; incompatible with 1 Gb firmware partitioning schemes. | Consider only for space-constrained designs where full 1 Gb capacity is unnecessary and ECC is handled externally. |
Compared with S29GL01GP12DHVV13 and MX29GL128FPTI-90G, the S29GL01GS12DHVV13 provides higher density, faster access, built-in ECC, and OTP security-making it the only choice for new AEC-Q100 Grade 2 or industrial-plus designs requiring long-term data integrity and secure boot.
Availability
S29GL01GS12DHVV13 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system BIOS requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S29GL01GS12DHVV13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions, with global R&D centers and ISO/TS 16949-certified manufacturing.
The GL-S family targets mission-critical embedded systems needing robust, high-density parallel NOR flash with automotive-grade qualification, hardware ECC, and secure OTP-addressing boot integrity and firmware update resilience in safety-aware platforms.
FAQ
Is S29GL01GS12DHVV13 pin-compatible with earlier S29GL01GP devices?
No. While both share the 56-pin TSOP package, S29GL01GS12DHVV13 has updated timing parameters, enhanced command set (including suspend/resume), and added hardware ECC functionality not present in S29GL01GP. Board-level redesign is required for migration due to differences in status reporting and OTP access protocols.
Does this device support 1.8 V I/O operation?
Yes. The Versatile I/O feature allows VIO to operate from 1.65 V to VCC (3.6 V). When VCC = 3.0 V, VIO can be set to 1.8 V, enabling direct interface with 1.8 V logic families without external level shifters-confirmed in Section 8.3 of the datasheet.
What is the purpose of the separate OTP array?
The 1024-byte OTP array is physically isolated and supports two independently lockable regions. It is intended for storing immutable data such as cryptographic keys, calibration constants, or device serial numbers-once locked, contents cannot be erased or rewritten, providing hardware-enforced security against firmware tampering.
How does hardware ECC impact system-level error handling?
Hardware ECC automatically detects and corrects single-bit errors during every read operation, eliminating the need for software-based error correction routines. Uncorrectable multi-bit errors trigger status register flags (ECC_FAIL), allowing the host to initiate recovery-reducing CPU overhead and improving boot-time reliability in safety-critical applications.
S29GL01GS12DHVV13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 120 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL01GS12DHVV13 FAQ
1.How can I place an order for S29GL01GS12DHVV13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL01GS12DHVV13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL01GS12DHVV13 reliable?
The price and inventory of S29GL01GS12DHVV13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL01GS12DHVV13 is usually 5 days.
3.What payment methods are accepted for S29GL01GS12DHVV13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL01GS12DHVV13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL01GS12DHVV13?
S29GL01GS12DHVV13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL01GS12DHVV13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL01GS12DHVV13?
For technical support, including S29GL01GS12DHVV13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL01GS12DHVV13 requirements.
6.How does Aetrix verify that S29GL01GS12DHVV13 is sourced from the original manufacturer or authorized distributors?
All S29GL01GS12DHVV13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL01GS12DHVV13 meets industry standards.
7.What is the process for return or replacement of S29GL01GS12DHVV13?
All S29GL01GS12DHVV13 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL01GS12DHVV13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL01GS12DHVV13 part is unused and in its original packaging.
Return procedure for S29GL01GS12DHVV13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL01GS12DHVV13 Tags
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